View CY8C3244LTI-130_1079042.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

psoc ? 3: cy8c32 family data sheet programmable system-on-chip (psoc ? ) cypress semiconductor corporation ? 198 champion court ? san jose , ca 95134-1709 ? 408-943-2600 document number: 001-56955 rev. *k revised may 20, 2011 general description with its unique array of configurable blocks, psoc ? 3 is a true ystem level solution provid ing microcontroller unit (mcu), memory, analog, and digital peripheral functions in a single chip. the cy8c 32 family offers a modern method of signal acquisition, sign al processing, and control with high accuracy, high bandwidth, and high flexibility. analog capability spans the range from thermo couples (near dc voltages) to ultrasonic signals. the cy8c32 family ca n handle dozens of data acquisition channels and analog inputs on every general-purpose input/output (gpio) pi n. the cy8c32 family is also a high-per formance configurable digital system with so me part numbers including interfaces such as usb, and multimaster inter-integrated circuit (i 2 c). in addition to communication interfaces, the cy8c32 family has an easy to configure logic array, flexible routing to al l i/o pins, and a high-performance single cycle 8 051 microprocessor core. you can easily create system-level designs usin g a rich library of prebuilt components and boolean primiti ves using psoc creator?, a hierarchical schemat ic design entry tool. the cy8c32 family pr ovides unparalleled opportunities for anal og and digital bill of materials integration while easily accommodat ing last minute design changes through simple firmware updates . features ? single cycle 8051 cpu core ? dc to 50 mhz operation ? multiply and divide instructions ? flash program memory, up to 64 kb, 100,000 write cycles, 20 years retention, and mu ltiple security features ? up to 8-kb flash error correcting code (ecc) or configuration storage ? up to 8 kb sram ? up to 2 kb electrically erasable programmable read-only memory (eeprom), 1 m cycles, and 20 years retention ? 24-channel direct memory access (dma) with multilayer ahb [1] bus access ? programmable chained descriptors and priorities ? high bandwidth 32-bit transfer support ? low voltage, ultra low-power ? wide operating voltage range: 0.5 v to 5.5 v ? high efficiency boost regulator from 0.5-v through 1.8-v to 5.0-v output ? 0.8 ma at 3 mhz, 1.2 ma at 6 mhz, and 6.6 ma at 50 mhz ? low-power modes including: ? 1-a sleep mode with real-time clock (rtc) and low-voltage detect (lvd) interrupt ? 200-na hibernate mode with ram retention ? versatile i/o system ? 28 to 72 i/o (62 gpios, eight special input/outputs (sio), two usbios [2] ) ? any gpio to any digital or analog peripheral routability ? lcd direct drive from any gpio, up to 4616 segments [2] ? capsense ? support from any gpio [3] ? 1.2-v to 5.5-v i/o interface voltages, up to four domains ? maskable, independent irq on any pin or port ? schmitt-trigger transistor-transistor logic (ttl) inputs ? all gpio configurable as open drain high/low, pull-up/pull-down, high z, or strong output ? configurable gpio pin state at power-on reset (por) ? 25 ma sink on sio ? digital peripherals ? 16 to 24 programmable pld based universal digital blocks (udb) ? full-speed (fs) usb 2.0 12 mbps using internal oscillator [2] ? up to four 16-bit configurable timer, counter, and pwm blocks ? library of standard peripherals ? 8-, 16-, 24-, and 32-bit timers, counters, and pwms ? serial peripheral interface (spi), universal asynchronous transmitter receiver (uart), and i 2 c ? many others available in catalog ? library of advanced peripherals ? cyclic redundancy check (crc) ? pseudo random sequence (prs) generator ? local interconnect network (lin) bus 2.0 ? quadrature decoder ? analog peripherals (1.71 v v dda 5.5 v) ? 1.024 v 0.9-percent internal voltage reference across ?40c to +85c (14 ppm/c) ? configurable delta-sigma adc with 8- to12-bit resolution ? programmable gain stage: 0.25 to 16 ? 12-bit mode, 192-ksps, 66-db signal to noise and distortion ratio (sinad), 1-bit inl/dnl ? one 8-bit, 8-msps idac or 1-msps vdac ? two comparators with 95 ns response time ? capsense support ? programming, debug, and trace ? jtag (4-wire), serial wire debu g (swd) (2-wire), and single wire viewer (swv) interfaces ? eight address and one data breakpoint ? 4-kb instruction trace buffer ? bootloader programming supportable through i 2 c, spi, uart, usb, and other interfaces ? precision, programmable clocking ? 3- to 24-mhz internal oscillat or over full temperature and voltage range ? 4- to 25-mhz crystal oscillator for crystal ppm accuracy ? internal pll clock generation up to 50 mhz ? 32.768-khz watch crystal oscillator ? low-power internal oscillator at 1, 33, and 100 khz ? temperature and packaging ? ?40c to +85c degrees industrial temperature ? 48-pin ssop, 48-pin qfn, 68-pin qfn, and 100-pin tqfp package options notes 1. ahb ? amba (advanced microcontroller bus architectu re) high-performance bus, an arm data transfer bus 2. this feature on select devices only. see ordering information on page 108 for details. 3. gpios with opamp outputs are not recommended for use with capsense.
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 2 of 120 contents 1. architectural overview ..................................................... 3 2. pinouts ............................................................................... 5 3. pin descriptions .............................................................. 10 4. cpu ................................................................................... 11 4.1 8051 cpu ................................................................. 11 4.2 addressing modes .................................................... 11 4.3 instruction set .......................................................... 12 4.4 dma and phub ....................................................... 16 4.5 interrupt controller ................................................... 18 5. memory ............................................................................. 22 5.1 static ram ............................................................... 22 5.2 flash program memory ............................................ 22 5.3 flash security ........................................................... 22 5.4 eeprom ...... ............... .............. .............. ........... ...... 22 5.5 nonvolatile latches (nvls) ...................................... 23 5.6 external memory interface ....................................... 24 5.7 memory map ............................................................ 24 6. system integration .......................................................... 26 6.1 clocking system ....................................................... 26 6.2 power system .......................................................... 29 6.3 reset ........................................................................ 33 6.4 i/o system and routing ........................................... 34 7. digital subsystem ........................................................... 40 7.1 example peripherals ................................................ 41 7.2 universal digital block .............................................. 44 7.3 udb array description ........ ..................................... 47 7.4 dsi routing interface descrip tion ............................ 47 7.5 usb .......................................................................... 49 7.6 timers, counters, and pwms .................................. 49 7.7 i 2 c ............................................................................ 49 8. analog subsystem .......................................................... 51 8.1 analog routing ......................................................... 52 8.2 delta-sigma adc ...................................................... 54 8.3 comparators ............................................................. 55 8.4 lcd direct drive ...................................................... 57 8.5 capsense ................................................................. 57 8.6 temp sensor ............................................................ 57 8.7 dac .......................................................................... 58 9. programming, debug interfa ces, resources ........... ..... 59 9.1 jtag interface ......................................................... 59 9.2 serial wire debug interface ..................................... 61 9.3 debug features ........................................................ 62 9.4 trace features ......................................................... 62 9.5 single wire viewer interfac e .................................... 62 9.6 programming features ............................................. 62 9.7 device security ............... ......................................... 62 10. development support ................................................... 63 10.1 documentation ................ ....................................... 63 10.2 online ..................................................................... 63 10.3 tools ....................................................................... 63 11. electrical specifications ............................................... 64 11.1 absolute maximum rating s .................................... 64 11.2 device level specificatio ns .................................... 65 11.3 power regulators ................................................... 69 11.1 inputs and outputs ................................................. 73 11.2 analog peripherals ........ ......................................... 81 11.3 digital peripherals .................................................. 93 11.4 memory .................................................................. 96 11.5 psoc system resources ..................................... 102 11.6 clocking ......................... ....................................... 104 12. ordering information ................................................... 108 12.1 part numbering conventions ............................... 109 13. packaging .... .............. .............. ............... .............. ........ 110 14. acronyms ..................................................................... 113 15. reference documents .......... ....................................... 114 16. document conventions .............................................. 115 16.1 units of measure .................................................. 115 17. revision history .......................................................... 116 18. sales, solutions, and legal information .................120
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 3 of 120 1. architectural overview introducing the cy8c32 family of ultra low-po wer, flash programmable system-on-chip (psoc ? ) devices, part of a scalable 8-bit psoc 3 and 32-bit psoc 5 platform. the cy8c32 family provides configurable blocks of analog, digital, and interconnect circuitry around a cpu subsystem. the comb ination of a cpu with a flexible analog subsystem, digital sub system, routing, and i/o enables a high level of integration in a wide variety of consumer, industrial, and medical applications. figure 1-1. simplified block diagram figure 1-1 illustrates the major components of the cy8c32 family. they are: ? 8051 cpu subsystem ? nonvolatile subsystem ? programming, debug, and test subsystem ? inputs and outputs ? clocking ? power ? digital subsystem ? analog subsystem psoc?s digital subsystem pr ovides half of its unique configurability. it connects a digital signal from any peripheral to any pin through the digital system interconnect (dsi). it also provides functional flexibility through an array of small, fast, low-power udbs. psoc creator provides a library of prebuilt and tested standard digital peripher als (uart, spi, lin, prs, crc, timer, counter, pwm, and, or, and so on) that are mapped to the udb array. you can also easily create a digital circuit using boolean primitives by means of graphical design entry. each udb contains programmable array logic (pal)/programmable logic device (pld) functionality, together with a small state machine engine to support a wide variety of peripherals. analog system lcd direct drive capsense temperature sensor adc dac del sig adc 2 x cmp + - i2c master/ slave universal digital block array ( 24 x udb) 4 x timer counter pwm fs usb 2.0 system wide resources digital system program debug & trace boundary scan program & debug 8051 or cortex m3 cpu interrupt controller phub dma sram flash eeprom emif cpu system memory system system bus digital interconnect analog interconnect 1.71 to 5.5v 0. 5 to 5.5v ( optional ) 4- 33 mhz ( optional ) xtal osc 32. 768 khz ( optional ) rtc timer imo clock tree wdt and wake ilo clocking system 1.8v ldo smp por and lvd sleep power power management system usb phy gpios gpios gpios gpios gpios gpios sio gpios sios udb udb udb udb udb udb udb udb udb udb udb udb udb udb udb uart logic 12- bit pwm i2c slave 8- bit spi 12- bit spi logic 8- bit timer 16- bit prs udb 8- bit timer quadrature decoder 16- bit pwm sequencer usage example for udb udb udb udb udb udb udb udb udb 22
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 4 of 120 in addition to the flexibility of the udb array, psoc also provides configurable digital blocks targeted at specific functions. for the cy8c32 family these blocks can include four 16-bit timers, counters, and pwm blocks; i 2 c slave, master, and multimaster; and fs usb. for more details on the peripherals see the ?example peripherals? section on page 41 of this datasheet. for information on udbs, dsi, and other digital blocks, see the ?digital subsystem? section on page 40 of this datasheet. psoc?s analog subsystem is the second half of its unique configurability. all analog performance is based on a highly accurate absolute voltage reference with less than 0.9-percent error over temperature and voltage. the configurable analog subsystem includes: ? analog muxes ? comparators ? voltage references ? adc ? dac all gpio pins can route analog signals into and out of the device using the internal analog bus. this allows the device to interface up to 62 discrete analog signals. the heart of the analog subsystem is a fast, accurate, configurable delta-sigma adc with these features: ? less than 100 v offset ? a gain error of 0.2 percent ? inl less than 1 lsb ? dnl less than 1 lsb ? sinad better than 66 db this converter addresses a wide variety of precision analog applications, including some of the most demanding sensors. a high-speed voltage or current dac supports 8-bit output signals at an update rate of 8 ms ps in current dac (idac) and 1 msps in voltage dac (vdac). it can be routed out of any gpio pin. you can create higher resolution voltage pwm dac outputs using the udb array. this can be used to create a pulse width modulated (pwm) dac of up to 10 bits, at up to 48 khz. the digital dacs in each udb support pwm, prs, or delta-sigma algorithms with programmable widths. in addition to the adc and dac, the analog subsystem provides multiple comparators. see the ?analog subsystem? section on page 51 of this datasheet for more details. psoc?s 8051 cpu subsystem is built around a single cycle pipelined 8051 8-bit processor running at up to 50 mhz. the cpu subsystem includes a programmable nested vector interrupt controller, dma controller, and ram. psoc?s nested vector interrupt controller provides low latency by allowing the cpu to vector directly to the first address of the interrupt service routine, bypassing the jump instruction required by other architectures. the dma controller enables peripherals to exchange data without cpu involvement. this allows the cpu to run slower (saving power) or use those cpu cycles to improve the performance of firmware al gorithms. the si ngle cycle 8051 cpu runs ten times faster than a standard 8051 processor. the processor speed itself is configurable, allowing you to tune active power consumption for specific applications. psoc?s nonvolatile subsystem consis ts of flash, byte-writeable eeprom, and nonvolatile configuration options. it provides up to 64 kb of on-chip flash. the cpu can reprogram individual blocks of flash, enabling bootl oaders. you can enable an ecc for high reliability applications. a po werful and flexible protection model secures the user's sensitive information, allowing selective memory block locking fo r read and write protection. up to 2 kb of byte-writeable eeprom is available on-chip to store application data. additionally, selected configuration options such as boot speed and pin drive mode are stored in nonvolatile memory. this allows settings to activate immediately after por. the three types of psoc i/o are ex tremely flexible. all i/os have many drive modes that are set at por. psoc also provides up to four i/o voltage domains through the v ddio pins. every gpio has analog i/o, lcd drive [4] , capsense [5] , flexible interrupt generation, slew rate control, and digital i/o capability. the sios on psoc allow voh to be set independently of v ddio when used as outputs. when sios are in input mode they are high impedance. this is true even w hen the device is not powered or when the pin voltage goes above the supply voltage. this makes the sio ideally suited for use on an i 2 c bus where the psoc may not be powered when other devices on the bus are. the sio pins also have high current sink capability for applications such as led drives. the programmable input threshold feature of the sio can be used to make the sio function as a general purpose analog comparator. for devices with fs usb the usb physical interface is also provided (usbio). when not using usb these pins may also be used for limited digital functionality and device programming. all of the features of the psoc i/os are covered in detail in the ?i/o system and routing? section on page 34 of this datasheet. the psoc device incorporates flexible internal clock generators, designed for high stability and factory trimmed for high accuracy. the internal main oscillator (imo) is the master clock base for the system, and has 1-percent a ccuracy at 3 mhz. the imo can be configured to run from 3 mhz up to 24 mhz. multiple clock derivatives can be generated from the main clock frequency to meet application needs. the device provides a pll to generate system clock frequencies up to 50 mhz from the imo, external crystal, or external reference cloc k. it also contains a separate, very low-power internal low-speed oscillator (ilo) for the sleep and watchdog timers. a 32.768-khz external watch crystal is also supported for use in rtc a pplications. the clocks, together with programmable clock dividers, provide the flexibility to integrate most timing requirements. the cy8c32 family supports a wide supply operating range from 1.71 v to 5.5 v. this allows o peration from regulated supplies such as 1.8 5 percent, 2.5 v 10 percent, 3.3 v 10 percent, or 5.0 v 10 percent, or directly from a wide range of battery types. in addition, it provides an integrated high efficiency synchronous boost converter that can power the device from supply voltages as low as 0.5 v. notes 4. this feature on select devices only. see ordering information on page 108 for details. 5. gpios with opamp outputs are not recommended for use with capsense.
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 5 of 120 this enables the device to be powered directly from a single battery or solar cell. in addition, you can use the boost converter to generate other voltages required by the device, such as a 3.3-v supply for lcd glass drive. the boost?s output is available on the v boost pin, allowing other devices in the application to be powered from the psoc. psoc supports a wide range of low-power modes. these include a 200-na hibernate mode with ram retention and a 1-a sleep mode with rtc. in the second mode the optional 32.768-khz watch crystal runs continuously and maintains an accurate rtc. power to all major functional bl ocks, including the programmable digital and analog peripherals, can be controlled independently by firmware. this allows low-power background processing when some peripherals are not in use. this, in turn, provides a total device current of only 1.2 ma when the cpu is running at 6 mhz, or 0.8 ma running at 3 mhz. the details of the psoc power modes are covered in the ?power system? section on page 29 of this datasheet. psoc uses jtag (4-wire) or swd (2-wire) interfaces for programming, debug, and test. the 1-wire swv may also be used for ?printf? style debugging. by combining swd and swv, you can implement a full debugging interface with just three pins. using these standard interfaces enables you to debug or program the psoc with a variety of hardware solutions from cypress or third party vendors. psoc supports on-chip break points and 4-kb instruction and data race memory for debug. details of the programming, test, and debugging interfaces are discussed in the ?programming, debug interfaces, resources? section on page 59 of this datasheet. 2. pinouts the vddio pin that supplies a particular set of pins is indicated by the black lines drawn on the pinout diagrams in figure 2-1 through figure 2-4 . using the vddio pins, a single psoc can support multiple interface voltage levels, eliminating the need for off-chip level shifters. each vddi o may sink up to 100 ma total to its associated i/o pins. on the 68 pin and 100 pin devices each set of vddio associated pins may sink up to 100 ma. the 48-pin device may sink up to 100 ma total for all vddio0 plus vddio2 associated i/o pins and 100 ma total for all vddio1 plus vddio3 associated i/o pins. figure 2-1. 48-pin ssop part pinout ssop vssa (sio) p12[3] 247 vcca (gpio) p0[0] 346 p15[3] (gpio, khz xtal: xi) (gpio) p0[1] 445 p12[0] (sio, i2c1: scl) vddio0 742 p12[1] (sio, i2c1: sda) 643 (extref0, gpio) p0[3] p15[1] (gpio, mhz xtal: xi) (gpio) p0[5] 940 p15[0] (gpio, mhz xtal: xo) (idac0, gpio) p0[6] 10 39 vccd (gpio) p0[7] 11 38 vssd vccd 12 37 vddd vssd 13 36 p15[7] (usbio, d-, swdck) vddd 14 35 p15[6] (usbio, d+, swdio) (gpio) p2[3] 15 34 p1[7] (gpio) (gpio) p2[4] 16 33 p1[6] (gpio) vddio2 17 32 vddio1 (gpio) p2[5] 18 31 p1[5] (gpio, ntrst) (gpio) p2[6] 19 30 p1[4] (gpio, tdi) (gpio) p2[7] 20 29 p1[3] (gpio, tdo, swv) vssb 21 28 ind 22 27 p1[1] (gpio, tck, swdck) vboost 23 26 p1[0] (gpio, tms, swdio) vbat 24 25 vdda (sio) p12[2] 148 vddio3 (gpio) p0[4] 841 p15[2] (gpio, khz xtal: xo) (gpio) p0[2] 544 lines show vddio to i/o supply association p1[2] (gpio, configurable xres) [6] [6] note 6. pins are do not use (dnu) on devices without usb. the pin must be left floating.
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 6 of 120 figure 2-2. 48-pin qfn part pinout [8] qfn (top view ) vddio2 vddio0 10 11 12 vssb ind vboost vbat 35 34 33 32 31 30 29 28 27 26 25 36 48 47 4 6 45 44 43 42 41 4 0 39 38 37 1 2 3 4 5 6 7 8 9 13 14 15 16 17 18 19 20 21 22 23 24 vddio1 (gpio) p1[6] vddd vssd vccd (gpio, mhz xtal: xo) p15[0] vddio3 vccd p2[5] (gpio) (gpio) p1[7] (gpio, mhz xtal: xi) p15[1] vcca vssa vdda vddd vssd p12[2] (sio) p12[3] (sio) p0[0] (gpio) p0[1] (gpio) p0[2] (gpio) p0[3] (extref0, gpio) p0[4] (gpio) p0[5] (gpio) p0[6] (gpio, idac0) p0[7] (gpio) p2[3] (gpio) p2[4] (gpio) (gpio) p2[6] (gpio) p2[7] (gpio, ntrst) p1[5] (gpio, tdi) p1[4] (gpio, tdo, swv) p1[3] (gpio, tck, swdck) p1[1] (gpio, tms, swdio) p1[0] (gpio, configurable xres) p1[2] (sio, i2c1: scl) p12[0] p12[1] (sio, i2c1: sda) p15[3] (gpio, khz xtal: xi) p15[2] (gpio, khz xtal: xo) (usbio, d-, swdck) p15[7] (usbio, d+, swdio) p15[6] lines show vddio to i/o supply association [7] [7] notes 7. the center pad on the qfn package should be connected to digita l ground (vssd) for best mechanical, thermal, and electrical p erformance. if not connected to ground, it should be electrically floated and not connected to any other signal. 8. ppins are do not use (dnu) on devices with out usb. the pin must be left floating.
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 7 of 120 figure 2-3. 68-pin qfn part pinout [10] notes 9. pins are do not use (dnu) on devices without usb. the pin must be left floating. 10. the center pad on the qfn package should be connected to digital ground (vssd) for best mechanic al, thermal, and electrical performance. if not connected to ground, it should be electrically floated a nd not connected to any other signal. (gpio) p2[6] (gpio) p2[7] (i2c0: scl, sio) p12[4] (i2c0: sda, sio) p12[5] vssb ind vboost vbat vssd xres (tms, swdio, gpio) p1[0] (tck, swdck, gpio) p1[1] (configurable xres, gpio) p1[2] (tdo, swv, gpio) p1[3] (tdi, gpio) p1[4] (ntrst, gpio) p1[5] vddio1 (gpio) p1[6] vccd (gpio) p3[3] (gpio) p1[7] (sio) p12[6] (sio) p12[7] (usbio, d+, swdio) p15[6] (usbio, d-, swdck) p15[7] vddd vssd (mhz xtal: xo, gpio) p15[0] (mhz xtal: xi, gpio) p15[1] (gpio) p3[0] (gpio) p3[1] (extref1, gpio) p3[2] (gpio) p3[4] (gpio) p3[5] p0[3] (gpio, extref0) p0[2] (gpio) p0[1] (gpio) p0[0] (gpio) p12[3] (sio) p12[2] (sio) vssd vdda vssa vcca p15[3] (gpio, khz xtal: xi) p15[2] (gpio, khz xtal: xo) p12[1] (sio, i2c1: sda) p12[0] (sio, 12c1: scl) p3[7] (gpio) p3[6] (gpio) vddio3 p2[5] (gpio) vddio2 p2[4] (gpio) p2[3] (gpio) p2[2] (gpio) p2[1] (gpio) p2[0] (gpio) p15[5] (gpoi) p15[4] (gpio) vddd vssd vccd p0[7] (gpio) p0[6] (gpio, idac0) p0[5] (gpio) p0[4] (gpio) vddio0 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 10 11 12 13 14 15 16 17 1 2 3 4 5 6 7 8 9 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 qfn (top view) lines show vddio to i/o supply association
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 8 of 120 figure 2-4. 100-pin tqfp part pinout figure 2-5 and figure 2-6 show an example schematic and an example pcb layou t, for the 100-pin tqfp part, for optimal analog performance on a two layer board. ? the two pins labeled vddd must be connected together. ? the two pins labeled vccd must be connected together, with capacitance added, as shown in figure 2-5 and power system on page 29. the trace between the two vccd pins should be as short as possible. ? the two pins labeled vssd must be connected together. for information on circuit board layout issues for mixed signals, refer to the application note an57821 - mixed signal circuit board layout considerations for psoc? 3 and psoc 5. tqfp (gpio) p2[5] (gpio) p2[6] (gpio) p2[7] (i2c0: scl, sio) p12[4] (i2c0: sda, sio) p12[5] (gpio) p6[4] (gpio) p6[5] (gpio) p6[6] (gpio) p6[7] vssb ind vboost vbat vssd xres (gpio) p5[0] (gpio) p5[1] (gpio) p5[2] (gpio) p5[3] (tms, swdio, gpio) p1[0] (tck, swdck, gpio) p1[1] (configurable xres, gpio) p1[2] (tdo, swv, gpio) p1[3] (tdi, gpio) p1[4] (ntrst, gpio) p1[5] vddio1 (gpio) p5[7] nc (extref1, gpio) p3[2] (gpio) p1[6] (gpio) p1[7] (sio) p12[6] (sio) p12[7] (gpio) p5[4] (gpio) p5[5] (gpio) p5[6] (usbio, d+, swdio) p15[6] (usbio, d-, swdck) p15[7] vddd vssd vccd nc (mhz xtal: xo, gpio) p15[0] (mhz xtal: xi, gpio) p15[1] (gpio) p3[0] (gpio) p3[1] (gpio) p3[3] (gpio) p3[4] (gpio) p3[5] vddio3 vddio0 p0[3] (gpio,extref0) p0[2] (gpio) p0[1] (gpio) p0[0] (gpio) p4[1] (gpio) p4[0] (gpio) p12[3] (sio) p12[2] (sio) vssd vdda vssa vcca nc nc nc nc nc nc p15[3] (gpio, khz xtal: xi) p15[2] (gpio, khz xtal: xo) p12[1] (sio, i2c1: sda) p12[0] (sio, i2c1: scl) p3[7] (gpio) p3[6] (gpio) vddio2 p2[4] (gpio) p2[3] (gpio) p2[2] (gpio) p2[1] (gpio) p2[0] (gpio) p15[5] (gpio) p15[4] (gpio) p6[3] (gpio) p6[2] (gpio) p6[1] (gpio) p6[0] (gpio) vddd vssd vccd p4[7] (gpio) p4[6] (gpio) p4[5] (gpio) p4[4] (gpio) p4[3] (gpio) p4[2] (gpio) p0[7] (gpio) p0[6] (gpio, idac0) p0[5] (gpio) p0[4] (gpio) 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 1 2 3 4 5 6 7 8 9 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 50 49 lines show vddio to i/o supply association [11] [11] note 11. pins are do not use (dnu) on devices without usb. the pin must be left floating.
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 9 of 120 figure 2-5. example schematic for 100-pin tqfp part with power connections note the two vccd pins must be connected together with as short a trace as possible. a trace under the device is recommended, as shown in figure 2-6 on page 10. vssb 10 ind 11 vboost 12 vbat 13 vssd 14 xres 15 vddd 37 vssd 38 vccd 39 vcca 63 vssa 64 vdda 65 vssd 66 vccd 86 vssd 87 vddd 88 sio, p12[2] 67 sio, p12[3] 68 p4[0] 69 p4[1] 70 oa2out, p0[0] 71 oa0out, p0[1] 72 oa0+, p0[2] 73 oa0-, ref0, p0[3] 74 vddio0 75 oa2+, p0[4] 76 oa2-, p0[5] 77 idac0, p0[6] 78 idac2, p0[7] 79 p4[2] 80 p4[3] 81 p4[4] 82 p4[5] 83 p4[6] 84 p4[7] 85 p5[0] 16 p5[1] 17 p5[2] 18 p5[3] 19 p1[0], swio, tms 20 p1[1], swdio, tck 21 p1[2] 22 p1[3], swv, tdo 23 p1[4], tdi 24 p1[5], ntrst 25 vddio1 26 p1[6] 27 p1[7] 28 p12[6], sio 29 p12[7], sio 30 p5[4] 31 p5[5] 32 p5[6] 33 p5[7] 34 usb d+, p15[6] 35 usb d-, p15[7] 36 p6[7] 9 p6[0] 89 p6[1] 90 p6[2] 91 p6[3] 92 p15[4] 93 p15[5] 94 p2[0] 95 p2[1] 96 p2[2] 97 p2[3] 98 p2[4] 99 vddio2 100 p2[5] 1 p2[6] 2 p2[7] 3 p12[4], sio 4 p12[5], sio 5 p6[4] 6 p6[5] 7 p6[6] 8 nc 40 nc 41 p15[0], mhzxout 42 p15[1], mhzxin 43 p3[0], idac1 44 p3[1], idac3 45 p3[2], oa3-, ref1 46 p3[3], oa3+ 47 p3[4], oa1- 48 p3[5], oa1+ 49 vddio3 50 oa1out, p3[6] 51 oa3out, p3[7] 52 sio, p12[0] 53 sio, p12[1] 54 khzxout, p15[2] 55 khzxin, p15[3] 56 nc 57 nc 58 nc 59 nc 60 nc 61 nc 62 u2 cy8c55xx vssd vdda vcca vccd vssd vddd vssd vddd vddd vssd p32 vssa vssa vssd vssd vssd vssd 0.1 uf c8 vssd vddd vddd vddd vddd vssa vssa vddd vssd 1 uf c9 0.1 uf c10 0.1 uf c11 0.1 uf c14 0.1 uf c16 0.1 uf c12 0.1 uf c6 0.1 uf c2 1 uf c15 1 uf c1 vssd vddd vssd vdda vssd vccd 10 uf, 6.3 v c13 1 uf c17 vssa vdda
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 10 of 120 figure 2-6. example pcb layout for 100-pin tqfp part for optimal analog performance 3. pin descriptions idac0 low resistance output pin for high current dac (idac). extref0, extref1 external reference input to the analog system. gpio general purpose i/o pin provides interfaces to the cpu, digital peripherals, analog peripherals, interrupts, lcd segment drive, and capsense. i2c0: scl, i2c1: scl i 2 c scl line providing wake from sleep on an address match. any i/o pin can be used for i 2 c scl if wake from sleep is not required. i2c0: sda, i2c1: sda i 2 c sda line providing wake from sleep on an address match. any i/o pin can be used for i 2 c sda if wake from sleep is not required. ind inductor connection to boost pump. khz xtal: xo, khz xtal: xi 32.768-khz crystal oscillator pin. mhz xtal: xo, mhz xtal: xi 4- to 25- mhz crystal oscillator pin. ntrst optional jtag test reset programming and debug port connection to reset the jtag connection. sio special i/o provides interfaces to the cpu, digital peripherals and interrupts with a programmable high threshold voltage, analog comparator, high sink current, and high impedance state when the device is unpowered. swdck serial wire debug clock programming and debug port connection. swdio serial wire debug input and output programming and debug port connection. swv. single wire viewer debug output. tck jtag test clock programming and debug port connection. tdi jtag test data in programming and debug port connection. tdo jtag test data out programming and debug port connection. tms jtag test mode select programming and debug port connection. vddd vssd vdda vssa vssd plane vssa plane
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 11 of 120 usbio, d+ provides d+ connection directly to a usb 2.0 bus. may be used as a digital i/o pin. pins are do not use (dnu) on devices without usb. usbio, d? provides d? connection directly to a usb 2.0 bus. may be used as a digital i/o pin. pins are no connect (nc) on devices without usb. vboost power sense connection to boost pump. vbat battery supply to boost pump. vcca output of analog core regulator and input to analog core. requires a 1-f capacitor to v ssa . regulator output not for external use. vccd output of digital core regulator and input to digital core. the two v ccd pins must be shorted together, with the trace between them as short as possible, and a 1-f capacitor to v ssd ; see power system on page 29. regulator output not for external use. vdda supply for all analog peripherals and analog core regulator. vdda must be the highest voltage present on the device. all other supply pins must be less than or equal to v dda . vddd supply for all digital peripherals and digital core regulator. v dda must be less than or equal to v dda . vssa ground for all analog peripherals. vssb ground connection for boost pump. vssd ground for all digital logic and i/o pins. vddio0, vddio1, vddio2, vddio3 supply for i/o pins. see pinouts for specific i/o pin to vddio mapping. each vddio must be tied to a valid operating voltage (1.71 v to 5.5 v), and must be less than or equal to vdda. if the i/o pins associated with vddio0, vddio2 or vddio3 are not used then that vddio should be tied to ground (vssd or vssa). xres (and configurable xres ) external reset pin. active low wit h internal pull-up . pin p1[2] may be configured to be a xres pin; see ?nonvolatile latches (nvls)? on page 23. 4. cpu 4.1 8051 cpu the cy8c32 devices use a single cycle 8051 cpu, which is fully compatible with the original mcs-51 instruction set. the cy8c32 family uses a pipelined risc architecture, which executes most instructions in 1 to 2 cycles to provide peak performance of up to 24 mips wi th an average of 2 cycles per instruction. the singl e cycle 8051 cpu runs ten times faster than a standard 8051 processor. the 8051 cpu subsystem includes these features: ? single cycle 8051 cpu ? up to 64 kb of flash memory, up to 2 kb of eeprom, and up to 8 kb of sram ? programmable nested vector interrupt controller ? direct memory access (dma) controller ? peripheral hub (phub) ? external memory interface (emif) 4.2 addressing modes the following addressing modes are supported by the 8051: ? direct addressing: the operand is specified by a direct 8-bit address field. only the internal ram and the sfrs can be accessed using this mode. ? indirect addressing: the instruct ion specifies the register which contains the address of the op erand. the registers r0 or r1 are used to specify the 8-bit address, while the data pointer (dptr) register is used to specify the 16-bit address. ? register addressing: certain instructions access one of the registers (r0 to r7) in the specified register bank. these instructions are more efficient because there is no need for an address field. ? register specific instructions: some instructions are specific to certain registers. for example, some instructions always act on the accumulator. in this case, there is no need to specify the operand. ? immediate constants: some instru ctions carry the value of the constants directly instead of an address. ? indexed addressing: this type of addressing can be used only for a read of the program memo ry. this mode uses the data pointer as the base and the accumulator value as an offset to read a program memory. ? bit addressing: in this mode, the operand is one of 256 bits.
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 12 of 120 4.3 instruction set the 8051 instruction set is highly optimized for 8-bit handling and boolean operations. the types of instructions supported include: ? arithmetic instructions ? logical instructions ? data transfer instructions ? boolean instructions ? program branching instructions 4.3.1 instruction set summary 4.3.1.1 arithmetic instructions arithmetic instructions support the direct, indirect, register, immediate constant, and register-specific instructions. arithmetic modes are used for addition, subtraction, multiplication, division, increment, and decrement operations. ta b l e 4 - 1 table 4-1 on page 12lists the different arithmetic instructions. table 4-1. arithmetic instructions mnemonic description bytes cycles add a,rn add register to accumulator 1 1 add a,direct add direct byte to accumulator 2 2 add a,@ri add indirect ram to accumulator 1 2 add a,#data add immediate data to accumulator 2 2 addc a,rn add register to accumulator with carry 1 1 addc a,direct add direct byte to accumulator with carry 2 2 addc a,@ri add indirect ram to accumulator with carry 1 2 addc a,#data add immediate data to accumulator with carry 2 2 subb a,rn subtract register fr om accumulator with borrow 1 1 subb a,direct subtract direct byte from accumulator with borrow 2 2 subb a,@ri subtract indirect ram from accumulator with borrow 1 2 subb a,#data subtract immediate data from accumulator with borrow 2 2 inc a increment accumulator 1 1 inc rn increment register 1 2 inc direct increment direct byte 2 3 inc @ri increment indirect ram 1 3 dec a decrement accumulator 1 1 dec rn decrement register 1 2 dec direct decrement direct byte 2 3 dec @ri decrement indirect ram 1 3 inc dptr increment data pointer 1 1 mul multiply accumulator and b 1 2 div divide accumulator by b 1 6 daa decimal adjust accumulator 1 3
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 13 of 120 4.3.1.2 logical instructions the logical instructions perform boolean operations such as and, or, xor on bytes, rotate of accumulator contents, and swap of nibbles in an accumulator. the boolean operations on the bytes are performed on the bit-by-bit basis. ta b l e 4 - 2 ta b l e 4 - 2 on page 13 shows the list of logical inst ructions and their description. table 4-2. logical instructions mnemonic description bytes cycles anl a,rn and register to accumulator 1 1 anl a,direct and direct byte to accumulator 2 2 anl a,@ri and indirect ram to accumulator 1 2 anl a,#data and immediate data to accumulator 2 2 anl direct, a and accumulator to direct byte 2 3 anl direct, #data and immediate data to direct byte 3 3 orl a,rn or register to accumulator 1 1 orl a,direct or direct by te to accumulator 2 2 orl a,@ri or indirect ram to accumulator 1 2 orl a,#data or immediate data to accumulator 2 2 orl direct, a or accumulator to direct byte 2 3 orl direct, #data or immediate data to direct byte 3 3 xrl a,rn xor register to accumulator 1 1 xrl a,direct xor direct byte to accumulator 2 2 xrl a,@ri xor indirect ram to accumulator 1 2 xrl a,#data xor immediate data to accumulator 2 2 xrl direct, a xor accumulator to direct byte 2 3 xrl direct, #data xor immediate data to direct byte 3 3 clr a clear accumulator 1 1 cpl a complement accumulator 1 1 rl a rotate accumulator left 1 1 rlc a rotate accumulato r left through carry 1 1 rr a rotate accumulator right 1 1 rrc a rotate accumulator right though carry 1 1 swap a swap nibbles within accumulator 1 1
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 14 of 120 4.3.1.3 data transfer instructions the data transfer instructions are of three types: the core ram, xdata ram, and the lookup tables. the core ram transfer includes transfer between any two core ram locations or sfrs. these instructions can use direct, indirect, register, and immediate addressing. the xdata ram transfer includes only the transfer between the accumulato r and the xdata ram location. it can use only indirect addressing. the lookup tables involve nothing but the read of program memory using the indexed addressing mode. table 4-3 lists the various data transfer instructions available. 4.3.1.4 boolean instructions the 8051 core has a separate bit-addressable memory location. it has 128 bits of bit addressable ram and a set of sfrs that are bit addressable. the instruction set includes the whole menu of bit operations such as move, set, clear, toggle, or, and and instructions and the condit ional jump instructions. table 4-4 on page 15 table 4-4 lists the available boolean instructions. table 4-3. data transfer instructions mnemonic description bytes cycles mov a,rn move register to accumulator 1 1 mov a,direct move direct byte to accumulator 2 2 mov a,@ri move indirect ram to accumulator 1 2 mov a,#data move immediate data to accumulator 2 2 mov rn,a move accumulator to register 1 1 mov rn,direct move direct byte to register 2 3 mov rn, #data move immediate data to register 2 2 mov direct, a move accumulator to direct byte 2 2 mov direct, rn move register to direct byte 2 2 mov direct, direct move direct byte to direct byte 3 3 mov direct, @ri move indirect ram to direct byte 2 3 mov direct, #data move immediate data to direct byte 3 3 mov @ri, a move accumulator to indirect ram 1 2 mov @ri, direct move direct byte to indirect ram 2 3 mov @ri, #data move immediate data to indirect ram 2 2 mov dptr, #data16 load data pointer with 16-bit constant 3 3 movc a, @a+dptr move code byte rela tive to dptr to accumulator 1 5 movc a, @a + pc move code byte re lative to pc to accumulator 1 4 movx a,@ri move external ram (8-bit) to accumulator 1 4 movx a, @dptr move external ram (16-bit) to accumulator 1 3 movx @ri, a move accumulator to external ram (8-bit) 1 5 movx @dptr, a move accumulator to external ram (16-bit) 1 4 push direct push direct byte onto stack 2 3 pop direct pop direct byte from stack 2 2 xch a, rn exchange register with accumulator 1 2 xch a, direct exchange direct byte with accumulator 2 3 xch a, @ri exchange indirect ram with accumulator 1 3 xchd a, @ri exchange low order indirect digit ram with accumulator 1 3
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 15 of 120 table 4-4. boolean instructions mnemonic description bytes cycles clr c clear carry 1 1 clr bit clear direct bit 2 3 setb c set carry 1 1 setb bit set direct bit 2 3 cpl c complement carry 1 1 cpl bit complement direct bit 2 3 anl c, bit and direct bit to carry 2 2 anl c, /bit and complement of direct bit to carry 2 2 orl c, bit or direct bit to carry 2 2 orl c, /bit or complement of direct bit to carry 2 2 mov c, bit move direct bit to carry 2 2 mov bit, c move carry to direct bit 2 3 jc rel jump if carry is set 2 3 jnc rel jump if no carry is set 2 3 jb bit, rel jump if direct bit is set 3 5 jnb bit, rel jump if direct bit is not set 3 5 jbc bit, rel jump if direct bit is set and clear bit 3 5
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 16 of 120 4.3.1.5 program branching instructions the 8051 supports a set of conditional and unconditional jump in structions that help to modify the program execution flow. table 4-5 shows the list of jump instructions. 4.4 dma and phub the phub and the dma controller are responsible for data transfer between the cpu and peripherals, and also data transfers between peripherals. the phub and dma also control device configuration during boot. the phub consists of: ? a central hub that includes th e dma controller, arbiter, and router ? multiple spokes that radiate outward from the hub to most peripherals there are two phub masters: the cpu and the dma controller. both masters may initiate transactions on the bus. the dma channels can handle peripheral communication without cpu intervention. the arbiter in t he central hub determines which dma channel is the highest priority if there are multiple requests. 4.4.1 phub features ? cpu and dma controller are both bus masters to the phub ? eight multi-layer ahb bus parall el access paths (spokes) for peripheral access ? simultaneous cpu and dma access to peripherals located on different spokes ? simultaneous dma source and de stination burst transactions on different spokes ? supports 8, 16, 24, and 32-bit addressing and data table 4-5. jump instructions mnemonic description bytes cycles acall addr11 absolute subroutine call 2 4 lcall addr16 long subroutine call 3 4 ret return from subroutine 1 4 reti return from interrupt 1 4 ajmp addr11 absolute jump 2 3 ljmp addr16 long jump 3 4 sjmp rel short jump (relative address) 2 3 jmp @a + dptr jump indirect relative to dptr 1 5 jz rel jump if accumulator is zero 2 4 jnz rel jump if accumulator is nonzero 2 4 cjne a,direct, rel compare direct byte to accumulator and jump if not equal 3 5 cjne a, #data, rel compare immediate data to accumulator and jump if not equal 3 4 cjne rn, #data, rel compare immediate data to register and jump if not equal 3 4 cjne @ri, #data, rel compare immediate data to indirect ram and jump if not equal 3 5 djnz rn,rel decrement register and jump if not zero 2 4 djnz direct, rel decrement direct byte and jump if not zero 3 5 nop no operation 1 1 table 4-6. phub spokes and peripherals phub spokes peripherals 0 sram 1 ios , picu , emif 2 phub local configuration, power manager , clocks , ic , swv , eeprom , flash programming interface 3 analog interface and trim , decimator 4 usb , usb , i 2 c , timers, counters, and pwms 5reserved 6 udbs group 1 7 udbs group 2
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 17 of 120 4.4.2 dma features ? 24 dma channels ? each channel has one or more transaction descriptors (tds) to configure channel behavior. up to 128 total tds can be defined ? tds can be dynamically updated ? eight levels of priority per channel ? any digitally routable signal, the cpu, or another dma channel, can trigger a transaction ? each channel can generate up to two interrupts per transfer ? transactions can be stalled or canceled ? supports transaction size of infinite or 1 to 64k bytes ? tds may be nested and/or chained for complex transactions 4.4.3 priority levels the cpu always has higher priority than the dma controller when their accesses require the same bus resources. due to the system architecture, the cpu c an never starve the dma. dma channels of higher priority (lower priority number) may interrupt current dma transfers. in the case of an interrupt, the current transfer is allowed to complete its current transaction. to ensure latency limits when multiple dma accesses are requested simultaneously, a fairness algorithm guarantees an interleaved minimum percentage of bus bandwidth for priority levels 2 through 7. priority levels 0 and 1 do not take part in the fairness algorithm and may use 100 percent of the bus bandwidth. if a tie occurs on two dma requests of the same priority level, a simple round robin method is used to evenly share the allocated bandwidth. the round robin allocation can be disabled for each dma channel, allowing it to always be at the head of the line. priority levels 2 to 7 are guaranteed the minimum bus bandwidth shown in ta b l e 4 - 7 after the cpu and dma priority levels 0 and 1 have satisfied their requirements. when the fairness algorithm is disabled, dma access is granted based solely on the priority level; no bus bandwidth guarantees are made. 4.4.4 transaction modes supported the flexible configuration of each dma channel and the ability to chain multiple channels allow the creation of both simple and complex use cases. general use cases include, but are not limited to: 4.4.4.1 simple dma in a simple dma case, a single td transfers data between a source and sink (peripherals or memory location). the basic timing diagrams of dma read and write cycles are shown in figure 4-1 . for more description on other transfer modes, refer to the technical reference manual. figure 4-1. dma timing diagram 4.4.4.2 auto repeat dma auto repeat dma is typically used when a static pattern is repetitively read from system memo ry and written to a peripheral. this is done with a single td that chains to itself. 4.4.4.3 ping pong dma a ping pong dma case uses double buffering to allow one buffer to be filled by one client while an other client is consuming the data previously received in the other buffer. in its simplest form, this is done by chaining two tds together so that each td calls the opposite td when complete. 4.4.4.4 circular dma circular dma is similar to ping pong dma except it contains more than two buffers. in this case there are multiple tds; after the last td is complete it chains back to the first td. table 4-7. priority levels priority level % bus bandwidth 0 100.0 1 100.0 2 50.0 3 25.0 4 12.5 56.2 63.1 71.5 clk addr 16/32 write data ready basic dma read transfer without wait states ab data (a) address phase data phase ab address phase data phase clk write data ready data (a) basic dma write transfer without wait states addr 16/32
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 18 of 120 4.4.4.5 scatter gather dma in the case of scatter gather dma, there are multiple noncontiguous sources or destin ations that are required to effectively carry out an overall dma transaction. for example, a packet may need to be transmitted off of the device and the packet elements, including the header, payload, and trailer, exist in various noncontiguous locations in memory. scatter gather dma allows the segments to be concatenated together by using multiple tds in a chain. the chain gathers the data from the multiple locations. a similar concept applies for the reception of data onto the device. certain parts of the received data may need to be scattered to various locati ons in memory for software processing convenience. each td in the chain specifies the location for each discrete element in the chain. 4.4.4.6 packet queuing dma packet queuing dma is similar to scatter gather dma but specifically refers to packet protocols. with these protocols, there may be separate configurat ion, data, and status phases associated with sending or receiving a packet. for instance, to transmit a packet, a memory mapped configuration register can be written inside a peripheral, specifying the overall length of the ensuing data phase. the cpu can set up this configuration information anywhere in system memory and copy it with a simple td to the peripheral. after the configuration phase, a data phase td (or a series of data phase tds) can begin (potentially using scatter gather). when the data phase td(s) finish, a status phase td can be invoked that reads some memory mapped status information from the peripheral and copies it to a location in system memory s pecified by the cpu for later inspection. multiple sets of configuration, data, and status phase ?subchains? can be strung together to create larger chains that transmit multiple packets in this way. a similar concept exists in the opposite di rection to receive the packets. 4.4.4.7 nested dma one td may modify another td, as the td configuration space is memory mapped similar to any other peripheral. for example, a first td loads a second td?s configuration and then calls the second td. the second td moves data as required by the application. when complete, the second td calls the first td, which again updates the second td?s configuration. this process repeats as often as necessary. 4.5 interrupt controller the interrupt controller provides a mechanism for hardware resources to change program execution to a new address, independent of the current task being executed by the main code. the interrupt controller provides enhanced features not found on original 8051 interrupt controllers: ? thirty two interrupt vectors ? jumps directly to isr anywhere in code space with dynamic vector addresses ? multiple sources for each vector ? flexible interrupt to vector matching ? each interrupt vector is independently enabled or disabled ? each interrupt can be dynamically assigned one of eight priorities ? eight level nestable interrupts ? multiple i/o interrupt vectors ? software can send interrupts ? software can clear pending interrupts when an interrupt is pending, the current instruction is completed and the program coun ter is pushed onto the stack. code execution then jumps to the program address provided by the vector. after the isr is comp leted, a reti instruction is executed and returns execution to the instruction following the previously interrupted instruction. to do this the reti instruction pops the program counter from the stack. if the same priority level is assi gned to two or more interrupts, the interrupt with the lower vector number is executed first. each interrupt vector may choose from three interrupt sources: fixed function, dma, and udb. the fixed function interrupts are direct connections to the most common interrupt sources and provide the lowest resource cost connection. the dma interrupt sources provide direct connections to the two dma interrupt sources provided per dma channel. the third interrupt source for vectors is from the udb digital routing array. this allows any digital signal available to the udb array to be used as an interrupt source. fixed function interrupts and all interrupt sources may be routed to any interrupt vector usin g the udb interrupt source connections. figure 4-2 on page 19 represents typical flow of events when an interrupt triggered. figure 4-3 on page 20 shows the interrupt structure and priority polling.
document number: 001-56955 rev. *k page 19 of 120 psoc ? 3: cy8c32 family data sheet figure 4-2. interrupt processing timing diagram notes 1: interrupt triggered asynchronous to the clock 2: the pend bit is set on next active clock edge to indicate the interrupt arrival 3: post bit is set following the pend bit 4: interrupt request and t he interrupt number sent to cpu core af ter evaluation priority (takes 3 clocks) 5: isr address is posted to cpu core for branching 6: cpu acknowledges the interrupt request 7: isr address is read by cpu for branching 8, 9: pend and post bits are cleared res pectively after receiving the ira from core 10: ira bit is cleared after completing the current instruction an d starting the instruction exec ution from isr location (takes 7 cycles) 11: irc is set to indicate the co mpletion of isr, active int. status is restored with previous status the total interrupt latency (isr execution) = post + pend + irq + ira + completing current instruction and branching = 1+1+1+2+7 cycles = 12 cycles the active interrupt isr address is posted to core interrupt generation and posting to cpu the active interrupt number is posted to core interrupt request sent to core for processing interrupt is posted to ascertain the priority pend bit is set on next system clock active edge arrival of new interrupt clk int_input pend post irq active_int_num (#10) int_vect_addr ira irc s s s s s s s s s s s 0x0010 na cpu response int. state clear completing current instruction and branching to vector address complete isr and return na irq cleared after receiving ira post and pend bits cleared after irq is sleared 0x0000 na time 1 2 3 4 5 6 7 8 9 10 11
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 20 of 120 figure 4-3. interrupt structure interrupts 0 to 30 from udbs interrupt routing logic to select 31 sources interrupt 2 to 29 0 1 30 individual enable disable bits global enable disable bit interrupt enable/ disable, pend and post logic interrupts form fixed function blocks, dma and udbs 8 level priority decoder for all interrupts polling sequence highest priority lowest priority interrupt polling logic irc ira irq 0 to 30 [15:0] active_int_num int_vect_addr interrupts 0 to 30 from fixed function blocks interrupts 0 to 30 from dma
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 21 of 120 table 4-8. interrupt vector table # fixed function dma udb 0 lvd phub_termout0[0] udb_intr[0] 1 ecc phub_termout0[1] udb_intr[1] 2 reserved phub_termout0[2] udb_intr[2] 3 sleep (pwr mgr) phub_termout0[3] udb_intr[3] 4 picu[0] phub_term out0[4] udb_intr[4] 5 picu[1] phub_term out0[5] udb_intr[5] 6 picu[2] phub_term out0[6] udb_intr[6] 7 picu[3] phub_term out0[7] udb_intr[7] 8 picu[4] phub_term out0[8] udb_intr[8] 9 picu[5] phub_term out0[9] udb_intr[9] 10 picu[6] phub_termout 0[10] udb_intr[10] 11 picu[12] phub_term out0[11] udb_intr[11] 12 picu[15] phub_term out0[12] udb_intr[12] 13 comparators combined phub_termout0[13] udb_intr[13] 14 reserved phub_termout0[14] udb_intr[14] 15 i 2 c phub_termout0[15] udb_intr[15] 16 reserved phub_termout1[0] udb_intr[16] 17 timer/counter0 phub_t ermout1[1] udb_intr[17] 18 timer/counter1 phub_t ermout1[2] udb_intr[18] 19 timer/counter2 phub_t ermout1[3] udb_intr[19] 20 timer/counter3 phub_t ermout1[4] udb_intr[20] 21 usb sof int phub_termout1[5] udb_intr[21] 22 usb arb int phub_termout1[6] udb_intr[22] 23 usb bus int phub_termout1[7] udb_intr[23] 24 usb endpoint[0] phub_termout1[8] udb_intr[24] 25 usb endpoint data phub_termout1[9] udb_intr[25] 26 reserved phub_termout1[10] udb_intr[26] 27 lcd phub_termout1[11] udb_intr[27] 28 reserved phub_termout1[12] udb_intr[28] 29 decimator int phub_termout1[13] udb_intr[29] 30 phub error int phub_termout1[14] udb_intr[30] 31 eeprom fault int phub_termout1[15] udb_intr[31]
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 22 of 120 5. memory 5.1 static ram cy8c32 static ram (sram) is used for temporary data storage. up to 8 kb of sram is provided and can be accessed by the 8051 or the dma controller. see memory map on page 24. simultaneous access of sram by the 8051 and the dma controller is possible if diff erent 4-kb blocks are accessed. 5.2 flash program memory flash memory in psoc devices provides nonvolatile storage for user firmware, user configuration data, bulk data storage, and optional ecc data. the main flash memory area contains up to 64 kb of user program space. up to an additional 8 kb of flash space is available for error correcting codes (ecc). if ecc is not used this space can store device configuration data and bulk user data. user code may not be run out of the ecc flash me mory section. ecc can correct one bit error and detect two bit errors per 8 bytes of firmware memory; an interrupt can be generated when an error is detected. flash is read in units of rows; each row is 9 bytes wide with 8 bytes of data and 1 byte of ecc data. when a row is read, the data bytes are copied into an 8-byte instruction buffer. the cpu fetches its instructions from this buffer, for improved cpu performance. flash programming is performed through a special interface and preempts code execution out of flash. the flash programming interface performs flash erasing, programming and setting code protection levels. flash in-syst em serial programming (issp), typically used for production programming, is possible through both the swd and jtag interf aces. in-system programming, typically used for bootloaders, is also possible using serial interfaces such as i 2 c, usb, uart, and spi, or any communications protocol. 5.3 flash security all psoc devices include a flexible flash-protection model that prevents access and visibility to on-chip flash memory. this prevents duplication or reverse en gineering of proprietary code. flash memory is organized in blo cks, where each block contains 256 bytes of program or data and 32 bytes of ecc or configuration data. a to tal of up to 256 blocks is provided on 64-kb flash devices. the device offers the ability to assign one of four protection levels to each row of flash. table 5-1 lists the protection modes available. flash protection levels can only be changed by performing a complete flash erase. the full protection and field upgrade settings disable external access (through a debugging tool such as psoc creator, for example). if your application requires code update through a boot loader, then use the field upgrade setting. use the unprotected setting only when no security is needed in your application. the psoc device also offers an advanced security feature called device security which permanently disables all test, programming, and debug ports, protecting your application from external access (see the ?device security? section on page 62). for more information about how to take full advantage of the security features in psoc, see the psoc 3 trm. disclaimer note the following details of the fl ash code protection features on cypress devices. cypress products meet the specifications contained in their particular cypress datasheets. cypress believes that its family of products is one of the most secure families of its kind on the market today, regardless of how they are used. there may be methods, unknown to cypress, that can breach the code protection features. an y of these methods, to our knowledge, would be dishonest and possibly illegal. neither cypress nor any other semiconductor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? cypress is willing to work with the customer who is concerned about the integrity of their code. code protection is constantly evolving. we at cypress are committed to continuously improving the code protecti on features of our products. 5.4 eeprom psoc eeprom memory is a byte-addressable nonvolatile memory. the cy8c32 has up to 2 kb of eeprom memory to store user data. reads from eep rom are random access at the byte level. reads are done dire ctly; writes are done by sending write commands to an eeprom programming interface. cpu code execution can continue from flash during eeprom writes. eeprom is erasable and writeab le at the row level. the eeprom is divided into 128 rows of 16 bytes each. the cpu can not execute out of eeprom. there is no ecc hardware associated with eeprom. if ecc is required it must be handled in firmware. table 5-1. flash protection protection setting allowed not allowed unprotected external read and write + internal read and write ? factory upgrade external write + internal read and write external read field upgrade internal read and write external read and write full protection internal read external read and write + internal write
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 23 of 120 5.5 nonvolatile latches (nvls) psoc has a 4-byte array of nonvolatile latches (nvls) that are used to configure the device at reset. the nvl register map is s hown in ta b l e 5 - 2 . the details for individual fields and their factory default settings are shown in table 5-3 :. although psoc creator provides support for modifying the device configuration nvls, the number of nvl erase / write cycles is l imited ? see ?nonvolatile latches (nvl))? on page 97 . table 5-2. device configuration nvl register map register address 7 6 5 4 3 2 1 0 0x00 prt3rdm[1:0] prt2rdm[1:0] prt1rdm[1:0] prt0rdm[1:0] 0x01 prt12rdm[1:0] prt6rdm[1:0] prt5rdm[1:0] prt4rdm[1:0] 0x02 xresmen prt15rdm[1:0] 0x03 dig_phs_dly[ 3:0] eccen dps[1:0] table 5-3. fields and factory default settings field description settings prtxrdm[1:0] controls reset drive mode of the corresponding io port. see ?reset configuration? on page 40. all pins of the port are set to the same mode. 00b (default) - high impedance analog 01b - high impedance digital 10b - resistive pull up 11b - resistive pull down xresmen controls whether pin p1[2 ] is used as a gpio or as an external reset. see ?pin descriptions? on page 10, xres description. 0 (default for 68-pin and 100-pin parts) - gpio 1 (default for 48-pin parts) - external reset dps{1:0] controls the usage of various p1 pins as a debug port. see ?programming, debug interfaces, resources? on page 59. 00b - 5-wire jtag 01b (default) - 4-wire jtag 10b - swd 11b - debug ports disabled eccen controls whether ecc flash is used for ecc or for general configuration and data storage. see ?flash program memory? on page 22. 0 (default) - ecc disabled 1 - ecc enabled dig_phs_dly[3:0] selects the digital clock phase delay. see the trm for details.
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 24 of 120 5.6 external memory interface cy8c32 provides an external memory interface (emif) for connecting to external memory devices. the connection allows read and write accesses to external memories. the emif operates in conjunction with udbs, i/o ports, and other hardware to generate external memory address and control signals. at 33 mhz, each memo ry access cycle takes four bus clock cycles. figure 5-1 is the emif block diagram. the emif supports synchronous and asynchronous memories. the cy8c32 supports only one type of external memory device at a time. external memory can be accessed via the 8051 xdata space; up to 24 address bits can be used. see ?xdata space? section on page 26. the memory can be 8 or 16 bits wide. figure 5-1. emif block diagram 5.7 memory map the cy8c32 8051 memory map is very similar to the mcs-51 memory map. 5.7.1 code space the cy8c32 8051 code space is 64 kb. only main flash exists in this space. see the ?flash program memory? section on page 22. 5.7.2 internal data space the cy8c32 8051 internal data space is 384 bytes, compressed within a 256-byte space. this space consists of 256 bytes of ram (in addition to the sram mentioned in static ram on page 22) and a 128-byte space for special function registers (sfrs). see figure 5-2 . the lowest 32 bytes are used for 4 banks of registers r0-r7. the next 16 bytes are bit-addressable. phub io if udb emif io ports io ports io ports data, address, and control signals data, address, and control signals address signals data signals control signals data, address, and control signals em control signals other control signals dsi dynamic output control dsi to port control external_ mem_ data[15:0] external_ mem_ addr[23:0]
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 25 of 120 figure 5-2. 8051 internal data space in addition to the register or bit address modes used with the lower 48 bytes, the lower 128 bytes can be accessed with direct or indirect addressing. with direct addressing mode, the upper 128 bytes map to the sfrs. with indirect addressing mode, the upper 128 bytes map to ram. stack operations use indirect addressing; the 8051 stack space is 256 bytes. see the ?addressing modes? section on page 11 5.7.3 sfrs the special function register (sfr) space provides access to fr equently accessed registers. the memory map for the sfr memory space is shown in table 5-4 . the cy8c32 family provides the standard set of registers found on industry standard 8051 devices. in addition, the cy8c32 devices add sfrs to provide direct access to the i/o ports on the device. the following sections describe the sfrs added to the cy8c32 family. xdata space access sfrs the 8051 core features dual dp tr registers for faster data transfer operations. the data pointer select sfr, dps, selects which data pointer register, dptr 0 or dptr1, is used for the following instructions: ? movx @dptr, a ? movx a, @dptr ? movc a, @a+dptr ? jmp @a+dptr ? inc dptr ? mov dptr, #data16 the extended data pointer sfrs, dpx0, dpx1, mxax, and p2ax, hold the most significant parts of memory addresses during access to the xdata space. these sfrs are used only with the movx instructions. during a movx instruction using the dptr0/dptr1 register, the most significant byte of the address is always equal to the contents of dpx0/dpx1. during a movx instruction using t he r0 or r1 register, the most significant byte of the address is always equal to the contents of mxax, and the next most significant byte is always equal to the contents of p2ax. upper core ram shared with stack space (indirect addressing) sfr special function registers (direct addressing) lower core ram shared with stack space (direct and indirect addressing) bit-addressable area 4 banks, r0-r7 each 0xff 0x80 0x7f 0x30 0x2f 0x20 0x1f 0x00 table 5-4. sfr map address 0/8 1/9 2/a 3/b 4/c 5/d 6/e 7/f 0f8sfrprt15drsfrprt15pssfrprt15sel????? 0f0b ? sfrprt12sel????? 0e8sfrprt12drsfrprt12psmxax ????? 0e0acc ? ? ????? 0d8sfrprt6drsfrprt6pssfrprt6sel????? 0d0psw ? ? ????? 0c8sfrprt5drsfrprt5pssfrprt5sel????? 0c0sfrprt4drsfrprt4pssfrprt4sel????? 0b8? ? ? ????? 0b0sfrprt3drsfrprt3pssfrprt3sel????? 0a8ie ? ? ????? 0a0p2ax ? sfrprt1sel????? 098sfrprt2drsfrprt2pssfrprt2sel????? 090 sfrprt1dr sfrprt1ps ? dpx0 dpx1 ? ? 088? sfrprt0pssfrprt0sel????? 080 sfrprt0dr sp dpl0 dph0 dpl1 dph1 dps ?
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 26 of 120 i/o port sfrs the i/o ports provide digital input sensing, output drive, pin interrupts, connectivity for analog inputs and outputs, lcd, and access to peripherals through the dsi. full information on i/o ports is found in i/o system and routing on page 34. i/o ports are linked to the cpu through the phub and are also available in the sfrs. using the sfrs allows faster access to a limited set of i/o port registers, while using the phub allows boot configuration and access to all i/o port registers. each sfr supported i/o port provides three sfrs: ? sfrprtxdr sets the output data state of the port (where x is port number and includes ports 0 ? 6, 12 and 15). ? the sfrprtxsel selects whether the phub prtxdr register or the sfrprtxdr cont rols each pin?s output buffer within the port. if a sfrprtxsel[y] bit is high, the corresponding sfrprtxdr[y] bit se ts the output state for that pin. if a sfrprtxsel[y] bit is low, the corresponding prtxdr[y] bit sets the output state of the pin (where y varies from 0 to 7). ? the sfrprtxps is a read only regi ster that contains pin state values of the port pins. 5.7.3.1 xdata space the 8051 xdata space is 24-bit, or 16 mb in size. the majority of this space is not ?external??it is used by on-chip components. see ta b l e 5 - 5 . external, that is, off-chip, memory can be accessed using the emif. see external memory interface on page 24. 6. system integration 6.1 clocking system the clocking system generates, di vides, and distributes clocks throughout the psoc system. for the majority of systems, no external crystal is required. the imo and pll together can generate up to a 50 mhz clock, accurate to 1 percent over voltage and temperature. additional internal and external clock sources allow each design to op timize accuracy, power, and cost. all of the system clock sources can be used to generate other clock frequencies in the 16-bit clock dividers and udbs for anything the user wants, for example a uart baud rate generator. clock generation and distribution is automatically configured through the psoc creator ide graphical interface. this is based on the complete system?s require ments. it greatly speeds the design process. psoc creator allows you to build clocking systems with minimal input. yo u can specify desired clock frequencies and accuracies, and the software locates or builds a clock that meets the required specifications. this is possible because of the programmability inherent psoc. key features of the cl ocking system include: ? seven general purpose clock sources ? 3- to 24-mhz imo, 1 percent at 3 mhz ? 4- to 25-mhz external crystal oscillator (mhzeco) ? clock doubler provides a doubled clock frequency output for the usb block, see usb clock domain on page 29 ? dsi signal from an external i/o pin or other logic ? 24- to 50- mhz fractional p ll sourced from imo, mhzeco, or dsi ? 1-khz, 33-khz, 100-khz ilo for watchdog timer (wdt) and sleep timer ? 32.768-khz external crystal oscillator (khzeco) for rtc ? imo has a usb mode that auto locks to the usb bus clock requiring no external crystal for usb. (usb equipped parts only) ? independently sourced clock in all clock dividers ? eight 16-bit clock divider s for the digital system ? four 16-bit clock dividers for the analog system ? dedicated 16-bit divider for the bus clock ? dedicated 4-bit divider for the cpu clock ? automatic clock configuration in psoc creator table 5-5. xdata data address map address range purpose 000 0000 ? 000 1fff sram 000 4000 ? 000 42ff clocking, plls, and oscillators 000 4300 ? 000 43ff power management 000 4400 ? 000 44ff interrupt controller 000 4500 ? 000 45ff ports interrupt control 000 4700 ? 000 47ff flash programming interface 000 4900 ? 000 49ff i 2 c controller 000 4e00 ? 000 4eff decimator 000 4f00 ? 000 4fff fixed timer/counter/pwms 000 5000 ? 000 51ff i/o ports control 000 5400 ? 000 54ff external memory interface (emif) control registers 000 5800 ? 000 5fff analog subsystem interface 000 6000 ? 000 60ff usb controller 000 6400 ? 000 6fff udb configuration 000 7000 ? 000 7fff phub configuration 000 8000 ? 000 8fff eeprom 001 0000 ? 001 ffff digital interconnect configuration 005 0220 ? 005 02f0 debug controller 008 0000 ? 008 1fff flash ecc bytes 080 0000 ? 0ff ffff external memory interface table 5-5. xdata data address map (continued) address range purpose
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 27 of 120 figure 6-1. clocking subsystem 6.1.1 internal oscillators 6.1.1.1 internal main oscillator in most designs the imo is the only clock source required, due to its 1-percent accuracy. the imo operates with no external components and outputs a stable clock. a factory trim for each frequency range is stored in the device. with the factory trim, tolerance varies from 1 percent at 3 mhz, up to 4-percent at 24 mhz. the imo, in conjunction with the pll, allows generation of cpu and system clocks up to the device's maximum frequency (see phase-locked loop ) the imo provides clock outputs at 3, 6, 12, and 24 mhz. 6.1.1.2 clock doubler the clock doubler outputs a clock at twice the frequency of the input clock. the doubler works at input frequency of 24 mhz, providing 48 mhz for the usb. it can be configured to use a clock from the imo, mhzeco, or the dsi (external pin). 6.1.1.3 phase-locked loop the pll allows low-frequency, high-accuracy clocks to be multiplied to higher frequencies. this is a tradeoff between higher clock frequency and accuracy and, higher power consumption and increased startup time. the pll block provides a mechanism for generating clock frequencies based upon a variety of input sources. the pll table 6-1. oscillator summary source fmin tolerance at fmin fmax tolerance at fmax startup time imo 3 mhz 1% over voltage and temperature 24 mhz 4% 10 s max mhzeco 4 mhz crystal dependent 25 mhz crystal dependent 5 ms typ, max is crystal dependent dsi 0 mhz input dependent 50 mhz input dependent input dependent pll 24 mhz input dependent 50 mhz input dependent 250 s max doubler 48 mhz input dependent 48 mhz input dependent 1 s max ilo 1 khz ?50%, +100% 100 khz ?55%, +100% 15 ms max in lowest power mode khzeco 32 khz crystal dependent 32 khz crystal dependent 500 ms typ, max is crystal dependent 4-25 mhz eco 3-24 mhz imo 32 khz eco 1,33,100 khz ilo s k e w 7 7 digital clock divider 16 bit digital clock divider 16 bit digital clock divider 16 bit digital clock divider 16 bit digital clock divider 16 bit digital clock divider 16 bit digital clock divider 16 bit digital clock divider 16 bit analog clock divider 16 bit bus clock divider 16 bit 48 mhz doubler for usb 24-50 mhz pll system clock mux external io or dsi 0-50 mhz s k e w analog clock divider 16 bit s k e w analog clock divider 16 bit s k e w analog clock divider 16 bit cpu clock divider 4 bit bus clock cpu clock
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 28 of 120 outputs clock frequencies in the range of 24 to 50 mhz. its input and feedback dividers supply 4032 discrete ratios to create almost any desired system cloc k frequency. the accuracy of the pll output depends on the accu racy of the pll input source. the most common pll use is to mu ltiply the imo clock at 3 mhz, where it is most accurate to generate the cpu and system clocks up to the device?s maximum frequency. the pll achieves phase lock within 250 s (verified by bit setting). it can be configured to use a clock from the imo, mhzeco or dsi (external pin). the pll clock source can be used until lock is complete and signaled with a lock bit. the lock signal can be routed through the dsi to generate an interrupt. disable the pll before entering low-power modes. 6.1.1.4 internal low-speed oscillator the ilo provides clock frequenci es for low-power consumption, including the watchdog timer, and sleep timer. the ilo generates up to three different clocks: 1 khz, 33 khz, and 100 khz. the 1 khz clock (clk1k) is typically used for a background ?heartbeat? timer. this clock inherently lends itself to low-power supervisory operations such as the watchdog timer and long sleep intervals using the central timewheel (ctw). the central timewheel is a 1 khz, free running, 13-bit counter clocked by the ilo. the central timewheel is always enabled, except in hibernate mode and when the cpu is stopped during debug on chip mode. it can be used to generate periodic interrupts for timing purposes or to wake the system from a low-power mode. firmware can reset the central timewheel. systems that require accurate timing should use the rtc capability instead of the central timewheel. the 100-khz clock (clk100k) works as a low-power system clock to run the cpu. it can also generate time intervals such as fast sleep intervals using the fast timewheel. the fast timewheel is a 100-khz, 5-bit counter clocked by the ilo that can also be used to wake the system. the fast timewheel settings are programmable, and th e counter automatically resets when the terminal count is reached. this enables flexible, periodic wakeups of the cpu at a higher rate than is allowed using the central timewheel. the fast timewheel can generate an optional interrupt each time the terminal count is reached. the 33-khz clock (clk33k) comes from a divide-by-3 operation on clk100k. this output can be used as a reduced accuracy version of the 32.768-khz eco clock with no need for a crystal. 6.1.2 external oscillators 6.1.2.1 mhz external crystal oscillator the mhzeco provides high frequency, high precision clocking using an external crystal (see figure 6-2 ). it supports a wide variety of crystal types, in the range of 4 to 25 mhz. when used in conjunction with the pll, it can ge nerate cpu and system clocks up to the device's maximum frequency (see ?phase-locked loop? section on page 27). the gpio pins connecting to the external crystal and capacitors are fixed. mhzeco accuracy depends on the crystal chosen. figure 6-2. mhzeco block diagram 6.1.2.2 32.768-khz eco the 32.768-khz external cryst al oscillator (32khzeco) provides precision timing with minimal power consumption using an external 32.768-khz watch crystal (see figure 6-3 ). the 32khzeco also connects directly to the sleep timer and provides the source for the rtc. the rtc uses a 1-second interrupt to implement the rtc functionality in firmware. the oscillator works in two distinct power modes. this allows users to trade off power consumption with noise immunity from neighboring circuits. the gpio pins connected to the external crystal and capacitors are fixed. figure 6-3. 32khzeco block diagram 6.1.2.3 digital system interconnect the dsi provides routing for clocks taken from external clock oscillators connected to i/o. the oscillators can also be generated within the de vice in the digital system and universal digital blocks. while the primary dsi clock input provides access to all clocking resources, up to eight other dsi clocks (internally or externally generated) may be routed directly to the eight digital clock xo (pin p15[0]) 4 - 25 mhz crystal osc xclk_mhz 4 ? 25 mhz crystal capacitors external components xi (pin p15[1]) xo (pin p15[2]) 32 khz crystal osc xclk32k 32 khz crystal capacitors external components xi (pin p15[3])
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 29 of 120 dividers. this is only possible if there are multiple precision clock sources. 6.1.3 clock distribution all seven clock sources are inputs to the central clock distribution system. the distribution system is designed to create multiple high precision clocks. these clocks are customized for the design?s requirements and eliminate the common problems found with limited resolution pre scalers attached to peripherals. the clock distribution system generates several types of clock trees. ? the system clock is used to se lect and supply the fastest clock in the system for general system clock requirements and clock synchronization of the psoc device. ? bus clock 16-bit divider uses t he system clock to generate the system's bus clock used for da ta transfers. bus clock is the source clock for the cpu clock divider. ? eight fully programmable 16-bit clock dividers generate digital system clocks for general us e in the digital system, as configured by the design?s requ irements. digital system clocks can generate custom clocks derived from any of the seven clock sources for any purpose. examples include baud rate generators, accurate pwm periods, and timer clocks, and many others. if more than eight digital clock dividers are required, the universal digital bl ocks (udbs) and fixed function timer/counter/pwms can also generate clocks. ? four 16-bit clock dividers genera te clocks for the analog system components that require clocking, such as adc. the analog clock dividers include skew control to ensure that critical analog events do not occur simultaneously with digital switching events. this is done to reduce analog system noise. each clock divider consists of an 8-input multiplexer, a 16-bit clock divider (divide by 2 and higher) that generates ~50 percent duty cycle clocks, system clo ck resynchronizati on logic, and deglitch logic. the outputs from each digital clock tree can be routed into the digital system interconnect and then brought back into the clock system as an input, a llowing clock chaining of up to 32 bits. 6.1.4 usb clock domain the usb clock domain is unique in that it operates largely asynchronously from the main clock network. the usb logic contains a synchronous bus interface to the chip, while running on an asynchronous clock to process usb data. the usb logic requires a 48 mhz frequency. this frequency can be generated from different sources, including dsi clock at 48 mhz or doubled value of 24 mhz from internal oscillator, dsi signal, or crystal oscillator. 6.2 power system the power system consists of separate analog, digital, and i/o supply pins, labeled vdda, vddd, and vddiox, respectively. it also includes two internal 1.8 v regulators that provide the digital (vccd) and analog (vcca) supplies for the internal core logic. the output pins of the regulators (v ccd and vcca) and the vddio pins must have capacitors connected as shown in figure 6-4 . the two vccd pins must be shorted to gether, with as short a trace as possible, and connected to a 1-f 10-percent x5r capacitor. the power system also contains a sleep regulator, an i 2 c regulator, and a hibernate regulator.
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 30 of 120 figure 6-4. psoc power system note the two vccd pins must be connected together with as short a trace as possible. a trace under the device is recommended, as shown in figure 2-6 . vssb vssd vddio1 vddio2 vddio0 vddio3 vccd vddd vssd vccd vddd vssa vcca vdda digital regulators analog regulator analog domain digital domain i2c regulator sleep regulator hibernate regulator i/ o supply i/o supply i/o supply i/o supply . vddio2 vddio0 vddio3 vddio1 0.1 f 0.1 f 0.1 f 0.1 f vddd vddd 1 f 1 f vdda 0.1 f 0.1 f 0.1 f
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 31 of 120 6.2.1 power modes psoc 3 devices have four different power modes, as shown in ta b l e 6 - 2 and ta b l e 6 - 3 . the power modes allow a design to easily provide required functional ity and processing power while simultaneously minimizing power consumption and maximizing battery life in low-power and portable devices. psoc 3 power modes, in order of decreasing power consumption are: ? active ? alternate active ? sleep ? hibernate active is the main processing mode. its functionality is configurable. each power contro llable subsystem is enabled or disabled by using separate power configuration template registers. in alte rnate active mode, fewer subsystems are enabled, reducing power. in sleep mode most resources are disabled regardless of the template settings. sleep mode is optimized to provide timed sleep intervals and rtc functionality. the lowest power mode is hibernate, which retains register and sram state, but no clocks, and allows wakeup only from i/o pins. figure 6-5 illustrates the allowable transitions between power modes. note 12. bus clock off. execute from cpu instruction buffer at 6 mhz. see table 11-2 on page 65. table 6-2. power modes power modes description entry condition wakeup source active clocks regulator active primary mode of operation, all peripherals available (program- mable) wakeup, reset, manual register entry any interrupt any (programmable) all regulators available. digital and analog regulators can be disabled if external regulation used. alternate active similar to active mode, and is typically configured to have fewer peripherals active to reduce power. one possible configuration is to use the udbs for processing, with the cpu turned off manual register entry any interrupt any (programmable) all regulators available. digital and analog regulators can be disabled if external regulation used. sleep all subsystems automatically disabled manual register entry comparator, picu, i 2 c, rtc, ctw, lvd ilo/khzeco both digital and analog regulators buzzed. digital and analog regulators can be disabled if external regulation used. hibernate all subsystems automatically disabled lowest power consuming mode with all peripherals and internal regulators disabled, except hibernate regulator is enabled configuration and memory contents retained manual register entry picu only hibernate regulator active. table 6-3. power modes wakeup time and power consumption sleep modes wakeup time current (typ) code execution digital resources analog resources clock sources available wakeup sources reset sources active ? 1.2 ma [12] yes all all all ? all alternate active ??user defined all all all ? all sleep <15 s 1 a no i 2 c comparator ilo/khzeco comparator, picu, i 2 c, rtc, ctw, lvd xres, lvd, wdr hibernate <100 s 200 na no none none none picu xres
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 32 of 120 figure 6-5. power mode transitions 6.2.1.1 active mode active mode is the primary oper ating mode of the device. when in active mode, the active configuration template bits control which available resources are enabled or disabled. when a resource is disabled, the digital clocks are gated, analog bias currents are disabled, and leakage currents are reduced as appropriate. user firmware can dynamically control subsystem power by setting and clearing bits in the active configuration template. the cpu can disable itself, in which case the cpu is automatically reenabled at the next wakeup event. when a wakeup event occurs, the global mode is always returned to active, and the cpu is automatically enabled, regardless of its template setting s. active mode is the default global power mode upon boot. 6.2.1.2 alternate active mode alternate active mode is very sim ilar to active mode. in alternate active mode, fewer subsystems are enabled, to reduce power consumption. one possible configuration is to turn off the cpu and flash, and run peripherals at full speed. 6.2.1.3 sleep mode sleep mode reduces power consumption when a resume time of 15 s is acceptable. the wake time is used to ensure that the regulator outputs are stable enough to directly enter active mode. 6.2.1.4 hibernate mode in hibernate mode nearly all of the internal functions are disabled. internal voltages are reduced to the minimal level to keep vital systems alive. config uration state is preserved in hibernate mode and sram memory is retained. gpios configured as digital outputs maintain their previous values and external gpio pin interrupt settings are preserved. the device can only return from hibernate mode in response to an external i/o interrupt. the resume time from hibernate mode is less than 100 s. 6.2.1.5 wakeup events wakeup events are configurable and can come from an interrupt or device reset. a wakeup event restores the system to active mode. firmware enabled interrupt sources include internally generated interrupts, power super visor, central timewheel, and i/o interrupts. internal interrupt sources can come from a variety of peripherals, such as analog comparators and udbs. the central timewheel provides periodic interrupts to allow the system to wake up, poll periphe rals, or perform real-time functions. reset event sources include the external reset i/o pin (xres), wdt, and precision reset (pres). 6.2.2 boost converter applications that use a supply voltage of less than 1.71 v, such as solar or single cell battery supplies, may use the on-chip boost converter. the boost converter may also be used in any system that requires a higher operating voltage than the supply provides. for instance, this includes driving 5.0 v lcd glass in a 3.3 v system. the boost converter accept s an input voltage as low as 0.5 v. with one low cost inductor it produces a selectable output voltage sourcing enough current to operate the psoc and other on-board components. the boost converter accepts an input voltage from 0.5 v to 5.5 v (v bat ), and can start up with v bat as low as 0.5 v. the converter provides a user configurable output voltage of 1.8 to 5.0 v (v boost ). v bat is typically less than v boost ; if v bat is greater than or equal to v boost , then v boost will be the same as v bat . the block can deliver up to 50 ma (i boost ) depending on configuration. four pins are associated with the boost converter: v bat , v ssb , v boost , and ind. the boosted output voltage is sensed at the v boost pin and must be connected directly to the chip?s supply inputs. an inductor is connected between the v bat and ind pins. you can optimize the inductor value to increase the boost converter efficiency based on input voltage, output voltage, current and switching frequency. the external schottky diode shown in figure 6-6 is required only in cases when v boost >3.6v. figure 6-6. application for boost converter active manual hibernate alternate active sleep buzz psoc vboost ind vbat vssb vssd vdda vddd vssa 22 f 0. 1 f 22 f 10 h optional schottky diode only required vboost > 3.6 v vddio smp
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 33 of 120 the switching frequency can be set to 100 khz, 400 khz, 2 mhz, or 32 khz to optimize efficiency and component cost. the 100 khz, 400 khz, and 2 mhz switching frequencies are generated using oscillators internal to the boost converter block. when the 32-khz switching frequency is selected, the clock is derived from a 32 khz external crystal oscillator. the 32-khz external clock is primarily intended for boost standby mode. at 2 mhz the vboost output is limited to 2 vbat, and at 400 khz vboost is limited to 4 vbat. the boost converter can be operated in two different modes: active and standby. active mode is the normal mode of operation where the boost regulator active ly generates a regulated output voltage. in standby mode, most boost functions are disabled, thus reducing power consumpt ion of the boost circuit. the converter can be configured to provide low-power, low-current regulation in the standby mode. the external 32 khz crystal can be used to generate inductor boost pulses on the rising and falling edge of the clock when the output voltage is less than the programmed value. this is calle d automatic thump mode (atm). the boost typically draws 200 a in active mode and 12 a in standby mode. the boost operating modes must be used in conjunction with chip power modes to minimize the total chip power consumption. ta b l e 6 - 4 lists the boost power modes available in different chip power modes. if the boost converter is not used in a given application, tie the v bat , v ssb , and v boost pins to ground and leave the ind pin unconnected. 6.3 reset cy8c32 has multiple internal and external reset sources available. the reset sources are: ? power source monitoring ? the analog and digital power voltages, v dda , v ddd , v cca , and v ccd are monitored in several different modes during power up, active mode, and sleep mode (buzzing). if any of the voltages goes outside predetermined ranges then a rese t is generated. the monitors are programmable to generate an interrupt to the processor under certain conditions before reaching the reset thresholds. ? external ? the device can be reset from an external source by pulling the reset pin (xres ) low. the xres pin includes an internal pull-up to v ddio1 . v ddd , v dda , and v ddio1 must all have voltage applied before the part comes out of reset. ? watchdog timer ? a watchdog timer monitors the execution of instructions by the processor. if the watchdog timer is not reset by firmware within a certain period of time, the watchdog timer generates a reset. ? software ? the device can be reset under program control. figure 6-7. resets the term device reset indicates that the processor as well as analog and digital peripherals and registers are reset. a reset status register holds the source of the most recent reset or power voltage monitoring interrupt. the program may examine this register to detect and report exception conditions. this register is cleared after a power-on reset. 6.3.1 reset sources 6.3.1.1 power voltage level monitors ? ipor ? initial power-on reset at initial power-on, ipor monitors the power voltages v ddd and v dda , both directly at the pins and at the outputs of the corresponding internal regulators. the trip level is not precise. it is set to approximately 1 volt, which is below the lowest specified operating voltage but high enough for the internal circuits to be reset and to hold their reset state. the monitor generates a reset pulse that is at least 100 ns wide. it may be much wider if one or more of the voltages ramps up slowly. to save power the ipor circuit is disabled when the internal digital supply is stable. voltage supervision is then handed off to the precise low voltage reset (pres) circuit. when the voltage is high enough for pres to release, the imo starts. ? pres ? precise low voltage reset this circuit monitors the outputs of the analog and digital internal regulators after power up. the regulator outputs are compared to a precise reference voltage. the response to a pres trip is identica l to an ipor reset. in normal operating mode, the program cannot disable the digital pres circuit. the analog regulator can be disabled, which also disables the analog portion of the pres. the pres circuit is disabled automatically during sleep and hibernate modes, with one exception: du ring sleep mode the regulators are periodically activated (bu zzed) to provide supervisory table 6-4. chip and boost power modes compatibility chip power modes boost power modes chip ? active mode boost can be operated in either active or standby mode. chip ? sleep mode boost can be operated in either active or standby mode. however, it is recom- mended to operate boost in standby mode for low-power consumption chip ? hibernate mode boost can only be operated in active mode. however, it is recommended not to use boost in chip hibernate mode due to high current consumption in boost active mode reset controller watchdog timer external reset power voltage level monitors software reset register vddd vdda reset pin system reset processor interrupt
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 34 of 120 services and to reduce wakeup time. at these times the pres circuit is also buzzed to allow periodic voltage monitoring. ? alvi, dlvi, ahvi ? analog/digital low voltage interrupt, analog high voltage interrupt interrupt circuits are available to detect when v dda and v ddd go outside a voltage range. for ahvi, v dda is compared to a fixed trip level. for alvi and dlvi, v dda and v ddd are compared to trip levels that are programmable, as listed in table 6-5 . alvi and dlvi can also be configured to generate a device reset instead of an interrupt. the monitors are disabled until after ipor. during sleep mode these circuits are periodically activated (buzzed). if an interrupt occurs during buzzing then the system first enters its wake up sequence. the interrupt is then recognized and may be serviced. 6.3.1.2 other reset sources ? xres ? external reset psoc 3 has either a single gpio pin that is configured as an external reset or a dedicated xres pin. either the dedicated xres pin or the gpio pin, if configured, holds the part in reset while held active (low). the response to an xres is the same as to an ipor reset. the external reset is active low. it includes an internal pull-up resistor. xres is active during sleep and hibernate modes. ? sres ? software reset a reset can be commanded under program control by setting a bit in the software reset register. this is done either directly by the program or indirectly by dma access. the response to a sres is the same as after an ipor reset. another register bit exists to disable this function. ? wres ? watchdog timer reset the watchdog reset detects when the software program is no longer being executed correctly. to indicate to the watchdog timer that it is running correct ly, the program must periodically reset the timer. if the timer is not reset before a user-specified amount of time, then a reset is generated. note ipor disables the watchdog function. the program must enable the watchdog function at an appropriate point in the code by setting a register bit. when this bit is set, it cannot be cleared again except by an ipor power-on reset event. 6.4 i/o system and routing psoc i/os are extremely flexible. every gpio has analog and digital i/o capability. all i/os have a large number of drive modes, which are set at por. psoc also provides up to four individual i/o voltage domains through the v ddio pins. there are two types of i/o pins on every device; those with usb provide a third type. both gpio and special i/o (sio) provide similar digital functionality. the primary differences are their analog capability and drive strength. devices that include usb also provide two usbio pins that support specific usb functionality as well as limited gpio capability. all i/o pins are available for use as digital inputs and outputs for both the cpu and digital peripherals. in addition, all i/o pins can generate an interrupt. the flexible and advanced capabilities of the psoc i/o, combined with any signal to any pin routability, greatly simplify circuit design and board layout. all gpio pins can be used for analog input, capsense, and lcd segment drive, while sio pins are used for voltages in excess of v dda and for programmable output voltages. ? features supported by both gpio and sio: ? user programmable port reset state ? separate i/o supplies and voltages for up to four groups of i/o ? digital peripherals use dsi to connect the pins ? input or output or both for cpu and dma ? eight drive modes ? every pin can be an interrupt source configured as rising edge, falling edge or both edges. if required, level sensitive interrupts are supported through the dsi ? dedicated port interrupt vector for each port ? slew rate controlled digital output drive mode ? access port control and configurat ion registers on either port basis or pin basis ? separate port read (ps) and writ e (dr) data registers to avoid read modify write errors ? special functionality on a pin by pin basis ? additional features only provided on the gpio pins: ? lcd segment drive on lcd equipped devices ? capsense ? analog input and output capability ? continuous 100 a clamp current capability ? standard drive strength down to 1.7 v ? additional features only provided on sio pins: ? higher drive strength than gpio ? hot swap capability (5 v tolerance at any operating v dd ) ? programmable and regulated high input and output drive levels down to 1.2 v ? no analog input, capsense, or lcd capability ? over voltage tolerance up to 5.5 v ? sio can act as a general purpose analog comparator ? usbio features: ? full speed usb 2.0 compliant i/o ? highest drive strength for general purpose use ? input, output, or both for cpu and dma ? input, output, or both for digital peripherals ? digital output (cmos) drive mode ? each pin can be an interrupt source configured as rising edge, falling edge, or both edges table 6-5. analog/digital low voltage interrupt, analog high voltage interrupt interrupt supply normal voltage range available trip settings accuracy dlvi v ddd 1.71 v ? 5.5 v 1.70 v ? 5.45 v in 250 mv increments 2% alvi v dda 1.71 v ? 5.5 v 1.70 v ? 5.45 v in 250 mv increments 2% ahvi v dda 1.71 v ? 5.5 v 5.75 v 2%
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 35 of 120 figure 6-8. gpio block diagram drive logic prt[x]dm0 prt[x]dr pin digital output path digital input path prt[x]slw lcd logic & mux prt[x]dm1 prt[x]dm2 prt[x]lcd_en prt[x]lcd_com_seg analog analog mux enable analog global enable digital system output 0 1 prt[x]byp prt[x]bie bidirectional control capsense global control switches pin interrupt signal digital system input prt[x]ps prt[x]ctl input buffer disable display data interrupt logic picu[x]inttype[y] picu[x]intstat vddio vddio vddio slew cntl lcd bias bus 5 prt[x]amux prt[x]ag 1 caps[x]cfg1 oe in prt[x]sync_out prt[x]dbl_sync_in picu[x]intstat naming convention ?x? = port number ?y? = pin number 0 1 0 1
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 36 of 120 figure 6-9. sio input/output block diagram figure 6-10. usbio block diagram drive logic prt[x]dm0 prt[x]dr pin digital output path digital input path prt[x]slw prt[x]dm1 prt[x]dm2 digital system output 0 1 prt[x]byp prt[x]bie bidirectional control pin interrupt signal digital system input prt[x]ps input buffer disable interrupt logic picu[x]inttype[y] picu[x]intstat slew cntl oe in prt[x]sync_out prt[x]dbl_sync_in picu[x]intstat prt[x]sio_diff buffer thresholds driver vhigh prt[x]sio_cfg prt[x]sio_hyst_en naming convention ?x? = port number ?y? = pin number reference level reference level drive logic usbio_cr1[4,5] pin digital output path digital input path digital system output 0 1 prt[x]byp pin interrupt signal digital system input usbio_cr1[0,1] interrupt logic picu[x]inttype[y] picu[x]intstat in prt[x]dbl_sync_in picu[x]intstat naming convention ?x? = port number ?y? = pin number vddd vddd vddd 5 k 1.5 k d+ pin only usbio_cr1[2] usbio_cr1[3] usbio_cr1[6] usbio_cr1[7] usb or i/o d+ 1.5 k d+d- 5 k open drain prt[x]sync_out usb sie control for usb mode usb receiver circuitry vddd
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 37 of 120 6.4.1 drive modes each gpio and sio pin is individually configurab le into one of the eight drive modes listed in ta b l e 6 - 6 . three configuration bits are used for each pin (dm[2:0]) and set in the prtxdm[2:0] registers. figure 6-11 depicts a simplified pin view based on each of the eight drive modes. ta b l e 6 - 6 shows the i/o pin?s drive state based on the port data regi ster value or digital array signal if bypass mode is selected. note that the actual i/o pin vo ltage is determined by a combination of th e selected drive mode and the load at the pi n. for example, if a gpio pin is configured for resistive pull-up mode and driven high while the pin is floating, the voltage measured at the pin is a high logic state. if the same gpio pin is externally tied to ground then the voltage unmeasured at the pin is a low lo gic state. figure 6-11. drive mode table 6-6. drive modes diagram drive mode prtxdm2 prtxdm1 prtxdm0 prtxdr = 1 prtxdr = 0 0 high impedence analog 0 0 0 high z high z 1 high impedance digital 0 0 1 high z high z 2 resistive pull-up [13] 0 1 0 res high (5k) strong low 3 resistive pull-down [13] 0 1 1 strong high res low (5k) 4 open drain, drives low 1 0 0 high z strong low 5 open drain, drive high 1 0 1 strong high high z 6 strong drive 1 1 0 strong high strong low 7 resistive pull-up and pull-down [13] 1 1 1 res high (5k) res low (5k) high impedance analog ps dr ps dr ps dr 0. high impedance digital 1. resistive pull-up 2. resistive pull-down 3. open drain , drives low 4. open drain , drives high 5. strong drive 6. resistive pull-up and pull-down 7. vddio pin pin pin vddio pin pin pin pin pin ps dr ps dr ps dr ps dr ps dr vddio vddio vddio note 13. resistive pull-up and pull-down are not av ailable with sio in regulated output mode.
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 38 of 120 ? high impedance analog the default reset state with both the output driver and digital input buffer turned off. this prevents any current from flowing in the i/o?s digital input buffer due to a floating voltage. this state is recommended for pins that are floating or that support an analog voltage. high impedance analog pins do not provide digital input functionality. to achieve the lowest chip current in sleep modes, all i/os must either be configured to the high impedance analog mode, or have their pins driven to a power supply rail by the psoc device or by external circuitry. ? high impedance digital the input buffer is enabled for digital signal input. this is the standard high impedance (hiz) state recommended for digital inputs. ? resistive pull-up or resistive pull-down resistive pull-up or pull-down, respectively, provides a series resistance in one of the data states and strong drive in the other. pins can be used for di gital input and output in these modes. interfacing to mechani cal switches is a common application for these modes. resistive pull-up and pull-down are not available with sio in regulated output mode. ? open drain, drives high a nd open drain, drives low open drain modes provide high impedance in one of the data states and strong drive in the other. pins can be used for digital input and output in these modes. a common application for these modes is driving the i 2 c bus signal lines. ? strong drive provides a strong cmos output drive in either high or low state. this is the standard out put mode for pins. strong drive mode pins must not be used as inputs under normal circumstances. this mode is often used to drive digital output signals or external fets. ? resistive pull-up and pull-down similar to the resistive pull-u p and resistive pull-down modes except the pin is always in series with a resistor. the high data state is pull-up while the low da ta state is pull-down. this mode is most often used when othe r signals that may cause shorts can drive the bus. resistive pull-up and pull-down are not available with sio in regulated output mode. 6.4.2 pin registers registers to configure and interact with pins come in two forms that may be used interchangeably. all i/o registers are available in the standard port form, where each bit of the register corresponds to one of the port pins. this register form is efficient for quickly reconfiguring multiple port pins at the same time. i/o registers are also available in pin form, which combines the eight most commonly used port register bits into a single register for each pin. this enables very fast configuration changes to individual pins with a single register write. 6.4.3 bidirectional mode high-speed bidirectional capability allows pins to provide both the high impedance digital drive mode for input signals and a second user selected drive mode su ch as strong drive (set using prtdm[2:0] registers) for output signals on the same pin, based on the state of an auxiliary control bus signal. the bidirectional capability is useful for processor busses and communications interfaces such as the spi slave miso pin that requires dynamic hardware control of the output buffer. the auxiliary control bus routes up to 16 udb or digital peripheral generated output enable signals to one or more pins. 6.4.4 slew rate limited mode gpio and sio pins have fast and slow output slew rate options for strong and open drain drive m odes, not resistive drive modes. because it results in reduced emi, the slow edge rate option is recommended for signals that are not speed critical, generally less than 1 mhz. the fast slew rate is for signals between 1 mhz and 33 mhz. the slew rate is individually configurable for each pin, and is set by the prtslw registers. 6.4.5 pin interrupts all gpio and sio pins are able to generate interrupts to the system. all eight pins in each por t interface to their own port interrupt control unit (picu) and associated interrupt vector. each pin of the port is independently configurable to detect rising edge, falling edge, both edge interrupts, or to not generate an interrupt. depending on the configured mode for each pin, each time an interrupt event occurs on a pin, its corresponding status bit of the interrupt status register is set to ?1? and an interrupt request is sent to the interrupt controller. each picu has its own interrupt vector in the interrupt controll er and the pin st atus register providing easy determination of t he interrupt source down to the pin level. port pin interrupts remain active in all sleep modes allowing the psoc device to wake from an externally generated interrupt. while level sensitive interrupts are not directly supported; universal digital blocks (udb) prov ide this functionality to the system when needed. 6.4.6 input buffer mode gpio and sio input buffers can be configured at the port level for the default cmos input thre sholds or the optional lvttl input thresholds. all input buffers incorporate schmitt triggers for input hysteresis. additionally, individual pin input buffers can be disabled in any drive mode. 6.4.7 i/o power supplies up to four i/o pin power supplies are provided depending on the device and package. each i/o supply must be less than or equal to the voltage on the chip?s analog (v dda ) pin. this feature allows users to provide different i/o voltage levels for different pins on the device. refer to the specific device package pinout to determine v ddio capability for a given port and pin. the sio port pins support an additional regulated high output capability, as described in adjustable output level .
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 39 of 120 6.4.8 analog connections these connections apply only to gpio pins. all gpio pins may be used as analog inputs or outputs. the analog voltage present on the pin must not exceed the v ddio supply voltage to which the gpio belongs. each gpio may connect to one of the analog global busses or to one of the analog mux buses to connect any pin to any internal analog resource such as adc or comparators. in addition, one select pin provides direct connection to the high current dac. 6.4.9 capsense this section applies only to gpio pins. all gpio pins may be used to create capsense bu ttons and sliders. see the ?capsense? section on page 57 fo r more information. 6.4.10 lcd segment drive this section applies only to gpio pins. all gpio pins may be used to generate segment and common drive signals for direct glass drive of lcd glass. see the ?lcd direct drive? section on page 57 for details. 6.4.11 adjustable output level this section applies only to sio pins. sio port pins support the ability to provide a regulated high output level for interface to external signals that are lower in voltage than the sio?s respective v ddio . sio pins are individually configurable to output either the standard v ddio level or the regulated output, which is based on an internally generated reference. typically the voltage dac (vdac) is used to generate the reference (see figure 6-12 ). the ?dac? section on page 58 has more details on vdac use and reference routing to the sio pins. resistive pull-up and pull-down drive modes are not available with sio in regulated output mode. 6.4.12 adjustable input level this section applies only to sio pins. sio pins by default support the standard cmos and lvttl input levels but also support a differential mode with programmable levels. sio pins are grouped into pairs. each pair shares a reference generator block which, is used to set the digital input buffer reference level for interface to external signals that differ in voltage from v ddio . the reference sets the pins voltage threshold for a high logic level (see figure 6-12 ). available input thresholds are: ? 0.5 vddio ? 0.4 vddio ? 0.5 v ref ? v ref typically the voltage dac (vdac) generates the v ref reference. the ?dac? section on page 58 has more details on vdac use and reference routing to the sio pins. figure 6-12. sio reference for input and output 6.4.13 sio as comparator this section applies only to sio pins. the adjustable input level feature of the sios as explained in the adjustable input level section can be used to construct a comparator. the threshold for the comparator is provided by the sio's reference generator. the reference generator has the option to set the analog signal routed through the analog global line as threshold for the comparator. note that a pair of sio pins share the same threshold. the digital input path in figure 6-9 on page 36 illustrates this functionality. in the figure, ?reference level? is the analog signal routed through the analog global . the hysteresis feature can also be enabled for the input buffer of the sio, which increases noise immunity for the comparator. 6.4.14 hot swap this section applies only to sio pins. sio pins support ?hot swap? capability to plug into an application without loading the signals that are connected to the sio pins even when no power is applied to the psoc device. this allows the unpowered psoc to maintain a high impedance load to the external device while also preventing the psoc from being powered through a gpio pin?s protection diode. pin drive logic driver vhigh reference generator sio_ref digital input digital output input path output path vinref voutref
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 40 of 120 6.4.15 over voltage tolerance all i/o pins provide an over voltage tolerance feature at any operating v dd . ? there are no current limitations fo r the sio pins as they present a high impedance load to the external circuit where v ddio < v in < 5.5 v. ? the gpio pins must be limited to 100 a using a current limiting resistor. gpio pins clamp the pin voltage to approximately one diode above the v ddio supply where v ddio < v in < v dda . ? in case of a gpio pin configured for analog input/output, the analog voltage on the pin must not exceed the v ddio supply voltage to which the gpio belongs. a common application for this featur e is connection to a bus such as i 2 c where different devices are running from different supply voltages. in the i 2 c case, the psoc chip is configured into the open drain, drives low mode fo r the sio pin. this allows an external pull-up to pull the i 2 c bus voltage above the psoc pin supply. for example, the psoc chip could operate at 1.8 v, and an external device could run from 5 v. note that the sio pin?s v ih and v il levels are determined by the associated v ddio supply pin. the i/o pin must be configured into a high impedance drive mode, open drain low drive mode, or pull-down drive mode, for over voltage tolerance to work properly. absolute maximum ratings for the device must be observed for all i/o pins. 6.4.16 reset configuration while reset is active all i/os ar e reset to and held in the high impedance analog state. after rese t is released, the state can be reprogrammed on a port-by-port basis to pull-down or pull-up. to ensure correct reset operation, the port reset configuration data is stored in special nonvolatile registers. the stored reset data is automatically transferred to the por t reset configuration registers at reset release. 6.4.17 low-power functionality in all low-power modes the i/o pins retain their state until the part is awakened and changed or reset. to awaken the part, use a pin interrupt, because the port interrupt logic continues to function in all low-power modes. 6.4.18 special pin functionality some pins on the device include additional special functionality in addition to their gpio or sio functionality. the specific special function pins are listed in pinouts on page 5. the special features are: ? digital ? 4- to 25- mhz crystal oscillator ? 32.768-khz crystal oscillator ? wake from sleep on i 2 c address match. any pin can be used for i 2 c if wake from sleep is not required. ? jtag interface pins ? swd interface pins ? swv interface pins ? external reset ? analog ? high current idac output ? external reference inputs 6.4.19 jtag boundary scan the device supports standard jtag boundary scan chains on all i/o pins for board level test. 7. digital subsystem the digital programmable system creates applicat ion specific combinations of both standard and advanced digital peripherals and custom logic functions. these peripherals and logic are then interconnected to each other and to any pin on the device, providing a high level of design flexibility and ip security. the features of the digital programmable system are outlined here to provide an overview of capabilities and architecture. you do not need to interact directly with the programmable digital system at the hardware and re gister level. psoc creator provides a high level schematic capture graphical interface to automatically place and route resources similar to plds. the main components of the di gital programmable system are: ? universal digital blocks (udb) ? these form the core functionality of the digital programmable system. udbs are a collection of uncommitted logic (pld) and structural logic (datapath) optimized to create all common embedded peripherals and customized functional ity that are application or design specific. ? universal digital block array ? udb blocks are arrayed within a matrix of programmable interconnect. the udb array structure is homogeneous and allows for flexible mapping of digital functions onto the array. the array supports extensive and flexible routing interconnects between udbs and the digital system interconnect. ? digital system interconnect (dsi) ? digital signals from universal digital blocks (udbs), fixed function peripherals, i/o pins, interrupts, dma, and ot her system core signals are attached to the digital system interconnect to implement full featured device connectivity. the dsi allows any digital function to any pin or other feature routability when used with the universal digital block array.
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 41 of 120 figure 7-1. cy8c32 digital programmable architecture 7.1 example peripherals the flexibility of the cy8c32 family?s universal digital blocks (udbs) and analog blocks allow the user to create a wide range of components (peripherals). the most common peripherals were built and characterized by cypress and are shown in the psoc creator component catalog, however, users may also create their own custom comp onents using psoc creator. using psoc creator, users may also cr eate their own components for reuse within their organization, for example sensor interfaces, proprietary algorithms, and display interfaces. the number of components available through psoc creator is too numerous to list in the datasheet, and the list is always growing. an example of a component available for use in cy8c32 family, but, not explicitly called out in this datasheet is the uart component. 7.1.1 example digital components the following is a sample of the digital components available in psoc creator for the cy8c32 family. the exact amount of hardware resources (udbs, routing, ram, flash) used by a component varies with the features selected in psoc creator for the component. ? communications ? i 2 c ? uart ? spi ? functions ? emif ? pwms ? timers ? counters ? logic ? not ? or ? xor ? and 7.1.2 example analog components the following is a sample of the analog components available in psoc creator for the cy8c32 family. the exact amount of hardware resources (routing, ram, flash) used by a component varies with the features selected in psoc creator for the component. ? adc ? delta-sigma ? dacs ? current ? voltage ? pwm ? comparators 7.1.3 example system function components the following is a sample of the system function components available in psoc creator for the cy8c32 family. the exact amount of hardware resources (udb s, routing, ram, flash) used by a component varies with t he features selected in psoc creator for the component. ? capsense ? lcd drive ? lcd control 7.1.4 designing with psoc creator 7.1.4.1 more than a typical ide a successful design tool allows for the rapid development and deployment of both simple and complex designs. it reduces or eliminates any learning curve. it makes the integration of a new design into the production stream straightforward. psoc creator is that design tool. psoc creator is a full featured integrated development environment (ide) for hardware and software design. it is optimized specifically for psoc devices and combines a modern, powerful software development platform with a sophisticated graphical design tool. this unique combination of tools makes psoc creator the most flexible embedded design platform available. graphical design entry simplifies the task of configuring a particular part. you can select th e required functionality from an extensive catalog of components an d place it in your design. all components are parameterized and have an editor dialog that allows you to tailor functionality to your needs. psoc creator automatical ly configures cloc ks and routes the i/o to the selected pins and then generates apis to give the application complete control over the hardware. changing the psoc device configuration is as simple as adding a new component, setting its parameters, and rebuilding the project. at any stage of development you are free to change the hardware configuration and even the target processor. to retarget your application (hardware and software) to new devices, even from 8- to 32-bit families, just select the new device and rebuild. you also have the ability to chan ge the c compiler and evaluate an alternative. components are designed for portability and are validated against all devices, from all families, and against all supported tool chains. switching compilers is as easy as editing the from the project options and rebuilding the application with no errors from the generated apis or boot code. io port digital core system and fixed function peripherals udb array udb array io port io port io port dsi routing interface dsi routing interface digital core system and fixed function peripherals udb udb udb udb udb udb udb udb udb udb udb udb udb udb udb udb udb udb udb udb udb udb udb udb
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 42 of 120 figure 7-2. psoc creator framework
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 43 of 120 7.1.4.2 component catalog figure 7-3. component catalog the component catalog is a repository of reusable design elements that select device functionality and customize your psoc device. it is populated with an impressive selection of content; from simple primitives such as logic gates and device registers, through the digital timers, counters and pwms, plus analog components such as adc and dac, and communication protocols, such as i 2 c, and usb. see example peripherals on page 41 for more details about available peripherals. all content is fully characterized and carefully documented in datasheets with code examples, ac/dc specifications, and user code ready apis. 7.1.4.3 design reuse the symbol editor gives you the ability to develop reusable components that can significantly reduce future design time. just draw a symbol and associate that symbol with your proven design. psoc creator allows fo r the placement of the new symbol anywhere in the component catalog along with the content provided by cypress. you can then reuse your content as many times as you want, and in any number of projects, without ever having to revisit the details of the implementation. 7.1.4.4 software development figure 7-4. code editor anchoring the tool is a modern, highly customizable user interface. it includes project m anagement and integrated editors for c and assembler source code, as well the design entry tools. project build control leverages compiler technology from top commercial vendors such as arm ? limited, keil?, and codesourcery (gnu). free versions of keil c51 and gnu c compiler (gcc) for arm, with no rest rictions on code size or end product distribution, are includ ed with the tool distribution. upgrading to more optimizing compilers is a snap with support for the professional keil c51 product and arm realview? compiler. 7.1.4.5 nonintrusive debugging figure 7-5. psoc creator debugger with jtag (4-wire) and swd (2-wire) debug connectivity available on all devices, the psoc creator debugger offers full control over the target device with minimum intrusion. breakpoints and code execution commands are all readily available from toolbar buttons and an impressive lineup of windows?register, locals, watch, call stack, memory and peripherals?make for an unparalleled level of visibility into the system.
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 44 of 120 psoc creator contains all the tools necessary to complete a design, and then to maintain and extend that design for years to come. all steps of the design flow are carefully integrated and optimized for ease-of-use and to maximize productivity. 7.2 universal digital block the universal digital block (udb) represents an evolutionary step to the next generation of psoc embedded digital peripheral functionality. the architecture in first generation psoc digital blocks provides coarse progra mmability in which a few fixed functions with a small number of options are available. the new udb architecture is the optima l balance between configuration granularity and efficient implementation. a cornerstone of this approach is to provide the ability to customize the devices digital operation to match application requirements. to achieve this, udbs consist of a combination of uncommitted logic (pld), structured logic (dat apath), and a flexible routing scheme to provide interconnect between these elements, i/o connections, and other peripherals. udb functionality ranges from simple self contained functions that are implemented in one udb, or even a portion of a udb (unused resources are available for other functions), to more complex functions that require multiple udbs. examples of basic functions are timers, counters, crc generators, pwms, dead band generators, and communications functions, such as uarts, spi, and i 2 c. also, the pld blocks and conn ectivity provide fu ll featured general purpose programmable logic within the limits of the available resources. figure 7-6. udb block diagram the main component blocks of the udb are: ? pld blocks ? there are two sma ll plds per udb. these blocks take inputs from the routing array and form registered or combinational sum-of-products logic. plds are used to implement state machines, state bits, and combinational logic equations. pld configuration is automatically generated from graphical primitives. ? datapath module ? this 8-bit wide datapath contains structured logic to implement a dynamically configurable alu, a variety of compare configurations and co ndition generation. this block also contains input/output fifos, which are the primary parallel data interface betw een the cpu/dma syst em and the udb. ? status and control module ? the primary role of this block is to provide a way for cpu firmware to interact and synchronize with udb operation. ? clock and reset module ? this bl ock provides the udb clocks and reset selection and control. 7.2.1 pld module the primary purpose of the pld blocks is to implement logic expressions, state machines, sequencers, lookup tables, and decoders. in the simple st use model, consider the pld blocks as a standalone resource onto which general purpose rtl is synthesized and mapped. the more common and efficient use model is to create digital func tions from a combination of pld and datapath blocks, where the pld implements only the random logic and state portion of the function while the datapath (alu) implements the more structured elements. figure 7-7. pld 12c4 structure one 12c4 pld block is shown in figure 7-7 . this pld has 12 inputs, which feed across eight product terms. each product term (and function) can be from 1 to 12 inputs wide, and in a given product term, the true (t) or complement (c) of each input can be selected. the product terms are summed (or function) to create the pld outputs. a sum can be from 1 to 8 product terms wide. the 'c' in 12c4 indicates that the width of the or gate (in this case 8) is constant across all outputs (rather than variable as in a 22v10 device). this pla like structure gives maximum flexibility and insures that all inputs and outputs are permutable for ease of allocation by the software tools. there are two 12c4 plds in each udb. pld 12c4 (8 pts) pld 12c4 (8 pts) datapath clock and reset control routing channel datapath chaining pld chaining status and control pt0 in0 in1 in2 in3 in4 in5 in6 in7 in8 in9 in10 in11 tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc tc pt1 pt2 pt3 pt4 pt5 pt6 pt7 tttttttt tttttttt tttttttt tttttttt and array or array mc0 mc1 mc2 out0 out1 out2 out3 mc3 selin (carry in) selout (carry out)
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 45 of 120 7.2.2 datapath module the datapath contains an 8-bit single cycle alu, with associated compare and condition generation logi c. this datapath block is optimized to implement embedded functions, such as timers, co unters, integrators, pwms, prs, crc, shifters and dead band generators and many others. figure 7-8. datapath top level 7.2.2.1 working registers the datapath contains six primary working registers, which are accessed by cpu firmware or dma during normal operation. 7.2.2.2 dynamic datapath configuration ram dynamic configuration is the ability to change the datapath function and internal configuration on a cycle-by-cycle basis, under sequencer control. this is implemented using the 8-word 16-bit configuration ram, which stores eight unique 16-bit wide configurations. the address input to this ram controls the sequence, and can be routed from any block connected to the udb routing matr ix, most typically pld logic, i/o pins, or from the outputs of this or other datapath blocks. alu the alu performs eight general purpose functions. they are: ? increment ? decrement ? add ? subtract ? logical and ? logical or ? logical xor ? pass, used to pass a value through the alu to the shift register, mask, or another udb register a0 a1 d0 d1 pi alu mask shift data registers output muxes f1 f0 fifos accumulators po a0 a1 d0 d1 output to programmable routing chaining control store ram 8 word x 16 bit parallel input/output (to/from programmable routing) input from programmable routing input muxes to/from next datapath to/from previous datapath datapath control phub system bus r/w access to all registers conditions: 2 compares, 2 zero detect, 2 ones detect overflow detect 6 6 table 7-1. working datapath registers name function description a0 and a1 accumulators these are sources and sinks for the alu and also sources for the compares. d0 and d1 data registers these are sources for the alu and sources for the compares. f0 and f1 fifos these are the primary interface to the system bus. they can be a data source for the data registers and accumulators or they can capture data from the accumu- lators or alu. ea ch fifo is four bytes deep.
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 46 of 120 independent of the alu operation, these functions are available: ? shift left ? shift right ? nibble swap ? bitwise or mask 7.2.2.3 conditionals each datapath has two compar es, with bit masking options. compare operands include the two accumulators and the two data registers in a variety of configurations. other conditions include zero detect, all ones detect, and overflow. these conditions are the primary datapat h outputs, a selection of which can be driven out to the udb routing matrix. conditional computation can use the built in chaining to neighboring udbs to operate on wider data widths without the need to use routing resources. 7.2.2.4 variable msb the most significant bit of an arithmetic and shift function can be programmatically specified. this supports variable width crc and prs functions, and in conjunction with alu output masking, can implement arbitrary width timers, counters and shift blocks. 7.2.2.5 built in crc/prs the datapath has built in support for single cycle cyclic redundancy check (crc) computation and pseudo random sequence (prs) generation of arbitrary width and arbitrary polynomial. crc/prs functions longer than 8 bits may be implemented in conjunction with pld logic, or built in chaining may be use to extend the func tion into neighboring udbs. 7.2.2.6 input/output fifos each datapath contains two four-byte deep fifos, which can be independently configured as an i nput buffer (system bus writes to the fifo, datapath internal reads the fifo), or an output buffer (datapath internal writes to the fifo, the system bus reads from the fifo). the fifos generat e status that are selectable as datapath outputs and can theref ore be driven to the routing, to interact with sequencer s, interrupts, or dma. figure 7-9. example fifo configurations 7.2.2.7 chaining the datapath can be configured to chain conditions and signals such as carries and shift data with neighboring datapaths to create higher precision arithmetic, shift, crc/prs functions. 7.2.2.8 time multiplexing in applications that are over sa mpled, or do not need high clock rates, the single alu block in the datapath can be efficiently shared with two sets of register s and condition generators. carry and shift out data from the alu are registered and can be selected as inputs in subsequent cycles. this provides support for 16-bit functions in one (8-bit) datapath. 7.2.2.9 datapath i/o there are six inputs and six outputs that connect the datapath to the routing matrix. inputs fr om the routing provide the configuration for the datapath oper ation to perform in each cycle, and the serial data inputs. inputs can be routed from other udb blocks, other device peripherals, device i/o pins, and so on. the outputs to the routing can be selected from the generated conditions, and the serial data outputs. outputs can be routed to other udb blocks, device per ipherals, interrupt and dma controller, i/o pins, and so on. 7.2.3 status and control module the primary purpose of this circuitry is to coordinate cpu firmware interaction with internal udb operation. figure 7-10. status and control registers the bits of the control register, which may be written to by the system bus, are used to drive into the routing matrix, and thus provide firmware with the opportunity to control the state of udb processing. the status register is read-only and it allows internal udb state to be read out onto th e system bus directly from internal routing. this allows firm ware to monitor the state of udb processing. each bit of these registers has programmable connections to the routing matr ix and routing connections are made depending on the requirem ents of the application. 7.2.3.1 usage examples as an example of control input, a bit in the control register can be allocated as a function enable bit. there are multiple ways to enable a function. in one method the control bit output would be routed to the clock control block in one or more udbs and serve as a clock enable for the selected udb blocks. a status example is a case where a pld or datapath block generated a condition, such as a ?compare true? condi tion that is captured and latched by the status register and then read (and cleared) by cpu firmware. system bus f0 f1 system bus a0/a1/alu d0/d1 a0/a1/alu system bus f1 a0/a1/alu f0 d0 system bus f1 a0 d1 a1 f0 tx/rx dual capture dual buffer routing channel 8-bit status register (read only) 8-bit control register (write/read) system bus
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 47 of 120 7.2.3.2 clock generation each subcomponent block of a udb including the two plds, the datapath, and status and control, has a clock selection and control block. this promotes a fine granularity with respect to allocating clocking resources to udb component blocks and allows unused udb resources to be used by other functions for maximum system efficiency. 7.3 udb array description figure 7-11 shows an example of a 16 udb array. in addition to the array core, there are a dsi ro uting interfaces at the top and bottom of the array. other interfac es that are not explicitly shown include the system inte rfaces for bus and cl ock distribu tion. the udb array includes multiple horizontal and vertical routing channels each comprised of 96 wires. the wire connections to udbs, at horizontal/vertical inte rsection and at the dsi interface are highly permutable providing ef ficient automatic routing in psoc creator. additionally the routing allows wire by wire segmentation along the vertical and horizontal routing to further increase routing flexibility and capability. figure 7-11. digital system interface structure 7.3.1 udb array programmable resources figure 7-12 shows an example of how functions are mapped into a bank of 16 udbs. the primary programmable resources of the udb are two plds, one datapath and one status/control register. these resources are allocated independently, because they have independently selectable clocks, and therefore unused blocks are allocated to ot her unrelated functions. an example of this is the 8-bit timer in the upper left corner of the array. this function only requires one datapath in the udb, and therefore the pld resources may be allocated to another function. a function such as a quadrature decoder may require more pld logic than one udb can supply and in this case can utilize the unused pld blocks in the 8-bit timer udb. programmable resources in the udb array are generally homogeneous so functions can be mapped to arbitrary boundaries in the array. figure 7-12. function mappin g example in a bank of udbs 7.4 dsi routing interface description the dsi routing interface is a c ontinuation of the horizontal and vertical routing channels at t he top and bottom of the udb array core. it provides general purpose programmable routing between device peripherals, including udbs, i/os, analog peripherals, interrupts, dma and fixed function peripherals. figure 7-13 illustrates the concept of the digital system interconnect, which connects t he udb array routing matrix with other device peripherals. any digital core or fixed function peripheral that needs programmable routing is connected to this interface. signals in this category include: ? interrupt requests from all digital peripherals in the system. ? dma requests from all digital peripherals in the system. ? digital peripheral data signals that need flexible routing to i/os. ? digital peripheral data signals that need connections to udbs. ? connections to the interrupt and dma controllers. ? connection to i/o pins. ? connection to analog system digital signals. udb udb hv b udb udb hv a udb udb hv b hv a udb udb hv a udb udb hv b udb udb hv a hv b hv b hv a hv b hv a hv a hv b hv a hv b udb udb udb udb system connections system connections udb udb hv b udb udb hv a udb udb hv b hv a udb hv a udb hv b udb hv a hv b udb udb udb udb udb udb uart logic 12-bit pwm i2c slave 8-bit spi 12-bit spi logic 8-bit timer 16-bit pyrs udb 8-bit timer quadrature decoder 16-bit pwm sequencer
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 48 of 120 figure 7-13. digital system interconnect interrupt and dma routing is very flexible in the cy8c32 programmable architecture. in addition to the numerous fixed function peripherals that can gen erate interrupt requests, any data signal in the udb array routing can also be used to generate a request. a single peripheral may generate multiple independent interrupt requests simplifying system and firmware design. figure 7-14 shows the structure of the idmux (interrupt/dma multiplexer). figure 7-14. interrupt and dma processing in the idmux 7.4.1 i/o port routing there are a total of 20 dsi routes to a typical 8-bit i/o port, 16 for data and four for drive strength control. when an i/o pin is connected to the routing, there are two primary connections available, an input and an output. in conjunction with drive strength c ontrol, this can implement a bidirectional i/o pin. a data output signal has the option to be single synchronized (pipelined) and a data input signal has the option to be double synchronized. the synchronization clock is the system clock (see figure 6-1 ). normally all inputs from pins are synchronized as this is requi red if the cpu interacts with the signal or any signal derived from it. asynchronous inputs have rare uses. an example of this is a feed through of combinational pld logic from input pins to output pins. figure 7-15. i/o pin synchronization routing figure 7-16. i/o pin output connectivity there are four more dsi connections to a given i/o port to implement dynamic output enab le control of pins. this connectivity gives a range of options, from fully ganged 8-bits controlled by one signal, to up to four individually controlled pins. the output enable signal is us eful for creating tri-state bidirectional pins and buses. figure 7-17. i/o pin output enable connectivity udb array digital system routing i/f digital system routing i/f timers counters interrupt controller i2c io port pins dma controller global clocks emif comparators del-sig global clocks i/o port pins dac dma termout (irqs) dma controller interrupt controller fixed function irqs edge detect edge detect irqs udb array fixed function drqs drqs interrupt and dma processing in idmux 0 1 2 3 0 1 2 do di port i pin 0 do pin1 do pin2 do pin3 do pin4 do pin5 do pin6 do pin7 do 8 io data output connections from the udb array digital system interface port i pin 0 oe pin1 oe pin2 oe pin3 oe pin4 oe pin5 oe pin6 oe pin7 oe 4 io control signal connections from udb array digital system interface
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 49 of 120 7.5 usb psoc includes a dedicated full-speed (12 mbps) usb 2.0 transceiver supporting all four usb transfer types: control, interrupt, bulk, and isochronous. psoc creator provides full configuration support. usb interfaces to hosts through two dedicated usbio pins, which are detailed in the ?i/o system and routing? section on page 34. usb includes the following features: ? eight unidirectional data endpoints ? one bidirectional control endpoint 0 (ep0) ? shared 512-byte buffer for the eight data endpoints ? dedicated 8-byte buffer for ep0 ? three memory modes ? manual memory management with no dma access ? manual memory management with manual dma access ? automatic memory management with automatic dma access ? internal 3.3 v regula tor for transceiver ? internal 48 mhz main oscillator mode that auto locks to usb bus clock, requiring no external crystal for usb (usb equipped parts only) ? interrupts on bus and each endpoint event, with device wakeup ? usb reset, suspend, and resume operations ? bus powered and self powered modes figure 7-18. usb 7.6 timers, counters, and pwms the timer/counter/pwm peripheral is a 16-bit dedicated peripheral providing three of the most common embedded peripheral features. as almost all embedded systems use some combination of timers, counters , and pwms. four of them have been included on this psoc device family. additional and more advanced functionality timers, counters, and pwms can also be instantiated in universal digital blocks (udbs) as required. psoc creator allows you to choose the timer, counter, and pwm features that they requ ire. the tool set utilizes the most optimal resources available. the timer/counter/pwm periphera l can select from multiple clock sources, with input and ou tput signals connected through the dsi routing. dsi routing allo ws input and output connections to any device pin and any internal digital signal accessible through the dsi. each of the four instances has a compare output, terminal count output ( optional complementary compare output), and programmable interrupt request line. the timer/counter/pwms are configurab le as free running, one shot, or enable input controlled. the peripheral has timer reset and capture inputs, and a kill input for control of the comparator outputs. the peripheral suppor ts full 16-bit capture. timer/counter/pwm features include: ? 16-bit timer/counter/pwm (down count only) ? selectable clock source ? pwm comparator (configurable for lt, lte, eq, gte, gt) ? period reload on start, reset, and terminal count ? interrupt on terminal count, compare true, or capture ? dynamic counter reads ? timer capture mode ? count while enable signal is asserted mode ? free run mode ? one shot mode (stop at end of period) ? complementary pwm outputs with deadband ? pwm output kill figure 7-19. timer/counter/pwm 7.7 i 2 c the i 2 c peripheral provides a synchronous two wire interface designed to interface the psoc device with a two wire i 2 c serial communication bus. the bus is compliant with philips ?the i 2 c specification? version 2.1. additional i 2 c interfaces can be instantiated using universal digital blocks (udbs) in psoc creator, as required. to eliminate the need for excessive cpu intervention and overhead, i 2 c specific support is provided for status detection and generation of framing bits. i 2 c operates as a slave, a master, or multimaster (slave and mast er). in slave mode, the unit always listens for a start condition to begin sending or receiving data. master mode supplies the ability to generate the start and stop conditions and initiate transactions. multimaster mode provides clock synchronization and arbitration to allow multiple masters on the same bus. if ma ster mode is enabled and slave mode is not enabled, the block does not generate interrupts on externally generated start conditions. i 2 c interfaces through the dsi routing and allows direct co nnections to any gpio or sio pins. s i e (serial interface engine) 48 mhz imo arbiter 512 x 8 sram usb i/o d+ d? interrupts system bus external 22 resistors timer / counter / pwm 16-bit clock reset enable capture kill irq compare tc / compare!
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 50 of 120 i 2 c provides hardware address detect of a 7-bit address without cpu intervention. additionally the device can wake from low-power modes on a 7-bit hardw are address match. if wakeup functionality is required, i 2 c pin connections are limited to the two special sets of sio pins. i 2 c features include: ? slave and master, transmitter, and receiver operation ? byte processing for low cpu overhead ? interrupt or polling cpu interface ? support for bus speeds up to 1 mbps (3.4 mbps in udbs) ? 7 or 10-bit addressing (10-bit addressing requires firmware support) ? smbus operation (through firmware support ? smbus supported in hardware in udbs) ? 7-bit hardware address compare ? wake from low-power modes on address match data transfers follow the format shown in figure 7-20 . after the start condition (s), a slave address is sent. this address is 7 bits long followed by an eighth bit which is a data direction bit (r/w) - a 'zero' indicates a transmission (write), a 'one' indicates a request for data (read). a data transfer is always terminated by a stop condition (p) generated by the master. however, if a master still wishes to communicate on the bus, it can generate a repeated start condition (sr) and address another slave without first generat ing a stop condition. various combinations of read/write formats are then possible within such a transfer. figure 7-20. i 2 c complete transfer timing sda scl 1 - 7 8 9 1 - 7 8 9 1 - 7 8 9 start condition address r/w ack data ack data ack stop condition
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 51 of 120 8. analog subsystem the analog programmable system creates application specific combinations of both standard and advanced analog signal processing blocks. these blocks are then interconnected to each other and also to any pin on the device, providing a high level of design flexibility and ip security. the features of the analog subsystem are ou tlined here to provide an overview of capabilities and architecture. ? flexible, configurable analog routin g architecture provided by analog globals, analog mux bus, and analog local buses. ? high resolution delta-sigma adc. ? one 8-bit dac that provides either voltage or current output. ? two comparators with optional connection to configurable lut outputs. ? capsense subsystem to enabl e capacitive touch sensing. ? precision reference for generating an accurate analog voltage for internal analog blocks. figure 8-1. analog subsystem block diagram the psoc creator software program provides a user friendly interf ace to configure the analog connections between the gpio and various analog resources and connections from one analog resource to another. psoc creator also provides component libraries th at allow you to configure the various analog blocks to perform applicat ion specific functions. the t ool also genera tes api interfa ce libraries that allow you to write firmw are that allows the communication betwe en the analog peripheral and cpu/memory. analog interface cmp cmp capsense subsystem dsi array clock distribution decimator config & status registers comparators gpio port gpio port delsig adc dac a n a l o g r o u t i n g a n a l o g r o u t i n g phub cpu precision reference
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 52 of 120 8.1 analog routing the cy8c32 family of devices has a flexible analog routing architecture that provides the capability to connect gpios and different analog blocks, and also route signals between different analog blocks. one of the strong points of this flexible routing architecture is that it allows dy namic routing of input and output connections to the di fferent analog blocks. for information on how to make pin selections for optimal analog routing, refer to the application note, an58304 - psoc? 3 and psoc? 5 - pin selection for analog designs. 8.1.1 features ? flexible, configurable anal og routing architecture ? 16 analog globals (ag) and two analog mux buses (amuxbus) to connect gpios and the analog blocks ? each gpio is connected to one analog global and one analog mux bus ? eight analog local buses (abus) to route signals between the different analog blocks ? multiplexers and switches for in put and output se lection of the analog blocks 8.1.2 functional description analog globals (ags) and analog mux buses (amuxbus) provide analog connectivity between gpios and the various analog blocks. there are 16 ags in the cy8c32 family. the analog routing architecture is di vided into four quadrants as shown in figure 8-2 . each quadrant has four analog globals (agl[0..3], agl[4..7], agr[0..3 ], agr[4..7]). each gpio is connected to the corresponding ag through an analog switch. the analog mux bus is a shared routing resource that connects to every gpio through an analog switch. there are two amuxbus routes in cy8c32, one in the left half (amuxbusl) and one in the right half (amuxbusr), as shown in figure 8-2 .
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 53 of 120 figure 8-2. cy8c32 analog interconnect vddio0 sio p12[3] sio p12[2] gpio p15[3] gpio p15[2] sio p12[1] sio p12[0] gpio p3[7] gpio p3[6] vddio3 vccd vssd vddd gpio p6[0] gpio p6[3] gpio p6[2] gpio p6[1] gpio p15[4] gpio p15[5] gpio p2[0] gpio p2[4] gpio p2[3] gpio p2[2] gpio p2[1] vddio2 gpio p2[5] gpio p2[7] gpio p2[6] sio p12[4] sio p12[5] gpio p6[4] gpio p6[5] gpio p6[6] gpio p6[7] vddio1 sio p12[6] sio p12[7] usb io p15[6] usb io p15[7] vddd vssd vccd gpxt p15[0] gpxt p15[1] gpio p3[5] gpio p3[4] gpio p3[3] gpio p3[2] gpio p3[1] agr[4] agr[7] agr[6] agr[5] agl[0] agl[3] agl[2] agl[1] agr[0] agr[3] agr[2] agr[1] *** * * * * * * * * * denotes pins on all packages dsm v0 i0 vidac 76543210 76543210 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 comp0 comp1 comparator agl[4] agl[7] agl[6] agl[5] agl[0] agl[3] agl[2] agl[1] agr[0] agr[3] agr[2] agr[1] agr[4] agr[7] agr[6] agr[5] notes: amuxbusr amuxbusl i0 rev #51 2-april-2010 vssa vssd vcca gpio p0[5] * gpio p0[7] * gpio p1[3] gpio p1[2] gpio p1[1] gpio p1[0] * * * * gpio p1[4] * gpio p1[5] * gpio p1[6] * gpio p1[7] * gpio p5[7] gpio p5[6] gpio p5[5] gpio p5[4] gpio p4[4] gpio p4[7] gpio p4[6] gpio p4[5] gpio p5[2] gpio p5[3] gpio p5[1] gpio p5[0] gpio p4[3] gpio p4[2] abusl0 * * ** * * * * * * * * * * * agl[4] agl[7] agl[6] agl[5] gpio p4[0] gpio p4[1] vssa amuxbusl amuxbusr amuxbusl amuxbusr amuxbusl amuxbusr abusl1 abusl2 abusl3 abusr3 abusr2 abusr1 abusr0 exvrefl exvrefr ind vssb vboost xres vssd * * * * vbat exvrefr exvrefl 90 36 28 13 44 + - qtz_ref refs gpio p3[0] gpio p0[6] * lpf in0 out0 in1 out1 5 mux group switch group connection large ( ~200 ohms) small ( ~870 ohms ) switch resistance vss ref ts adc gpio p0[0] * gpio p0[1] * gpio p0[2] * gpio p0[3] * gpio p0[4] * amuxbusr amuxbusl analog globals analog bus 0123 3210 analog bus analog globals refbufr refbufl in out ref in out ref vssa capsense vssa exvrefl1 exvrefl2 cmp0_vref (1.024v) vref_cmp1 (0.256v) vdda refbuf_vref1 (1.024v) refbuf_vref2 (1.2v) dsm0_vcm_vref1 (0.8v) dsm0_qtz_vref2 (1.2v) 3210 0123 lcd signals are not shown. * : vdda * vbe vref_vss_ext en_resvda en_resvpwra dsm0_vcm_vref2 (0.7v) vcmsel[1:0] vpwra vpwra/2 vdda vdda/4 refmux[2:0] dsm0_qtz_vref1 (1.024v) vcm dac0 dsm0 + - + - cmp_muxvn[1:0] vdda/2 bg_vda_swabusl0 cmp1_vref cmp1_vref cmp1_vref refsel[1:0] refbufl_ cmp refbufr_ cmp cmp0_vref (1.024v) bg_vda_res_en refbuf_vref1 (1.024v) refbuf_vref2 (1.2v) refsel[1:0] swout swin swout swin swinn swinp lpf
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 54 of 120 analog local buses (abus) are routing resources located within the analog subsystem and are used to route signals between different analog blocks. there are eight abus routes in cy8c32, four in the left half (abusl [0:3]) and four in the right half (abusr [0:3]) as shown in figure 8-2 . using the abus saves the analog globals and analog mux buses from being used for interconnecting the analog blocks. multiplexers and switches exist on the various buses to direct signals into and out of the analog blocks. a multiplexer can have only one connection on at a time, whereas a switch can have multiple connections on simultaneously. in figure 8-2 , multiplexers are indicated by grayed ovals and switches are indicated by transparent ovals. 8.2 delta-sigma adc the cy8c32 device contains one delta-sigma adc. this adc offers differential input, high resolution and excellent linearity, making it a good adc choice for measurement applications. the converter can be configured to output 12-bit resolution at data rates of up to 192 ksps. at a fi xed clock rate, resolution can be traded for faster data rates as shown in ta b l e 8 - 1 and figure 8-3 . figure 8-3. delta-sigma adc samp le rates, range = 1.024 v 8.2.1 functional description the adc connects and configures three basic components, input buffer, delta-sigma modulator, and decimator. the basic block diagram is shown in figure 8-4 . the signal from the input muxes is delivered to the delta-sig ma modulator either directly or through the input buffer. the delta-sigma modulator performs the actual analog to digital conversion. the modulator over-samples the input and generates a serial data stream output. this high speed data stream is not useful for most applications without some type of post processing, and so is passed to the decimator through the analog interface block. the decimator converts the high speed serial data stream into parallel adc results. the modulator/decimator frequency response is [(sin x)/x] 4 ; a typical frequency response is shown in figure 8-5 . figure 8-4. delta-sigma adc block diagram figure 8-5. delta-sigma adc frequency response, normalized to output, sample rate = 48 khz resolution and sample rate are controlled by the decimator. data is pipelined in the decimator; the output is a function of the last four samples. when the i nput multiplexer is switched, the output data is not valid until af ter the fourth sample after the switch. 8.2.2 operational modes the adc can be configured by the us er to operate in one of four modes: single sample, multi sample, continous, or multi sample (turbo). all four modes are started by either a write to the start bit in a control register or an assertion of the start of conversion (soc) signal. when the conversion is complete, a status bit is set and the output signal end of conversion (eoc) asserts high and remains high until the value is read by either the dma controller or the cpu. table 8-1. delta-sigma adc performance bits maximum sample rate (sps) sinad (db) 12 192 k 66 8 384 k 43 resolution, bits 100 1, 000 10, 000 100, 000 1,000,000 7 8 9 10 11 12 13 continuous mu l t i - sample sample rates, sps delta sigma modulator decimator 12 to 20 bit result eoc soc positive input mux negative input mux (analog routing) input buffer frequency response. db -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 100 1,000 10,000 100,000 1,000,000 input frequency, hz input frequency, hz
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 55 of 120 8.2.2.1 single sample in single sample mode, the adc performs one sample conversion on a trigger. in this mode, the adc stays in standby state waiting for the soc signal to be asserted. when soc is signaled the adc performs four successive conversions. the first three conversions prime the decimator. the adc result is valid and available after the fourth conversion, at which time the eoc signal is generated. to detect the end of conversion, the system may poll a control register for status or configure the external eoc signal to generate an interrupt or invoke a dma request. when the transfer is done the adc reenters the standby state where it stays until another soc event. 8.2.2.2 continuous continuous sample mode is us ed to take multiple successive samples of a single input signal. multiplexing multiple inputs should not be done with this mode. there is a latency of three conversion times before the first conversion result is available. this is the time required to prime the decimator. after the first result, successive conversions are available at the selected sample rate. 8.2.2.3 multi sample multi sample mode is similar to continuous mode except that the adc is reset between samples. this mode is useful when the input is switched between multiple signals. the decimator is re-primed between each sample so that previous samples do not affect the current conversion. upon completion of a sample, the next sample is auto matically initiated. the results can be transferred using either firmware polling, interrupt, or dma. more information on output formats is provided in the technical reference manual. 8.2.3 start of conversion input the soc signal is used to start an adc conversion. a digital clock or udb output can be used to drive this input. it can be used when the sampling period must be longer than the adc conversion time or when the adc must be synchronized to other hardware. this signal is optional and does not need to be connected if adc is running in a continuous mode. 8.2.4 end of conversion output the eoc signal goes high at the end of each adc conversion. this signal may be used to trigger either an interrupt or dma request. 8.3 comparators the cy8c32 family of devices contains two comparators in a device. comparators have these features: ? input offset factory trimmed to less than 5 mv ? rail-to-rail common mode input range (v ssa to v dda ) ? speed and power can be traded off by using one of three modes: fast, slow, or ultra low-power ? comparator outputs can be routed to lookup tables to perform simple logic functions and then can also be routed to digital blocks ? the positive input of the comp arators may be optionally passed through a low pass filter. two filters are provided ? comparator inputs can be connections to gpio or dac output 8.3.1 input and output interface the positive and negative inputs to the comparators come from the analog global buses, the analog mux line, the analog local bus and precision reference through multiplexers. the output from each comparator could be routed to any of the two input luts. the output of that lut is routed to the udb digital system interface.
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 56 of 120 figure 8-6. analog comparator 8.3.2 lut the cy8c32 family of devices contains four luts. the lut is a two input, one output lookup table that is driven by any one or two of the comparators in the chip. the output of any lut is routed to the digital system interface of the udb array. from the digital system interface of the udb array, these signals can be connected to udbs, dma contro ller, i/o, or the interrupt controller. the lut control word written to a register sets the logic function on the output. the available lu t functions and the associated control word is shown in ta b l e 8 - 2 . anaif + _ + _ comp0 comp1 4 lut0 lut1 lut2 lut3 4 4 4 4 4 4 4 from analog routing from analog routing udbs table 8-2. lut function vs. program word and inputs control word output (a and b are lut inputs) 0000b false (?0?) 0001b a and b 0010b a and (not b ) 0011b a 0100b (not a ) and b 0101b b 0110b a xor b 0111b a or b 1000b a nor b 1001b a xnor b 1010b not b 1011b a or (not b ) 1100b not a 1101b (not a ) or b 1110b a nand b 1111b true (?1?)
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 57 of 120 8.4 lcd direct drive the psoc liquid crystal display (lcd) driver system is a highly configurable peripheral designed to allow psoc to directly drive a broad range of lcd glass. all voltages are generated on chip, eliminating the need for external components. with a high multiplex ratio of up to 1/16, the cy8c32 family lcd driver system can drive a maximum of 736 segments. the psoc lcd driver module was also designed with the conservative power budget of portable devices in mind, enabling different lcd drive modes and power down modes to conserve power. psoc creator provides an lcd segment drive component. the component wizard provides easy and flexible configuration of lcd resources. you can specify pins for segments and commons along with other options. the software configures the device to meet the required specifications. this is possible because of the programmabilit y inherent to psoc devices. key features of the psoc lcd segment system are: ? lcd panel direct driving ? type a (standard) and type b (low-power) waveform support ? wide operating voltage range support (2 v to 5 v) for lcd panels ? static, 1/2, 1/3, 1/4, 1/5 bias voltage levels ? internal bias voltage generation through internal resistor ladder ? up to 62 total common and segment outputs ? up to 1/16 multiplex for a maximum of 16 backplane/common outputs ? up to 62 front plane/segment outputs for direct drive ? drives up to 736 total segments (16 backplane 46 front plane) ? up to 64 levels of software controlled contrast ? ability to move display data from memory buffer to lcd driver through dma (without cpu intervention) ? adjustable lcd refresh rate from 10 hz to 150 hz ? ability to invert lcd display for negative image ? three lcd driver drive modes, allowing power optimization figure 8-7. lcd system 8.4.1 lcd segment pin driver each gpio pin contains an lcd driver circuit. the lcd driver buffers the appropriate output of the lcd dac to directly drive the glass of the lcd. a register setting determines whether the pin is a common or segment. the pin?s lcd driver then selects one of the six bias voltages to drive the i/o pin, as appropriate for the display data. 8.4.2 display data flow the lcd segment driver syst em reads display data and generates the proper output voltages to the lcd glass to produce the desired image. display data resides in a memory buffer in the system sram. each time you need to change the common and segment driver voltages, the next set of pixel data moves from the memory buffer into the port data registers via dma. 8.4.3 udb and lcd segment control a udb is configured to generate the global lcd control signals and clocking. this set of signals is routed to each lcd pin driver through a set of dedicated lcd global routing channels. in addition to generating the global lcd control signals, the udb also produces a dma request to initiate the transfer of the next frame of lcd data. 8.4.4 lcd dac the lcd dac generates the cont rast control and bias voltage for the lcd system. the lcd dac produces up to five lcd drive voltages plus ground, based on the selected bias ratio. the bias voltages are driven out to gpio pins on a dedicated lcd bias bus, as required. 8.5 capsense the capsense system provides a versatile and efficient means for measuring capacitance in applications such as touch sense buttons, sliders, proximity det ection, etc. the capsense system uses a configuration of system resources, including a few hardware functions primarily targeted for capsense. specific resource usage is detailed in each capsense component in psoc creator. a capacitive sensing method using a delta-sigma modulator (csd) is used. it provides capacitance sensing using a switched capacitor technique with a delta-sigma modulator to convert the sensing current to a digital code. 8.6 temp sensor die temperature is used to establish programming parameters for writing flash. die temperatur e is measured using a dedicated sensor based on a forward biased transistor. the temperature sensor has its own auxiliary adc. lcd driver block udb dma display ram lcd dac pin global clock phub
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 58 of 120 8.7 dac the cy8c32 parts contain a digital to analog converter (dac). the dac is 8-bit and can be configured for either voltage or current output. the dac supports capsense, power supply regulation, and waveform generation. the dac has the following features: ? adjustable voltage or current output in 255 steps ? programmable step size (range selection) ? eight bits of calibration to correct 25 percent of gain error ? source and sink option for current output ? 8 msps conversion rate for current output ? 1 msps conversion rate for voltage output ? monotonic in nature ? data and strobe inputs can be provided by the cpu or dma, or routed directly from the dsi ? dedicated low-resistance output pin for high-current mode figure 8-8. dac block diagram 8.7.1 current dac the current dac (idac) can be configured for the ranges 0 to 32 a, 0 to 256 a, and 0 to 2.048 ma. the idac can be configured to source or sink current. 8.7.2 voltage dac for the voltage dac (vdac), t he current dac output is routed through resistors. the two ranges available for the vdac are 0 to 1.024 v and 0 to 4.096 v. in voltage mode any load connected to the output of a dac should be purely capacitive (the output of the vdac is not buffered). reference ? source ? scaler ? i source ? range ? 1x , ? 8x , ? 64x i sink ? range ???? 1x , ? 8x , ? 64x ? r ? ? 3r ? ? vout ? ? iout ? ?
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 59 of 120 9. programming, debug interfaces, resources psoc devices include extensive support for programming, testing, debugging, and tracing both hardware and firmware. three interfaces are available: jtag, swd, and swv. jtag and swd support all programming and debug features of the device. jtag also supports standard jtag scan chains for board level test and chaining multiple jtag devices to a single jtag connection. for more information on psoc 3 programming, refer to the application note an62391 - in-system programming for psoc ? 3 . complete debug on chip (doc) functionality enables full device debugging in the final system using the standard production device. it does not require special interfaces, debugging pods, simulators, or emulators. only the standard programming connections are required to fully support debug. the psoc creator ide software provides fully integrated programming and debug support for psoc devices. the low cost miniprog3 programmer and debugger is designed to provide full programming and debug support of psoc devices in conjunction with the psoc creator ide. psoc jtag, swd, and swv interfaces are fully compatible with industry standard third party tools. all doc circuits are disabled by default and can only be enabled in firmware. if not enabled, the only way to reenable them is to erase the entire device, clear flas h protection, and reprogram the device with new firmware that enables doc. disabling doc features, robust flash protection, and hiding custom analog and digital functionality inside the psoc device provide a level of security not possible with multichip application solutions. additionally, all device interfaces can be permanently disabled (device security) for applications concerned about phishing attacks due to a maliciously re programmed device. permanently disabling interfaces is not recommended in most applications because you cannot access the device later. because all programming, debug, and test interfaces are disabled when device security is enabled, psocs with device security enabled may not be returned for failure analysis. 9.1 jtag interface the ieee 1149.1 compliant jtag interface exists on four or five pins (the ntrst pin is optional). the jtag clock frequency can be up to 8 mhz, or 1/3 of the cpu clock frequency for 8 and 16-bit transfers, or 1/5 of the cpu clock frequency for 32-bit transfers, whichever is least. by default, the jtag pins are enabled on new devices but the jtag interface can be disabled, allowing these pins to be used as general purpose i/o (gpio) instead. the jtag interface is used for programming the flash memory, debugging, i/o scan chains, and jtag device chaining. table 9-1. debug configurations debug and trace configuration gpio pins used all debug and trace disabled 0 jtag 4 or 5 swd 2 swv 1 swd + swv 3
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 60 of 120 figure 9-1. jtag interface connections between psoc 3 and programmer tck ? (p1[1] tms ? (p1[0]) ?? 5 gnd gnd tck tms ?? 5 xres host programmer psoc 3 tdo tdi (p1[4]) tdi tdo (p1[3]) ntrst ? 6 ntrst (p1[5]) 6 1 the voltage levels of host programmer and the psoc 3 voltage domains involved in programming should be same. the port 1 jtag pins, xres pin (xres_n or p1[2]) are powered by v ddio1 . so, v ddio1 of psoc 3 should be at same voltage level as host v dd . rest of psoc 3 voltage domains ( ? v ddd , ? v dda , ? v ddio0 , ? v ddio2 , ? v ddio3 ) need not be at the same voltage level as host programmer. 2 vdda must be greater than or equal to all other power supplies (vddd, vddio?s) in psoc 3. 3 for power cycle mode programming, xres pin is no t required. but the host programmer must have the capability to toggle power (vddd, vdda, all vddio?s) to psoc 3. this may typically require external interface circuitry to toggle power which will depend on the programming setup. the power supplies can be brought up in any sequence, ho wever, once stable, vdda must be greater than or equal to all other supplies. 4 for jtag programming, device reset c an also be done without co nnecting to the xres pin or power cycle mode by using the tms,tck,tdi, tdo pins of psoc 3, and writing to a specific register. but this requires that the dps setting in nvl is not equal to ?debug ports disabled?. 5 by default, psoc 3 is configured for 4-wire jtag mode unless user changes the dps setting. so the tms pin is unidirectional. but if the dps setting is changed to non-jtag mode, the tms pin in jtag is bi-directional as the swd protocol has to be used for acquiring the psoc 3 device initially. after switching from swd to jtag mode, the tms pin will be uni-directional. in such a case, unidirectional buffer should not be used on tms line. 6 ntrst jtag pin (p1[5]) cannot be used to reset the jtag tap controlller during first time programming of psoc 3 as the default setting is 4-wire jtag (ntrst disabled). use the tms, tck pins to do a reset of jtag tap controller. 7 if xres pin is used by host, p1[2] will be configured as xres by default only for 48-pin devices (without dedicated xres pin). for devices with dedicated xres pin, p1[2] is gpio pin by default. so use p1[2] as reset pin only for 48-pin devices, but use dedicate d xres pin for rest of devices. v ddd , ? v dda , ? v ddio0 , ? v ddio1 , ? v ddio2 , ? v ddio3 1, 2, 3, 4 v ssd , ? v ssa xres ? or ? p1[2] ? 4, ? 7 v dd v dd
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 61 of 120 9.2 serial wire debug interface the swd interface is the prefe rred alternative to the jtag interface. it requires only two pins instead of the four or five needed by jtag. swd provides all of the programming and debugging features of jtag at the same speed. swd does not provide access to scan chains or device chaining. the swd clock frequency can be up to 1/3 of the cpu clock frequency. swd uses two pins, either two of the jtag pins (tms and tck) or the usbio d+ and d? pins. the usbio pins are useful for in system programming of usb so lutions that would otherwise require a separate programming connector. one pin is used for the data clock and the other is used for data input and output. swd can be enabled on only one of the pin pairs at a time. this only happens if, within 8 s (key window) after reset, that pin pair (jtag or usb) receives a predetermined sequence of 1s and 0s. swd is used for debugging or programming the flash memory. the swd interface can be enabled from the jtag interface or disabled, allowing its pins to be used as gpio. unlike jtag, the swd interface can always be reacquired on any device during the key window. it can then be used to reenable the jtag interface, if desired. when using swd or jtag pins as standard gpio, make sure that the gpio functionality and pcb circuits do not interfere with swd or jtag use. figure 9-2. swd interface connections between psoc 3 and programmer v ssd , ? v ssa v ddd , ? v dda , ? v ddio0 , ? v ddio1 , ? v ddio2 , ? v ddio3 1, 2, 3 swdck ? (p1[1] ? or ? p15[7]) swdio ? (p1[0] ? or ? p15[6]) xres ? or ? p1[2] ?? 3, ? 4 gnd gnd swdck swdio xres host programmer psoc 3 v dd 1 the voltage levels of the host programmer and the psoc 3 voltage domains involved in programming should be the same. xres pin (xres_n or p1[2]) is powered by v ddio1 . the usb swd pins are powered by v ddd . so for programming using the usb swd pins with xres pin, the v ddd , v ddio1 ? of psoc 3 should be at the same voltage level as host v dd . rest of psoc 3 voltage domains ( ? v dda , ? v ddio0 , ?? ???? v ddio2 , ? v ddio3 ) need not be at the same voltage level as host programmer. the port 1 swd pins are powered by v ddio1 . so v ddio1 of psoc 3 should be at same voltage level as host v dd for port 1 swd programming. rest of psoc 3 voltage domains ( ? v ddd , ?? v dda , ? v ddio0 , ? v ddio2 , ? v ddio3 ) need not be at the same voltage level as host programmer. 2 vdda must be greater than or equal to all other power supplies (vddd, vddio?s) in psoc 3. 3 for power cycle mode programming, xres pin is not required. but the host programmer must have the capability to toggle power (vddd, vdda, all vddio?s) to psoc 3. this may typically require external interface circuitry to toggle power which will depend on the programming setup. the power supplies can be brought up in any sequence, however, once stable, vdda must be greater than or equal to all other supplies. 4 p1[2] will be configured as xres by default only for 48-pin devices (without dedicated xres pin). for devices with dedicated xres pin, p1[2] is gpio pin by default. so use p1[2] as reset pin only for 48- pin devices, but use dedicated xres pin for rest of devices. v dd
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 62 of 120 9.3 debug features using the jtag or swd interface, the cy8c32 supports the following debug features: ? halt and single-step the cpu ? view and change cpu and peri pheral registers, and ram addresses ? eight program address breakpoints ? one memory access breakpoint?break on reading or writing any memory address and data value ? break on a sequence of breakpoints (non recursive) ? debugging at the full speed of the cpu ? debug operations are possible while the device is reset, or in low-power modes ? compatible with psoc creator and miniprog3 programmer and debugger ? standard jtag programming and debugging interfaces make cy8c32 compatible with other popular third-party tools (for example, arm / keil) 9.4 trace features the cy8c32 supports the following trace features when using jtag or swd: ? trace the 8051 program counter (pc), accumulator register (acc), and one sfr / 8051 core ram register ? trace depth up to 1000 instructions if all registers are traced, or 2000 instructions if only th e pc is traced (on devices that include trace memory) ? program address trigger to start tracing ? trace windowing, that is, only trace when the pc is within a given range ? two modes for handling trace buffer full: continuous (overwriting the oldest trace data) or break when trace buffer is full 9.5 single wire viewer interface the swv interface is closely associated with swd but can also be used independently. swv data is output on the jtag interface?s tdo pin. if using sw v, you must configure the device for swd, not jtag. swv is not supported with the jtag interface. swv is ideal for application debug where it is helpful for the firmware to output data similar to 'printf' debugging on pcs. the swv is ideal for data monitoring, because it requires only a single pin and can output data in standard uart format or manchester encoded format. for example, it can be used to tune a pid control loop in which the output and graphing of the three error terms greatly simplifies coefficient tuning. the following features are supported in swv: ? 32 virtual channels, each 32 bits long ? simple, efficient packing and serializing protocol ? supports standard uart format (n81) 9.6 programming features the jtag and swd interfaces provide full programming support. the entire device can be erased, programmed, and verified. you can increase flash protection levels to protect firmware ip. flash protection can only be reset after a full device erase. individual flash blocks can be erased, programmed, and verified, if block security settings permit. 9.7 device security psoc 3 offers an advanced security feature called device security, which permanently disables all test, programming, and debug ports, protecting your application from external access. the device security is activate d by programming a 32-bit key (050536f43) to a write once latch (wol). the write once latch is a type of nonvolatile latch (nvl). the cell itself is an nvl with additional logic wrapped around it. each wol device contains four bytes (32 bits) of data. the wrapper outputs a ?1? if a super-majority (28 of 32) of its bits match a pre-determined pattern (050536f43) ; it outputs a ?0? if this majority is not reached. when the output is 1, the write once nv latch locks the part out of debug and test modes; it also permanently gates off the ability to erase or alter the contents of the latch. matching all bits is in tentionally not r equired, so that single (or few) bit failures do not deassert the wol output. the state of the nvl bits after wafer processing is truly random with no tendency toward 1 or 0. the wol only locks the part af ter the correct 32-bit key (050536f43) is loaded into the nvl's volatile memory, programmed into the nvl's nonvolat ile cells, and the part is reset. the output of the wol is only sampled on reset and used to disable the access. this pr ecaution prevents anyone from reading, erasing, or altering the contents of the internal memory. the user can write the key into the wol to lock out external access only if no flash protection is set (see ?flash security? on page 22). however, after setting the values in the wol, a user still has access to the part until it is rese t. therefore, a user can write the key into the wol, pr ogram the flash protection data, and then reset the part to lock it. if the device is protected with a wol setting, cypress cannot perform failure analysis and, th erefore, cannot accept rmas from customers. the wol can be read out via swd port to electrically identify protected part s. the user can write the key in wol to lock out external access only if no flash protection is set. for more information on how to take full advantage of the security features in psoc see the psoc 3 trm. disclaimer note the following details of the fl ash code protection features on cypress devices. cypress products meet the specifications contained in their particular cypress datasheets. cypress believes that its family of products is one of the most secure families of its kind on the market today, regardless of how they are used. there may be methods, unknown to cypress, that can breach the code protection features. an y of these methods, to our knowledge, would be dishonest and possibly illegal. neither cypress nor any other semiconductor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? cypress is willing to work with the customer who is concerned about the integrity of their code. code protection is constantly evolving. we at cypress are committed to continuously improving the code protecti on features of our products.
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 63 of 120 10. development support the cy8c32 family has a rich set of documentation, development tools, and online resources to assist you during your development process. visit psoc.cypress.com/ getting-started to find out more. 10.1 documentation a suite of documentation, suppor ts the cy8c32 family to ensure that you can find answers to your questions quickly. this section contains a list of some of the key documents. software user guide : a step-by-step guide for using psoc creator. the software user guide shows you how the psoc creator build process works in detail, how to use source control with psoc creator, and much more. component datasheets : the flexibility of psoc allows the creation of new peripherals (components) long after the device has gone into production. component datasheets provide all of the information needed to select and use a particular component, including a functional description, api documentation, example code, and ac/dc specifications. application notes : psoc application notes discuss a particular application of psoc in depth; examples include brushless dc motor control and on-chip filtering. application notes often include example projects in addition to the application note document. technical reference manual : the technical reference manual (trm) contains all the technical detail you need to use a psoc device, including a co mplete description of all psoc registers. 10.2 online in addition to print documentation, the cypress psoc forums connect you with fellow psoc user s and experts in psoc from around the world, 24 hours a day, 7 days a week. 10.3 tools with industry standard cores, programming, and debugging interfaces, the cy8c32 family is part of a development tool ecosystem. visit us at www.cypress.com/go/psoccreator for the latest information on the revolutionary, easy to use psoc creator ide, supported third party compilers, programmers, debuggers, and development kits.
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 64 of 120 11. electrical specifications specifications are valid for ?40 c t a 85 c and t j 100 c, except where noted. specificat ions are valid for 1.71 v to 5.5 v, except where noted. the unique flexibility of the psoc udbs and analog blocks enable many functions to be implemented in psoc creator components, see the component datasheets for full ac /dc specifications of indi vidual functions. see the ?example peripherals? section on page 41 for further expl anation of psoc creator components. 11.1 absolute maximum ratings note usage above the absolute maximum conditions listed in ta b l e 11 - 1 may cause permanent damage to the device. exposure to maximum conditions for extended periods of time may affect de vice reliability. when used below maximum conditions but above normal operating conditions the device may not operate to specification. table 11-1. absolute maximum ratings dc specifications parameter description conditions min typ max units t stg storage temperature higher storage temperatures reduce nvl data retention time. recommended storage temper- ature is +25 c 25 c. extended duration storage temperatures above 85 c degrade reliability. ?55 25 100 c v dda analog supply voltage relative to v ssa ?0.5 ? 6 v v ddd digital supply voltage relative to v ssd ?0.5 ? 6 v v ddio i/o supply voltage relative to v ssd ?0.5 ? 6 v v cca direct analog core voltage input ?0.5 ? 1.95 v v ccd direct digital core voltage input ?0.5 ? 1.95 v v ssa analog ground voltage v ssd ?0.5 ? v ssd + 0.5 v v gpio [14] dc input voltage on gpio includes signals sourced by v dda and routed internal to the pin v ssd ?0.5 ? v ddio + 0.5 v v sio dc input voltage on sio output disabled v ssd ?0.5 ? 7 v output enabled v ssd ?0.5 ? 6 v v ind voltage at boost converter input 0.5 ? 5.5 v v bat boost converter supply v ssd ?0.5 ? 5.5 v ivddio current per v ddio supply pin ? ? 100 ma vextref adc external reference inputs pins p0[3], p3[2] ? ? 2 v lu latch up current [15] ?140 ? 140 ma esd hbm electrostatic discharge voltage human body model 750 ? ? v esd cdm electrostatic discharge voltage charge device model 500 ? ? v notes 14. the v ddio supply voltage must be greater than the maximum analog voltage on the associated gpio pins. maximum analog voltage on gpio pin v ddio v dda . 15. meets or exceeds jedec spec eia/jesd78 ic latch-up test.
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 65 of 120 11.2 device level specifications specifications are valid for ?40 c t a 85 c and t j 100 c, except where noted. specificat ions are valid for 1.71 v to 5.5 v, except where noted. 11.2.1 device level specifications table 11-2. dc specifications parameter description conditions min typ max units v dda analog supply voltage and input to analog core regulator analog core regulator enabled 1.8 ? 5.5 v v dda analog supply voltage, analog regulator bypassed analog core regulator disabled 1.71 1.8 1.89 v v ddd digital supply voltage relative to v ssd digital core regulator enabled 1.8 ? v dda [16] v v ddd digital supply voltage, digital regulator bypassed digital core regulator disabled 1.71 1.8 1.89 v v ddio [17] i/io supply voltage relative to v ssio 1.71 ? v dda [16] v v cca direct analog core voltage input (analog regulator bypass) analog core regulator disabled 1.71 1.8 1.89 v v ccd direct digital core voltage input (digital regulator bypass) digital core regulator disabled 1.71 1.8 1.89 v i dd [18] active mode, v dd = 1.71 v?5.5 v bus clock off. execute from cpu instruction buffer. see ?flash program memory? on page 22. cpu at 3 mhz t = ?40 c ? ? ? ma t = 25 c ? 0.8 ? ma t = 85 c ? ? ? ma cpu at 6 mhz t = ?40 c ? ? ? ma t = 25 c ? 1.2 ? ma t = 85 c ? ? ? ma cpu at 12 mhz t = ?40 c ? ? ? ma t = 25 c ? 2.0 ? ma t = 85 c ? ? ? ma cpu at 24 mhz t = ?40 c ? ? ? ma t = 25 c ? 3.5 ? ma t = 85 c ? ? ? ma cpu at 48 mhz t = ?40 c ? ? ? ma t = 25 c ? 6.6 ? ma t = 85 c ? ? ? ma v dd = 3.3 v, t = 25 c, imo and bus clock enabled, ilo = 1 khz, cpu executing from flash and accessing sram, all other blocks off, all i/os tied low. cpu at 3 mhz ? 1.4 ? ma cpu at 6 mhz ? 2.2 ? ma cpu at 12 mhz ? 3.6 ? ma cpu at 24 mhz ? 6.4 ? ma cpu at 48 mhz ? 11.8 ? ma notes 16. the power supplies can be brought up in any sequence however once stable v dda must be greater than or equal to all other supplies. 17. the v ddio supply voltage must be greater than the maximum analog voltage on the associated gpio pins. maximum analog voltage on gpio pin v ddio v dda . 18. the current consumption of additional peripherals that are im plemented only in programmed logic blocks can be found in their respective datasheets, available in psoc creator, the integrated design environm ent. to estimate total current, find cpu cu rrent at frequency of interest and add p eripheral currents for your particular system from the device datasheet and component datasheets.
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 66 of 120 sleep mode [20] cpu = off rtc = on (= eco32k on, in low-power mode) sleep timer = on (= ilo on at 1khz) [21] wdt = off i 2 c wake = off comparator = off por = on boost = off sio pins in single ended input, unregulated output mode v dd = v ddio = 4.5?5.5 v t = ?40 c ? ? ? a t = 25 c ? ? ? a t = 85 c ? ? ? a v dd = v ddio = 2.7?3.6 v t = ?40 c ? ? ? a t = 25 c ? 1 ? a t = 85 c ? ? ? a v dd = v ddio = 1.71?1.95 v t = ?40 c ? ? ? a t = 25 c ? ? ? a t = 85 c ? ? ? a comparator = on cpu = off rtc = off sleep timer = off wdt = off i2c wake = off por = on boost = off sio pins in single ended input, unregulated output mode v dd = v ddio = 2.7?3.6v t = 25 c ? ? ? a i2c wake = on cpu = off rtc = off sleep timer = off wdt = off comparator = off por = on boost = off sio pins in single ended input, unregulated output mode v dd = v ddio = 2.7?3.6v t= 25 c ? ? ? a hibernate mode [20] hibernate mode current all regulators and oscillators off. sram retention gpio interrupts are active boost = off sio pins in single ended input, unregulated output mode v dd = v ddio = 4.5?5.5 v t = ?40 c ? ? ? na t = 25 c ? ? ? na t = 85 c ? ? ? na v dd = v ddio = 2.7?3.6 v t = ?40 c ? ? ? na t = 25 c ? 200 ? na t = 85 c ? ? ? na v dd = v ddio = 1.71?1.95 v t = ?40 c ? ? ? na t = 25 c ? ? ? na t = 85 c ? ? ? na table 11-2. dc specifications (continued) parameter description conditions min typ max units notes 19. the current consumption of additional per ipherals that are implemented only in programmed logic blocks can be found in their respective datasheets, available in psoc creator, the integrated design environm ent. to compute total current, find cpu curr ent at frequency of interest and add pe ripheral currents for your particular system from the device datas heet and component datasheets. 20. if v ccd and v cca are externally regulated, t he voltage difference between v ccd and v cca must be less than 50 mv. 21. sleep timer generates periodic interrupts to wake up the cpu. this specification applies only to those times that the cpu is off.
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 67 of 120 figure 11-1. active mode current vs f cpu , v dd = 3.3 v, temperature = 25 c figure 11-2. active mode current vs temperature and f cpu , v dd = 3.3 v figure 11-3. active mode current vs v dd and temperature, f cpu = 24 mhz
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 68 of 120 figure 11-4. f cpu vs. v dd table 11-3. ac specifications [22] parameter description conditions min typ max units f cpu cpu frequency 1.71 v v ddd 5.5 v dc ? 50.01 mhz f busclk bus frequency 1.71 v v ddd 5.5 v dc ? 50.01 mhz svdd v dd ramp rate ? ? 1 v/ns t io_init time from v ddd /v dda /v ccd /v cca ipor to i/o ports set to their reset states ??10s t startup time from v ddd /v dda /v ccd /v cca pres to cpu executing code at reset vector v cca /v ccd = regulated from v dda /v ddd , no pll used, imo boot mode (12 mhz typ.) ??66s t sleep wakeup from sleep mode ? application of non-lvd interrupt to beginning of execution of next cpu instruction ??15s t hibernate wakeup from hibernate mode ? application of external interrupt to beginning of execution of next cpu instruction ? ? 100 s note 22. based on device characterization (not production tested). 5.5 v 1.71 v 0.5 v 0 v dc 1 mhz 10 mhz 50 mhz 3.3 v valid operating region valid operating region with smp cpu frequency vdd voltage
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 69 of 120 11.3 power regulators specifications are valid for ?40 c t a 85 c and t j 100 c, except where noted. specificat ions are valid for 1.71 v to 5.5 v, except where noted. 11.3.1 digital core regulator figure 11-5. regulators v cc vs v dd figure 11-6. digital regulator psrr vs frequency and v dd 11.3.2 analog core regulator figure 11-7. analog regulator psrr vs frequency and v dd table 11-4. digital core regulator dc specifications parameter description conditions min typ max units v ddd input voltage 1.8 ? 5.5 v v ccd output voltage ? 1.80 ? v regulator output capacitor 10%, x5r ceramic or better. the two v ccd pins must be shorted together, with as short a trace as possible, see power system on page 29 ?1?f table 11-5. analog core regulator dc specifications parameter description conditions min typ max units v dda input voltage 1.8 ? 5.5 v v cca output voltage ? 1.80 ? v regulator output capacitor 10%, x5r ceramic or better ? 1 ? f
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 70 of 120 11.3.3 inductive boost regulator. table 11-6. inductive boost regulator dc specifications unless otherwise specified, ope rating conditions are: v bat = 2.4 v, v out = 2.7 v, i out = 40 ma, f sw = 400 khz, l boost = 10 h, c boost = 22 f || 0.1 f parameter description conditions min typ max units v bat input voltage includes startup t=-35 c to +65 c 0.5 ? 3.6 v over entire temperature range 0.68 ? 3.6 v i out load current [23, 24] v bat = 1.6 ? 3.6 v, v out = 3.6 ? 5.0 v, external diode ??50ma v bat = 1.6 ? 3.6 v, v out = 1.6 ? 3.6 v, internal diode ??75ma v bat = 0.8 ? 1.6 v, v out = 1.6 ? 3.6 v, internal diode ??30ma v bat = 0.8 ? 1.6 v, v out = 3.6 ? 5.0 v, external diode ??20ma v bat = 0.5 ? 0.8 v, v out = 1.6 ? 3.6 v, internal diode ??15ma i lpk inductor peak current ? ? 700 ma i q quiescent current boost active mode ? 200 ? a boost standby mode, 32 khz external crystal oscillator, i out < 1 a ?12 ? a v out boost voltage range [25, 26] 1.8 v 1.71 1.80 1.89 v 1.9 v 1.81 1.90 2.00 v 2.0 v 1.90 2.00 2.10 v 2.4 v 2.28 2.40 2.52 v 2.7 v 2.57 2.70 2.84 v 3.0 v 2.85 3.00 3.15 v 3.3 v 3.14 3.30 3.47 v 3.6 v 3.42 3.60 3.78 v 5.0 v external diode required 4.75 5.00 5.25 v reg load load regulation ? ? 3.8 % reg line line regulation ? ? 4.1 % efficiency l boost = 10 h 70 85 ? % l boost = 22 h 82 90 ? % notes 23. for output voltages above 3.6 v, an external diode is required. 24. maximum output current applies for output voltages 4x input voltage. 25. based on device characteriza tion (not production tested). 26. at boost frequenc y of 2 mhz, v out is limited to 2 x v bat . at 400 khz, v out is limited to 4 x v bat .
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 71 of 120 table 11-7. inductive boost regulator ac specifications unless otherwise specified, ope rating conditions are: v bat = 2.4 v, v out = 2.7 v, i out = 40 ma, f sw = 400 khz, l boost = 10 h, c boost = 22 f || 0.1 f. parameter description conditions min typ max units v ripple ripple voltage (peak-to-peak) v out = 1.8 v, f sw = 400 khz, i out = 10 ma ? ? 100 mv f sw switching frequency ? 0.1, 0.4, or 2 ?mhz note 27. based on device characteri zation (not production tested). table 11-8. recommended external components for boost circuit parameter description conditions min typ max units l boost boost inductor 4.7 10 47 h c boost filter capacitor [27] 10 22 47 f i f external schottky diode average forward current external schottky diode is required for v out > 3.6 v 1? ? a v r 20 ? ? v
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 72 of 120 figure 11-8. efficiency vs v out i out = 30 ma, v bat ranges from 0.7 v to v out , l boost = 22 h figure 11-9. efficiency vs v bat i out = 30 ma, v out = 3.3 v, l boost = 22 h figure 11-10. efficiency vs i out v bat = 2.4 v, v out = 3.3 v figure 11-11. efficiency vs i out v bat ranges from 0.7 v to 3.3 v, l boost = 22 h figure 11-12. efficiency vs switching frequency v out = 3.3 v, v bat = 2.4 v, i out = 40 ma
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 73 of 120 11.1 inputs and outputs specifications are valid for ?40 c t a 85 c and t j 100 c, except where noted. specificat ions are valid for 1.71 v to 5.5 v, except where noted. unless otherwise specified, all charts and graphs show typical values. 11.1.1 gpio figure 11-13. gpio output high voltage and current figure 11-14. gpio output low voltage and current note 28. based on device characteri zation (not production tested). table 11-9. gpio dc specifications parameter description conditions min typ max units v ih input voltage high threshold cmos input, prt[]ctl = 0 0.7 v ddio ?? v v il input voltage low threshold cmos input, prt[]ctl = 0 ? ? 0.3 v ddio v v ih input voltage high threshold lvttl input, prt[]ctl = 1, v ddio < 2.7 v 0.7 v ddio ?? v v ih input voltage high threshold lvttl input, prt[]ctl = 1, v ddio 2.7v 2.0 ? ? v v il input voltage low threshold lvttl input, prt[]ctl = 1, v ddio < 2.7 v ? ? 0.3 v ddio v v il input voltage low threshold lvttl input, prt[]ctl = 1, v ddio 2.7v ??0.8v v oh output voltage high i oh = 4 ma at 3.3 v ddio v ddio ? 0.6 ? ? v i oh = 1 ma at 1.8 v ddio v ddio ? 0.5 ? ? v v ol output voltage low i ol = 8 ma at 3.3 v ddio ??0.6v i ol = 4 ma at 1.8 v ddio ??0.6v rpullup pull-up resistor 3.5 5.6 8.5 k rpulldown pull-down resistor 3.5 5.6 8.5 k i il input leakage current (absolute value) [29] 25 c, v ddio = 3.0 v ? ? 2 na c in input capacitance [29] ??7 pf v h input voltage hysteresis (schmitt-trigger) [29] ?40? mv idiode current through protection diode to v ddio and v ssio ??100a rglobal resistance pin to analog global bus 25 c, v ddio = 3.0 v ? 320 ? rmux resistance pin to analog mux bus 25 c, v ddio = 3.0 v ? 220 ?
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 74 of 120 figure 11-15. gpio output rise and fall times, fast strong mode, v ddio = 3.3 v, 25 pf load figure 11-16. gpio output rise and fall times, slow strong mode, v ddio = 3.3 v, 25 pf load table 11-10. gpio ac specifications parameter description conditions min typ max units trisef rise time in fast strong mode [29] 3.3 v v ddio cload = 25 pf ? ? 12 ns tfallf fall time in fast strong mode [29] 3.3 v v ddio cload = 25 pf ? ? 12 ns trises rise time in slow strong mode [29] 3.3 v v ddio cload = 25 pf ? ? 60 ns tfalls fall time in slow strong mode [29] 3.3 v v ddio cload = 25 pf ? ? 60 ns fgpioout gpio output operating frequency 2.7 v < v ddio < 5.5 v, fast strong drive mode 90/10% v ddio into 25 pf ? ? 33 mhz 1.71 v < v ddio < 2.7 v, fast strong drive mode 90/10% v ddio into 25 pf ? ? 20 mhz 3.3 v < v ddio < 5.5 v, slow strong drive mode 90/10% v ddio into 25 pf ? ? 7 mhz 1.71 v < v ddio < 3.3 v, slow strong drive mode 90/10% v ddio into 25 pf ? ? 3.5 mhz fgpioin gpio input operating frequency 1.71 v < v ddio < 5.5 v 90/10% v ddio ??50mhz note 29. based on device characteri zation (not production tested).
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 75 of 120 11.1.2 sio notes 30. see figure 6-9 on page 36 and figure 6-12 on page 39 for more information on sio reference 31. based on device characterizati on (not production tested). table 11-11. sio dc specifications parameter description conditions min typ max units vinmax maximum input voltage all allowed values of vddio and vddd, see section 11.2.1 ??5.5v vinref input voltage reference (differ- ential input mode) 0.5 ? 0.52 v ddio v voutref output voltage reference (regulated output mode) v ddio > 3.7 1 ? v ddio ? 1 v v ddio < 3.7 1 ? v ddio ? 0.5 v v ih input voltage high threshold gpio mode cmos input 0.7 v ddio ??v differential input mode [30] hysteresis disabled sio_ref + 0.2 ? ? v v il input voltage low threshold gpio mode cmos input ? ? 0.3 v ddio v differential input mode [30] hysteresis disabled ? ? sio_ref ? 0.2 v v oh output voltage high unregulated mode i oh = 4 ma, v ddio = 3.3 v v ddio ? 0.4 ? ? v regulated mode [30] i oh = 1 ma sio_ref ? 0.65 ? sio_ref + 0.2 v regulated mode [30] i oh = 0.1 ma sio_ref ? 0.3 ? sio_ref + 0.2 v v ol output voltage low v ddio = 3.30 v, i ol = 25 ma ? ? 0.8 v v ddio = 1.80 v, i ol = 4 ma ? ? 0.4 v rpullup pull-up resistor 3.5 5.6 8.5 k rpulldown pull-down resistor 3.5 5.6 8.5 k i il input leakage current (absolute value) [31] v ih < vddsio 25 c, vddsio = 3.0 v, v ih = 3.0 v ? ? 14 na v ih > vddsio 25 c, vddsio = 0 v, v ih = 3.0 v ? ? 10 a c in input capacitance [31] ??7pf v h input voltage hysteresis (schmitt-trigger) [31] single ended mode (gpio mode) ? 40 ? mv differential mode ? 35 ? mv idiode current through protection diode to v ssio ? ? 100 a
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 76 of 120 figure 11-17. sio output highvoltage and current, unregulated mode figure 11-18. sio output low voltage and current, unregulated mode figure 11-19. sio output high voltage and current, regulated mode note 32. based on device characteri zation (not production tested). table 11-12. sio ac specifications parameter description conditions min typ max units trisef rise time in fast strong mode (90/10%) [32] cload = 25 pf, v ddio = 3.3 v ? ? 12 ns tfallf fall time in fast strong mode (90/10%) [32] cload = 25 pf, v ddio = 3.3 v ? ? 12 ns trises rise time in slow strong mode (90/10%) [32] cload = 25 pf, v ddio = 3.0 v ? ? 75 ns tfalls fall time in slow strong mode (90/10%) [32] cload = 25 pf, v ddio = 3.0 v ? ? 60 ns
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 77 of 120 figure 11-20. sio output rise and fall times, fast strong mode, v ddio = 3.3 v, 25 pf load figure 11-21. sio output rise and fall times, slow strong mode, v ddio = 3.3 v, 25 pf load fsioout sio output operating frequency 2.7 v < v ddio < 5.5 v, unregu- lated output (gpi o) mode, fast strong drive mode 90/10% v ddio into 25 pf ? ? 33 mhz 1.71 v < v ddio < 2.7 v, unregu- lated output (gpi o) mode, fast strong drive mode 90/10% v ddio into 25 pf ? ? 16 mhz 3.3 v < v ddio < 5.5 v, unregu- lated output (gpio) mode, slow strong drive mode 90/10% v ddio into 25 pf ? ? 5 mhz 1.71 v < v ddio < 3.3 v, unregu- lated output (gpio) mode, slow strong drive mode 90/10% v ddio into 25 pf ? ? 4 mhz 2.7 v < v ddio < 5.5 v, regulated output mode, fast strong drive mode output continuously switching into 25 pf ??20mhz 1.71 v < v ddio < 2.7 v, regulated output mode, fast strong drive mode output continuously switching into 25 pf ??10mhz 1.71 v < v ddio < 5.5 v, regulated output mode, slow strong drive mode output continuously switching into 25 pf ??2.5mhz fsioin sio input operating frequency 1.71 v < v ddio < 5.5 v 90/10% v ddio ??50mhz table 11-12. sio ac specifications (continued) parameter description conditions min typ max units
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 78 of 120 11.1.3 usbio for operation in gpio mode, the standard range for v ddd applies, see device level specifications on page 65. figure 11-22. usbio output high voltage and current, gpio mode figure 11-23. usbio output low voltage and current, gpio mode table 11-13. usbio dc specifications parameter description conditions min typ max units rusbi usb d+ pull-up resistance with idle bus 0.900 ? 1.575 k rusba usb d+ pull-up resistance while receiving traffic 1.425 ? 3.090 k vohusb static output high 15 k 5% to vss, internal pull-up enabled 2.8 ? 3.6 v volusb static output low 15 k 5% to vss, internal pull-up enabled ??0.3v vohgpio output voltage high, gpio mode i oh = 4 ma, v ddd 3v 2.4 ? ? v volgpio output voltage low, gpio mode i ol = 4 ma, v ddd 3v ? ? 0.3 v vdi differential input sensitivity |(d+)?(d?)| ? ? 0.2 v vcm differential input common mode range ?0.8?2.5v vse single ended receiver threshold ? 0.8 ? 2 v rps2 ps/2 pull-up resistance in ps/2 mode, with ps/2 pull-up enabled 3?7k rext external usb series resistor in series with each usb pin 21.78 (?1%) 22 22.22 (+1%) zo usb driver output impedance including rext 28 ? 44 c in usb transceiver input capacitance ? ? ? 20 pf i il input leakage current (absolute value) 25 c, v ddd = 3.0 v ? ? 2 na
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 79 of 120 figure 11-24. usbio output rise and fall times, gpio mode, v ddd = 3.3 v, 25 pf load table 11-14. usbio ac specifications parameter description conditions min typ max units tdrate full-speed data rate average bit rate 12 ? 0.25% 12 12 + 0.25% mhz tjr1 receiver data jitter tolerance to next transition ?8 ? 8 ns tjr2 receiver data jitter tolerance to pair transition ?5 ? 5 ns tdj1 driver differential jitter to next transition ?3.5 ? 3.5 ns tdj2 driver differential jitter to pair transition ?4 ? 4 ns tfdeop source jitter for di fferential transition to se0 transition ?2 ? 5 ns tfeopt source se0 interval of eop 160 ? 175 ns tfeopr receiver se0 interval of eop 82 ? ? ns tfst width of se0 interval during differ- ential transition ??14ns fgpio_out gpio mode output operating frequency 3v v ddd 5.5 v ? ? 20 mhz v ddd = 1.71 v ? ? 6 mhz tr_gpio rise time, gpio mode, 10%/90% v ddd v ddd > 3 v, 25 pf load ? ? 12 ns v ddd = 1.71 v, 25 pf load ? ? 40 ns tf_gpio fall time, gpio mode, 90%/10% v ddd v ddd > 3 v, 25 pf load ? ? 12 ns v ddd = 1.71 v, 25 pf load ? ? 40 ns table 11-15. usb driver ac specifications parameter description conditions min typ max units tr transition rise time ? ? 20 ns tf transition fall time ? ? 20 ns tr rise/fall time matching v usb_5 , v usb_3.3 , see usb dc specifications on page 95 90% ? 111% vcrs output signal crossover voltage 1.3 ? 2 v
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 80 of 120 11.1.4 xres table 11-16. xres dc specifications parameter description conditions min typ max units v ih input voltage high threshold 0.7 v ddio ??v v il input voltage low threshold ? ? 0.3 v ddio v rpullup pull-up resistor 3.5 5.6 8.5 k c in input capacitance [33] ?3?pf v h input voltage hysteresis (schmitt-trigger) [33] ?100?mv idiode current through protection diode to v ddio and v ssio ??100a table 11-17. xres ac specifications parameter description conditions min typ max units t reset reset pulse width 1 ? ? s
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 81 of 120 11.2 analog peripherals specifications are valid for ?40 c t a 85 c and t j 100 c, except where noted. specificat ions are valid for 1.71 v to 5.5 v, except where noted. 11.2.1 delta-sigma adc unless otherwise specified, operating conditions are: ? operation in continuous sample mode ? fclk = 6.144 mhz ? reference = 1.024 v internal reference bypassed on p3.2 or p0.3 ? unless otherwise specified, all ch arts and graphs show typical values table 11-18. 12-bit delta-sigma adc dc specifications parameter description conditions min typ max units resolution 8?12bits number of channels, single ended ? ? no. of gpio ? number of channels, differential differential pair is formed using a pair of gpios. ?? no. of gpio/2 ? monotonic yes ? ? ? ? ge gain error buffered, buffer gain = 1, range = 1.024 v, 25 c ??0.2% gd gain drift buffered, buffer gain = 1, range = 1.024 v ? ? 50 ppm/c vos input offset voltage buffered, 16-bit mode, v dda = 2.7 v, 25 c ??0.1mv tcvos temperature coefficient, input offset voltage buffer gain = 1, 16-bit, range = 1.024 v ? ? 55 v/c input voltage range, single ended [34] v ssa ?v dda v input voltage range, differential unbuf- fered [34] v ssa ?v dda v input voltage range, differential, buffered [34] v ssa ?v dda ? 1 v inl12 integral non linearity [34] range = 1.024 v, unbuffered ? ? 1 lsb dnl12 differential non linearity [34] range = 1.024 v, unbuffered ? ? 1 lsb inl8 integral non linearity [34] range = 1.024 v, unbuffered ? ? 1 lsb dnl8 differential non linearity [34] range = 1.024 v, unbuffered ? ? 1 lsb rin_buff adc input resistance input buffer used 10 ? ? m rin_adc12 adc input resistance input buffer bypassed, 12 bit, range = 1.024 v ?148 [35] ?k vextref adc external reference input voltage, see also internal reference in voltage reference on page 83 pins p0[3], p3[2] 0.9 ? 1.3 v current consumption i dd_12 current consumption, 12 bit [34] 192 ksps, unbuffered ? ? 1.4 ma i buff buffer current consumption [34] ??2.5ma notes 34. based on device characteriza tion (not production tested). 35. by using switched capacitors at the adc input an effective input resistance is created. holding the gain and number of bits constant, the resistance is proportional to the inverse of the clock frequency. this value is calculated, not measured. for mo re information see the technical reference manual.
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 82 of 120 table 11-19. delta-sigma adc ac specifications parameter description conditions min typ max units startup time ? ? 4 samples thd total harmonic distortion [36] buffer gain = 1, 16 bit, range = 1.024 v ? ? 0.0032 % 12-bit resolution mode sr12 sample rate, continuous, high power [36] range = 1.024 v, unbuffered 4 ? 192 ksps bw12 input bandwidth at max sample rate [36] range = 1.024 v, unbuffered ? 44 ? khz sinad12int signal to noise ratio, 12-bit, internal reference [36] range = 1.024 v, unbuffered 66 ? ? db 8-bit resolution mode sr8 sample rate, continuous, high power [36] range = 1.024 v, unbuffered 8 ? 384 ksps bw8 input bandwidth at max sample rate [36] range = 1.024 v, unbuffered ? 88 ? khz sinad8int signal to noise ratio, 8-bit, internal reference [36] range = 1.024 v, unbuffered 43 ? ? db table 11-20. delta-sigma adc sample rates, range = 1.024 v resolution, bits continuous multi-sample min max min max 8 8000 384000 1911 91701 9 6400 307200 1543 74024 10 5566 267130 1348 64673 11 4741 227555 1154 55351 12 4000 192000 978 46900 note 36. based on device characteri zation (not production tested). figure 11-25. delta-sigma adc i dd vs sps, range = 1.024 v, continuous sample mode, input buffer bypassed
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 83 of 120 11.2.2 voltage reference 11.2.3 analog globals 11.2.4 comparator table 11-21. voltage reference specifications see also adc external reference specifications in section 11.2.1 . parameter description conditions min typ max units v ref precision reference voltage initial trim 1.014 (?1%) 1.024 1.034 (+1%) v table 11-22. analog globals specifications parameter description conditions min typ max units rppag resistance pin-to-pin through analog global [37] v dda = 3.0 v ? 939 1461 rppmuxbus resistance pin-to-pin through analog mux bus [37] v dda = 3.0 v ? 721 1135 notes 37. the resistance of the analog global and analog mux bus is high if v dda 2.7 v, and the chip is in either sleep or hibernate mode. use of analog global and analog mux bus under these conditions is not recommended 38. the recommended procedure for using a custom trim valu e for the on-chip comparators can be found in the trm. 39. based on device characterizati on (not production tested). table 11-23. comparator dc specifications parameter description conditions min typ max units v os input offset voltage in fast mode factory trim, vdda > 2.7 v, vin 0.5 v ?10mv input offset voltage in slow mode factory trim, vin 0.5 v ? 9 mv v os input offset voltage in fast mode [38] custom trim ? ? 4 mv input offset voltage in slow mode [38] custom trim ? ? 4 mv v os input offset voltage in ultra low-power mode ?12 ? mv v hyst hysteresis hysteresis enable mode ? 10 32 mv v icm input common mode voltage high current / fast mode v ssa ?v dda ? 0.1 v low current / slow mode v ssa ?v dda v ultra low power mode v ssa ?v dda ? 0.9 cmrr common mode rejection ratio ? 50 ? db i cmp high current mode/fast mode [39] ? ? 400 a low current mode/slow mode [39] ? ? 100 a ultra low-power mode [39] ?6 ? a table 11-24. comparator ac specifications parameter description conditions min typ max units tresp response time, high current mode [39] 50 mv overdrive, measured pin-to-pin ? 75 110 ns response time, low current mode [39] 50 mv overdrive, measured pin-to-pin ? 155 200 ns response time, ultra low-power mode [39] 50 mv overdrive, measured pin-to-pin ? 55 ? s
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 84 of 120 11.2.5 current digital-to-analog converter (idac) see the idac component datasheet in psoc creato r for full electrical specifications and apis. unless otherwise specified, all charts and graphs show typical values. table 11-25. idac dc specifications parameter description conditions min typ max units resolution ? ? 8 bits i out output current at code = 255 range = 2.048 ma, code = 255, v dda 2.7 v, rload = 600 ? ?2.048 ? ma range = 2.048 ma, high mode, code = 255, v dda 2.7 v, rload = 300 ?2.048 ? ma range = 255 a, code = 255, rload = 600 ?255 ? a range = 31.875 a, code = 255, rload = 600 ? 31.875 ? a monotonicity ? ? yes ezs zero scale error ? 0 1 lsb eg gain error range = 2.048 ma, 25 c ? ? 2.5 % range = 255 a, 25 c ? ? 2.5 % range = 31.875 a, 25 c ? ? 3.5 % tc_eg temperature coefficient of gain error range = 2.048 ma ? ? 0.04 % / c range = 255 a ? ? 0.04 % / c range = 31.875 a ? ? 0.05 % / c inl integral nonlinearity sink mode, range = 255 a, codes 8 ? 255, rload = 2.4 k , cload = 15 pf ?0.91 lsb source mode, range = 255 a, codes 8 ? 255, rload = 2.4 k , cload = 15 pf ?1.21.5 lsb dnl differential nonlinearity sink mode, range = 255 a, rload = 2.4 k , cload = 15 pf ?0.31 lsb source mode, range = 255 a, rload = 2.4 k , cload = 15 pf ?0.31 lsb vcompliance dropout voltage, source or sink mode voltage headroom at max current, rload to vdda or rload to vssa, vdiff from vdda 1? ? v
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 85 of 120 figure 11-26. idac inl vs input code, range = 255 a, source mode figure 11-27. idac inl vs inpu t code, range = 255 a, sink mode i dd operating current, code = 0 slo w mode, source mode, range = 31.875 a ? 44 100 a slow mode, source mode, range = 255 a, ? 33 100 a slow mode, source mode, range = 2.04 ma ? 33 100 a slow mode, sink mode, range = 31.875 a ? 36 100 a slow mode, sink mode, range = 255 a ? 33 100 a slow mode, sink mode, range = 2.04 ma ? 33 100 a fast mode, source mode, range = 31.875 a ? 310 500 a fast mode, source mode, range = 255 a ? 305 500 a fast mode, source mode, range = 2.04 ma ? 305 500 a fast mode, sink mode, range = 31.875 a ? 310 500 a fast mode, sink mode, range = 255 a ? 300 500 a fast mode, sink mode, range = 2.04 ma ? 300 500 a table 11-25. idac dc specifications (continued) parameter description conditions min typ max units
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 86 of 120 figure 11-28. idac dnl vs input code, range = 255 a, source mode figure 11-29. idac dnl vs inpu t code, range = 255 a, sink mode figure 11-30. idac inl vs temperature, range = 255 a, fast mode figure 11-31. idac dnl vs temperature, range = 255 a, fast mode
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 87 of 120 figure 11-32. idac full scal e error vs temperature, range = 255 a, source mode figure 11-33. idac full scale error vs temperature, range = 255 a, sink mode figure 11-34. idac operating current vs temperature, range = 255 a, code = 0, source mode figure 11-35. idac operatin g current vs temperature, range = 255 a, code = 0, sink mode
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 88 of 120 figure 11-36. idac step response, codes 0x40 - 0xc0, 255 a mode, source mode, fast mode, vdda = 5 v figure 11-37. idac glitch re sponse, codes 0x7f - 0x80, 255 a mode, source mode, fast mode, vdda = 5 v figure 11-38. idac psrr vs frequency table 11-26. idac ac specifications parameter description conditions min typ max units f dac update rate ? ? 8 msps t settle settling time to 0.5 lsb range = 31.875 a or 255 a, full scale transition, fast mode, 600 15-pf load ? ? 125 ns
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 89 of 120 11.2.6 voltage digital to analog converter (vdac) see the vdac component datasheet in psoc creato r for full electrical specifications and apis. unless otherwise specified, all charts and graphs show typical values. figure 11-39. vdac inl vs input code, 1 v mode fi gure 11-40. vdac dnl vs input code, 1 v mode table 11-27. vdac dc specifications parameter description conditions min typ max units resolution ? 8 ? bits inl1 integral nonlinearity 1 v scale ? 2.1 2.5 lsb dnl1 differential nonlinearity 1 v scale ? 0.3 1 lsb rout output resistance 1 v scale ? 4 ? k 4 v scale ? 16 ? k v out output voltage range, code = 255 1 v scale ? 1 ? v 4 v scale, vdda = 5 v ? 4 ? v monotonicity ? ? yes ? v os zero scale error ? 0 0.9 lsb eg gain error 1 v scale ? ? 2.5 % 4 v scale ? ? 2.5 % tc_eg temperature coefficient, gain error 1 v scale ? ? 0.03 %fsr / c 4 v scale ? ? 0.03 %fsr / c i dd operating current slow mode ? ? 100 a fast mode ? ? 500 a
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 90 of 120 figure 11-41. vdac inl vs temperature, 1 v mode fi gure 11-42. vdac dnl vs temperature, 1 v mode figure 11-43. vdac full scal e error vs temperature, 1 v mode figure 11-44. vdac full scal e error vs temperature, 4 v mode figure 11-45. vdac operating cu rrent vs temperature, 1v mode, slow mode figure 11-46. vdac operating current vs temperature, 1 v mode, fast mode
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 91 of 120 figure 11-47. vdac step response, codes 0x40 - 0xc0, 1 v mode, fast mode, vdda = 5 v figure 11-48. vdac glitch resp onse, codes 0x7f - 0x80, 1 v mode, fast mode, vdda = 5 v figure 11-49. vdac psrr vs frequency table 11-28. vdac ac specifications t parameter description conditions min typ max units f dac update rate 1 v scale ? ? 1000 ksps 4 v scale ? ? 250 ksps tsettlep settling time to 0.1%, step 25% to 75% 1 v scale, cload = 15 pf ? 0.45 1 s 4 v scale, cload = 15 pf ? 0.8 3.2 s tsettlen settling time to 0.1%, step 75% to 25% 1 v scale, cload = 15 pf ? 0.45 1 s 4 v scale, cload = 15 pf ? 0.7 3 s
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 92 of 120 11.2.7 temperature sensor 11.2.8 lcd direct drive table 11-29. temperature sensor specifications parameter description conditions min typ max units temp sensor accuracy range: ?40 c to +85 c ? 5 ? c table 11-30. lcd direct drive dc specifications parameter description conditions min typ max units i cc lcd system operating current device sleep mode with wakeup at 400-hz rate to refresh lcds, bus clock = 3 mhz, vddio = vdda = 3 v, 4 commons, 16 segments, 1/4 duty cycle, 50 hz frame rate, no glass connected ?38 ? a i cc_seg current per segment driver strong drive mode ? 260 ? a v bias lcd bias range (v bias refers to the main output voltage(v0) of lcd dac) v dda 3 v and v dda v bias 2? 5v lcd bias step size v dda 3 v and v dda v bias ? 9.1 v dda ?mv lcd capacitance per segment/common driver drivers may be combined ? 500 5000 pf long term segment offset ? ? 20 mv i out output drive current per segment driver) vddio = 5.5v, strong drive mode 355 ? 710 a table 11-31. lcd direct drive ac specifications parameter description conditions min typ max units f lcd lcd frame rate 10 50 150 hz
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 93 of 120 11.3 digital peripherals specifications are valid for ?40 c t a 85 c and t j 100 c, except where noted. specificat ions are valid for 1.71 v to 5.5 v, except where noted. 11.3.1 timer the following specifications apply to the timer/counter/pwm peripheral in timer mo de. timers can also be implemented in udbs; f or more information, see the timer component datasheet in psoc creator. 11.3.2 counter the following specifications apply to the timer/counter/pwm peri pheral, in counter mode. counters can also be implemented in udbs; for more information, see the counter component datasheet in psoc creator. table 11-32. timer dc specifications parameter description conditions min typ max units block current consumption 16-bit timer, at listed input clock frequency ???a 3 mhz ? 15 ? a 12 mhz ? 60 ? a 50 mhz ? 260 ? a table 11-33. timer ac specifications parameter description conditions min typ max units operating frequency dc ? 50.01 mhz capture pulse width (internal) 21 ? ? ns capture pulse width (external) 42 ? ? ns timer resolution 21 ? ? ns enable pulse width 21 ? ? ns enable pulse width (external) 42 ? ? ns reset pulse width 21 ? ? ns reset pulse width (external) 42 ? ? ns table 11-34. counter dc specifications parameter description conditions min typ max units block current consumption 16-bit c ounter, at listed input clock frequency ???a 3 mhz ? 15 ? a 12 mhz ? 60 ? a 50 mhz ? 260 ? a table 11-35. counter ac specifications parameter description conditions min typ max units operating frequency dc ? 50.01 mhz capture pulse 21 ? ? ns resolution 21 ? ? ns pulse width 21 ? ? ns pulse width (external) 42 ? ? ns enable pulse width 21 ? ? ns enable pulse width (external) 42 ? ? ns reset pulse width 21 ? ? ns reset pulse width (external) 42 ? ? ns
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 94 of 120 11.3.3 pulse width modulation the following specifications apply to the timer/counter/pwm per ipheral, in pwm mode. pwm components can also be implemented in udbs; for more information, see the pwm component datasheet in psoc creator.. 11.3.4 i 2 c controller area network [40] table 11-36. pwm dc specifications parameter description conditions min typ max units block current consumption 16-bit pwm, at listed input clock frequency ???a 3 mhz ? 15 ? a 12 mhz ? 60 ? a 50 mhz ? 260 ? a table 11-37. pulse width modulation (pwm) ac specifications parameter description conditions min typ max units operating frequency dc ? 50.01 mhz pulse width 21 ? ? ns pulse width (external) 42 ? ? ns kill pulse width 21 ? ? ns kill pulse width (external) 42 ? ? ns enable pulse width 21 ? ? ns enable pulse width (external) 42 ? ? ns reset pulse width 21 ? ? ns reset pulse width (external) 42 ? ? ns table 11-38. fixed i 2 c dc specifications parameter description conditions min typ max units block current consumption enabled, configured for 100 kbps ? ? 250 a enabled, configured for 400 kbps ? ? 260 a wake from sleep mode ? ? 30 a table 11-39. fixed i 2 c ac specifications parameter description conditions min typ max units bit rate ? ? 1 mbps table 11-40. can dc specifications parameter description conditions min typ max units i dd block current consumption ? ? 200 a table 11-41. can ac specifications parameter description conditions min typ max units bit rate minimum 8 mhz clock ? ? 1 mbit note 40. refer to iso 11898 specification for details.
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 95 of 120 11.3.5 usb 11.3.6 universal digital blocks (udbs) psoc creator provides a library of pre-built and tested standard digital peripherals (uart, spi, lin, prs, crc, timer, counter, pwm, and, or, and so on) that are mapped to the udb array. see the component datasheets in psoc creato r for full ac/dc specification s, apis, and example code. note 41. rise/fall time matching (tr) not guaranteed, see usb driver ac specifications on page 79. table 11-42. usb dc specifications parameter description conditions min typ max units v usb_5 device supply for usb operation usb configured, usb regulator enabled 4.35 ? 5.25 v v usb_3.3 usb configured, usb regulator bypassed 3.15 ? 3.6 v v usb_3 usb configured, usb regulator bypassed [41] 2.85 ? 3.6 v i usb_configured device supply current in device active mode, bus clock and imo = 24 mhz v ddd = 5 v, f cpu = 1.5 mhz ? 10 ? ma v ddd = 3.3 v, f cpu = 1.5 mhz ? 8 ? ma i usb_suspended device supply current in device sleep mode v ddd = 5 v, connected to usb host, picu configured to wake on usb resume signal ?0.5?ma v ddd = 5 v, disconnected from usb host ?0.3?ma v ddd = 3.3 v, connected to usb host, picu configured to wake on usb resume signal ?0.5?ma v ddd = 3.3 v, disconnected from usb host ?0.3?ma table 11-43. udb ac specifications parameter description conditions min typ max units datapath performance f max_timer maximum frequency of 16-bit timer in a udb pair ? ? 50.01 mhz f max_adder maximum frequency of 16-bit adder in a udb pair ? ? 50.01 mhz f max_crc maximum frequency of 16-bit crc/prs in a udb pair ? ? 50.01 mhz pld performance f max_pld maximum frequency of a two-pass pld function in a udb pair ? ? 50.01 mhz clock to output performance t clk_out propagation delay for clock in to data out, see figure 11-50 . 25 c, vddd 2.7 v ? 20 25 ns t clk_out propagation delay for clock in to data out, see figure 11-50 . worst-case placement, routing, and pin selection ? ? 55 ns
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 96 of 120 figure 11-50. clock to output performance 11.4 memory specifications are valid for ?40 c t a 85 c and t j 100 c, except where noted. specificat ions are valid for 1.71 v to 5.5 v, except where noted. 11.4.1 flash 11.4.2 eeprom table 11-44. flash dc specifications parameter description conditions min typ max units erase and program voltage v ddd pin 1.71 ? 5.5 v table 11-45. flash ac specifications parameter description conditions min typ max units t write row write time (erase + program) ? 15 20 ms t erase row erase time ? 10 13 ms row program time ? 5 7 ms t bulk bulk erase time (16 kb to 64 kb) ? ? 35 ms sector erase time (8 kb to 16 kb) ? ? 15 ms total device program time, including jtag or swd, and other overhead ? ? 5 seconds flash data retention time, retention period measured from last erase cycle average ambient temp. t a 55 c, 100 k erase/program cycles 20 ? ? years average ambient temp. t a 85 c, 10 k erase/program cycles 10 ? ? table 11-46. eeprom dc specifications parameter description conditions min typ max units erase and program voltage 1.71 ? 5.5 v
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 97 of 120 11.4.3 nonvolatile latches (nvl)) 11.4.4 sram table 11-47. eeprom ac specifications parameter description conditions min typ max units t write single row erase/wr ite cycle time ? 2 20 ms eeprom data retenti on time, retention period measured from last erase cycle average ambient temp, t a 25 c, 1m erase/program cycles 20 ? ? years average ambient temp, t a 55 c, 100 k erase/program cycles 20 ? ? average ambient temp. t a 85 c, 10 k erase/program cycles 10 ? ? table 11-48. nvl dc specifications parameter description conditions min typ max units erase and program voltage v ddd pin 1.71 ? 5.5 v table 11-49. nvl ac specifications parameter description conditions min typ max units nvl endurance programmed at 25 c 1k ? ? program/ erase cycles programmed at 0 c to 70 c 100 ? ? program/ erase cycles nvl data retention time programmed at 25 c 20 ? ? years programmed at 0 c to 70 c 20 ? ? years table 11-50. sram dc specifications parameter description conditions min typ max units v sram sram retention voltage 1.2 ? ? v table 11-51. sram ac specifications parameter description conditions min typ max units f sram sram operating frequency dc ? 50.01 mhz
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 98 of 120 11.4.5 external memory interface figure 11-51. asynchronous read cycle timing table 11-52. asynchronous read cycle specifications parameter description conditions min typ max units t emif clock period [42] vdda 3.3 v 30.3 ? ? ns tcel em_cen low time 2t ? 5 ? 2t+ 5 ns taddrv em_cen low to em_addr valid ? ? 5 ns taddrh address hold time after em_wen high t ? ? ns toel em_oen low time 2t ? 5 ? 2t + 5 ns tdoesu data to em_oen high setup time t + 15 ? ? ns tdoeh data hold time after em_oen high 3 ? ? ns em_ addr em_ cen em_ oen em_ data em_ wen address data tcel taddrv taddrh toel tdoesu tdoeh note 42. limited by gpio output frequency, see table 11-10 on page 74.
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 99 of 120 figure 11-52. asynchronous write cycle timing table 11-53. asynchronous write cycle specifications parameter description conditions min typ max units t emif clock period [43] vdda 3.3 v 30.3 ? ? ns tc e l em_cen low time t ? 5 ? t + 5 ns taddrv em_cen low to em_addr valid ? ? 5 ns taddrh address hold time after em_wen high t ? ? ns twel em_wen low time t ? 5 ? t + 5 ns tdcev em_cen low to data valid ? ? 7 ns tdweh data hold time after em_wen high t ? ? ns address taddrh tcel taddrv em_ addr em_cen em_ wen em_ oen em_ data twel tdcev tdweh data note 43. limited by gpio output frequency, see table 11-10 on page 74.
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 100 of 120 figure 11-53. synchronous read cycle timing table 11-54. synchronous read cycle specifications parameter description conditions min typ max units t emif clock period [44] vdda 3.3 v 30.3 ? ? ns tc p / 2 em_clock pulse high t/2 ? ? ns tc e l d em_cen low to em_clock high 5 ? ? ns tc e h d em_clock high to em_cen high t/2 ? 5 ? ? ns taddrv em_addr valid to em_clock high 5 ? ? ns taddriv em_clock high to em_addr invalid t/2 ? 5 ? ? ns toeld em_oen low to em_clock high 5 ? ? ns toehd em_clock high to em_oen high t ? ? ns tds data valid before em_oen high t + 15 ? ? ns tadscld em_adscn low to em_clock high 5 ? ? ns tadschd em_clock high to em_adscn high t/2 ? 5 ? ? ns em_ addr em_ cen em_ oen em_ data em_ clock address em_ adscn tcp/2 tceld taddrv tcehd taddriv toehd toeld tds tadscld tadschd data note 44. limited by gpio output frequency, see table 11-10 on page 74.
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 101 of 120 figure 11-54. synchron ous write cycle timing table 11-55. synchronous write cycle specifications parameter description conditions min typ max units t emif clock period [45] vdda 3.3 v 30.3 ? ? ns tc p / 2 em_clock pulse high t/2 ? ? ns tc e l d em_cen low to em_clock high 5 ? ? ns tc e h d em_clock high to em_cen high t/2 ? 5 ? ? ns taddrv em_addr valid to em_clock high 5 ? ? ns taddriv em_clock high to em_addr invalid t/2 ? 5 ? ? ns tweld em_wen low to em_clock high 5 ? ? ns twehd em_clock high to em_wen high t/2 ? 5 ? ? ns tds data valid before em_clock high 5 ? ? ns tdh data invalid after em_clock high t ? ? ns tadscld em_adscn low to em_clock high 5 ? ? ns tadschd em_clock high to em_adscn high t/2 ? 5 ? ? ns em_ addr em_ cen em_ wen em_ data em_ clock address em_ adscn tcp/2 tceld taddrv tcehd taddriv twehd tweld tds data tadscld tadschd tdh note 45. limited by gpio output frequency, see table 11-10 on page 74.
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 102 of 120 11.5 psoc system resources specifications are valid for ?40 c t a 85 c and t j 100 c, except where noted. specificat ions are valid for 1.71 v to 5.5 v, except where noted. 11.5.1 por with brown out for brown out detect in regulated mode, v ddd and v dda must be 2.0 v. brown out detect is not available in externally regulated mode. 11.5.2 voltage monitors table 11-56. precise power-on reset (pres) with brown out dc specifications parameter description conditions min typ max units precise por (ppor) presr rising trip voltage factory trim 1.64 ? 1.68 v presf falling trip voltage 1.62 ? 1.66 v table 11-57. power-on reset (p or) with brown out ac specifications parameter description conditions min typ max units pres_tr response time ? ? 0.5 s v ddd /v dda droop rate sleep mode ? 5 ? v/sec table 11-58. voltage monitors dc specifications parameter description conditions min typ max units lvi trip voltage lvi_a/d_sel[3:0] = 0000b 1.68 1.73 1.77 v lvi_a/d_sel[3:0] = 0001b 1.89 1.95 2.01 v lvi_a/d_sel[3:0] = 0010b 2.14 2.20 2.27 v lvi_a/d_sel[3:0] = 0011b 2.38 2.45 2.53 v lvi_a/d_sel[3:0] = 0100b 2.62 2.71 2.79 v lvi_a/d_sel[3:0] = 0101b 2.87 2.95 3.04 v lvi_a/d_sel[3:0] = 0110b 3.11 3.21 3.31 v lvi_a/d_sel[3:0] = 0111b 3.35 3.46 3.56 v lvi_a/d_sel[3:0] = 1000b 3.59 3.70 3.81 v lvi_a/d_sel[3:0] = 1001b 3.84 3.95 4.07 v lvi_a/d_sel[3:0] = 1010b 4.08 4.20 4.33 v lvi_a/d_sel[3:0] = 1011b 4.32 4.45 4.59 v lvi_a/d_sel[3:0] = 1100b 4.56 4.70 4.84 v lvi_a/d_sel[3:0] = 1101b 4.83 4.98 5.13 v lvi_a/d_sel[3:0] = 1110b 5.05 5.21 5.37 v lvi_a/d_sel[3:0] = 1111b 5.30 5.47 5.63 v hvi trip voltage 5.57 5.75 5.92 v table 11-59. voltage monitors ac specifications parameter description conditions min typ max units response time ? ? 1 s
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 103 of 120 11.5.3 interrupt controller 11.5.4 jtag interface figure 11-55. jtag interface timing table 11-60. interrupt controller ac specifications parameter description conditions min typ max units delay from interrupt signal input to isr code execution from isr code includes worse case completion of longest instruction div with 6 cycles ? ? 25 tcy cpu table 11-61. jtag interface ac specifications [46] parameter description conditions min typ max units f_tck tck frequency 3.3 v v ddd 5v ? ? 14 [47] mhz 1.71 v v ddd < 3.3 v ? ? 7 [47] mhz t_tdi_setup tdi setup before tck high (t/10) ? 5 ? ? ns t_tms_setup tms setup before tck high t/4 ? ? t_tdi_hold tdi, tms hold after tck high t = 1/f_tck max t/4 ? ? t_tdo_valid tck low to tdo valid t = 1/f_tck max ? ? 2t/5 t_tdo_hold tdo hold after tck high t = 1/f_tck max t/4 ? ? tdi tck t_tdi_setup tdo (1/f_tck) t_tdi_hold t_tdo_valid t_tdo_hold tms t_tms_setup t_tms_hold notes 46. based on device characteriza tion (not production tested). 47. f_tck must also be no more than 1/3 cpu clock frequency.
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 104 of 120 11.5.5 swd interface figure 11-56. swd interface timing 11.5.6 swv interface 11.6 clocking specifications are valid for ?40 c t a 85 c and t j 100 c, except where noted. specificat ions are valid for 1.71 v to 5.5 v, except where noted. 11.6.1 32 khz ex ternal crystal table 11-62. swd interface ac specifications [48] parameter description conditions min typ max units f_swdck swdclk frequency 3.3 v v ddd 5v ? ? 14 [49] mhz 1.71 v v ddd < 3.3 v ? ? 7 [49] mhz 1.71 v v ddd < 3.3 v, swd over usbio pins ??5.5 [49] mhz t_swdi_setup swdio input setup before swdck high t = 1/f_swdck max t/4 ? ? t_swdi_hold swdio input hold after swdck high t = 1/f_swdck max t/4 ? ? t_swdo_valid swdck high to swdio output t = 1/f_swdck max ? ? 2t/5 t_swdo_hold swdio output hold after swdck low t = 1/f_swdck max t/4 ? ? swdio (psoc 3 reading on swdio) swdck t_swdi_setup swdio (psoc 3 writing to swdio) (1/f_swdck) t_swdi_hold t_swdo_valid t_swdo_hold table 11-63. swv interface ac specifications [22] parameter description conditions min typ max units swv mode swv bit rate ? ? 33 mbit notes 48. based on device characterizati on (not production tested). 49. f_swdck must also be no more than 1/3 cpu clock frequency. table 11-64. 32 khz external crystal dc specifications [22] parameter description conditions min typ max units i cc operating current low-power mode ? 0.25 1.0 a cl external crystal capacitance ? 6 ? pf dl drive level ? ? 1 w table 11-65. 32 khz external crystal ac specifications parameter description conditions min typ max units f frequency ? 32.768 ? khz t on startup time high power mode ? 1 ? s
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 105 of 120 11.6.2 internal main oscillator figure 11-57. imo current vs. frequency note 50. based on device characterization (not production tested). table 11-66. imo dc specifications parameter description conditions min typ max units supply current 24 mhz ? usb mode with oscillator locking to usb bus ? ? 500 a 24 mhz ? non usb mode ? ? 300 a 12 mhz ? ? 200 a 6 mhz ? ? 180 a 3 mhz ? ? 150 a table 11-67. imo ac specifications parameter description conditions min typ max units f imo imo frequency stability (with factory trim) 24 mhz ? non usb mode ?4 ? 4 % 24 mhz ? usb mode with oscillator locking to usb bus ?0.25 ? 0.25 % 12 mhz ?3 ? 3 % 6 mhz ?2 ? 2 % 3 mhz ?1 ? 1 % startup time [50] from enable (during normal system operation) or wakeup from low-power state ??12s jp-p jitter (peak to peak) [50] f = 24 mhz ? 0.9 ? ns f = 3 mhz ? 1.6 ? ns jperiod jitter (long term) [50] f = 24 mhz ? 0.9 ? ns f = 3 mhz ? 12 ? ns
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 106 of 120 figure 11-58. imo frequency variation vs. temperature figure 11-59. imo frequency variation vs. v cc 11.6.3 internal low-speed oscillator figure 11-60. ilo frequency variation vs. temperature figure 11-61. ilo frequency variation vs. v dd table 11-68. ilo dc specifications parameter description conditions min typ max units i cc operating current f out = 1 khz ? 0.3 1.7 a f out = 33 khz ? 1.0 2.6 a f out = 100 khz ? 1.0 2.6 a leakage current power down mode ? 2.0 15 na table 11-69. ilo ac specifications parameter description conditions min typ max units startup time, all frequencies turbo mode ? ? 2 ms f ilo ilo frequencies (trimmed) 100 khz 45 100 200 khz 1 khz 0.5 1 2 khz ilo frequencies (untrimmed) 100 khz 30 100 300 khz 1 khz 0.3 1 3.5 khz
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 107 of 120 11.6.4 external crystal oscillator 11.6.5 external clock reference 11.6.6 phase?locked loop table 11-70. eco ac specifications parameter description conditions min typ max units f crystal frequency range 4 ? 25 mhz table 11-71. external clock reference ac specifications [51] parameter description conditions min typ max units external frequency range 0 ? 33 mhz input duty cycle range measured at v ddio /2 30 50 70 % input edge rate v il to v ih 0.1 ? ? v/ns notes 51. based on device characterizati on (not production tested). 52. this specification is guaran teed by testing the pll across the specified ra nge using the imo as the source for the pll. 53. pll input divider, q, must be set so that the input frequen cy is divided down to the intermediate frequency range. value for q ranges from 1 to 16. table 11-72. pll dc specifications parameter description conditions min typ max units i dd pll operating current in = 3 mhz, out = 24 mhz ? 200 ? a table 11-73. pll ac specifications parameter description conditions min typ max units fpllin pll input frequency [52] 1?48mhz pll intermediate frequency [53] output of prescaler 1 ? 3 mhz fpllout pll output frequency [52] 24 ? 50 mhz lock time at startup ? ? 250 s jperiod-rms jitter (rms) [51] ??250ps
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 108 of 120 12. ordering information in addition to the features listed in table 12-1 , every cy8c32 device includes: a precision on-chip voltage reference, precision oscillators, flash, ecc, dma, a fixed function i 2 c, 4 kb trace ram, jtag/swd programming and debug, external memory interface, and more. in addition to these features, the flexible udbs and analog subsection support a wide range of peripherals. to assist you in selecting the ideal part, psoc creator makes a part recommend ation after you choose the components required by your applicat ion. all cy8c32 derivatives incorporate device and flash security in user-selectable security levels; see the trm for details. table 12-1. cy8c32 family with single cycle 8051 part number mcu core analog digital i/o [55] package jtag id [56] cpu speed (mhz) flash (kb) sram (kb) eeprom (kb) lcd segment drive adc dac comparator sc/ct analog blocks opamps dfb capsense udbs [54] 16-bit timer/pwm fs usb can 2.0b total i/o gpio sio usbio 16 kb flash cy8c3244axi-153 50 16 2 0.5 ? 12-bit del-sig 1 2 0 0 ? ? 16 4 ? ? 70 62 8 0 100-pin tqfp 01e099069 CY8C3244LTI-130 50 16 2 0.5 ? 12-bit del-sig 1 2 0 0 ? ? 16 4 ? ? 46 38 8 0 68-pin qfn 01e082069 cy8c3244lti-123 50 16 2 0.5 ? 12-bit del-sig 1 2 0 0 ? ? 16 4 ? ? 29 25 4 0 48-pin qfn 01e07b069 cy8c3244pvi-133 50 16 2 0.5 ? 12-bit del-sig 1 2 0 0 ? ? 16 4 ? ? 29 25 4 0 48-pin ssop 01e085069 32 kb flash cy8c3245axi-158 50 32 4 1 ? 12-bit del-sig 1 2 0 0 ? ? 20 4 ? ? 70 62 8 0 100-pin tqfp 01e09e069 cy8c3245lti-163 50 32 4 1 ? 12-bit del-sig 1 2 0 0 ? ? 20 4 ? ? 46 38 8 0 68-pin qfn 01e0a3069 cy8c3245lti-139 50 32 4 1 ? 12-bit del-sig 1 2 0 0 ? ? 20 4 ? ? 29 25 4 0 48-pin qfn 01e08b069 cy8c3245pvi-134 50 32 4 1 ? 12-bit del-sig 1 2 0 0 ? ? 20 4 ? ? 29 25 4 0 48-pin ssop 01e086069 cy8c3245axi-166 50 32 4 1 ? 12-bit del-sig 1 2 0 0 ? ? 20 4 ? ? 72 62 8 2 100-pin tqfp 01e0a6069 cy8c3245lti-144 50 32 4 1 ? 12-bit del-sig 1 2 0 0 ? ? 20 4 ? ? 31 25 4 2 48-pin qfn 01e090069 cy8c3245lti-129 50 32 4 1 ? 12-bit del-sig 1 2 0 0 ? ? 20 4 ? ? 48 38 8 2 68-pin qfn 01e081069 cy8c3245pvi-150 50 32 4 1 ? 12-bit del-sig 1 2 0 0 ? ? 20 4 ? ? 31 25 4 2 48-pin ssop 01e096069 64 kb flash cy8c3246lti-149 50 64 8 2 ? 12-bit del-sig 1 2 0 0 ? ? 24 4 ? ? 46 38 8 0 68-pin qfn 01e095069 cy8c3246pvi-147 50 64 8 2 ? 12-bit del-sig 1 2 0 0 ? ? 24 4 ? ? 31 25 4 2 48-pin ssop 01e093069 cy8c3246axi-131 50 64 8 2 ? 12-bit del-sig 1 2 0 0 ? ? 24 4 ? ? 70 62 8 0 100-pin tqfp 01e083069 cy8c3246lti-162 50 64 8 2 ? 12-bit del-sig 1 2 0 0 ? ? 24 4 ? ? 29 25 4 0 48-pin qfn 01e0a2069 cy8c3246pvi-122 50 64 8 2 ? 12-bit del-sig 1 2 0 0 ? ? 24 4 ? ? 29 25 4 0 48-pin ssop 01e07a069 cy8c3246axi-138 50 64 8 2 ? 12-bit del-sig 1 2 0 0 ? ? 24 4 ? ? 72 62 8 2 100-pin tqfp 01e08a069 cy8c3246lti-128 50 64 8 2 ? 12-bit del-sig 1 2 0 0 ? ? 24 4 ? ? 48 38 8 2 68-pin qfn 01e080069 cy8c3246lti-125 50 64 8 2 ? 12-bit del-sig 1 2 0 0 ? ? 24 4 ? ? 31 25 4 2 48-pin qfn 01e07d069 notes 54. udbs support a wide variety of functionality including spi, lin, uart, timer, counter, pwm, prs, and others. individual func tions may use a fraction of a udb or multiple udbs. multiple functions can share a single udb. see the example peripherals on page 41 for more information on how udbs can be used. 55. the i/o count includes all types of digital i/o: gpio, sio, and the two usb i/o. see the i/o system and routing on page 34 for details on the functionality of each of these types of i/o. 56. the jtag id has three major fields. the most significant nibble (left digit) is the version, followed by a 2 byte part numbe r and a 3 nibble manufacturer id.
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 109 of 120 12.1 part numbering conventions psoc 3 devices follow the part numbering convention described here. all fields are single character alphanumeric (0, 1, 2, ?, 9 , a, b, ?, z) unless stated otherwise. cy8cabcdefg-xxx ? a: architecture ? 3: psoc 3 ? 5: psoc 5 ? b: family group within architecture ? 2: cy8c32 family ? 4: cy8c34 family ? 6: cy8c36 family ? 8: cy8c38 family ? c: speed grade ? 4: 50 mhz ? 6: 67 mhz ? d: flash capacity ? 4: 16 kb ? 5: 32 kb ? 6: 64 kb ? ef: package code ? two character alphanumeric ? ax: tqfp ? lt: qfn ? pv: ssop ? g: temperature range ? c: commercial ? i: industrial ? a: automotive ? xxx: peripheral set ? three character numeric ? no meaning is associated with these three characters. all devices in the psoc 3 cy8c32 family comply to rohs-6 spec ifications, demonstrating the commitment by cypress to lead-free products. lead (pb) is an alloying element in solders that has resulted in environmental concerns due to potential toxicity. cy press uses nickel-palladium-gold (nipdau) technology for the majority of leadframe-based packages. a high level review of the cypress pb-free position is available on our website. specific package information is also available . package material declaration datasheets (pmdds) identify all substanc es contained within cypress packages. pmdds also confirm the absence of many banned substances. the info rmation in the pmdds will help cypress cust omers plan for recycling or other ?end of life? requirements. architecture cypress prefix family group within architecture speed grade flash capacity package code temperature range peripheral set 3: psoc 3 4: 50 mhz 6: 64 kb pv: ssop i: industrial example cy8c 3 2 v p 6 4ix x -x 2: cy8c32 family
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 110 of 120 13. packaging table 13-1. package characteristics parameter description conditions min typ max units t a operating ambient temperature ?40 25.00 85 c t j operating junction temperature ?40 ? 100 c t ja package ja (48-pin ssop) ? 49 ? c/watt t ja package ja (48-pin qfn) ? 14 ? c/watt t ja package ja (68-pin qfn) ? 15 ? c/watt t ja package ja (100-pin tqfp) ? 34 ? c/watt t jc package jc (48-pin ssop) ? 24 ? c/watt t jc package jc (48-pin qfn) ? 15 ? c/watt t jc package jc (68-pin qfn) ? 13 ? c/watt t jc package jc (100-pin tqfp) ? 10 ? c/watt table 13-2. solder reflow peak temperature package maximum peak temperature maximum time at peak temperature 48-pin ssop 260 c 30 seconds 48-pin qfn 260 c 30 seconds 68-pin qfn 260 c 30 seconds 100-pin tqfp 260 c 30 seconds table 13-3. package moisture sensitivity level (msl), ipc/jedec j-std-2 package msl 48-pin ssop msl 3 48-pin qfn msl 3 68-pin qfn msl 3 100-pin tqfp msl 3
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 111 of 120 figure 13-1. 48-pin (300 mil) ssop package outline figure 13-2. 48-pin qfn package outline 0.095 0.025 0.008 seating plane 0.420 0.088 .020 0.292 0.299 0.395 0.092 bsc 0.110 0.016 0.620 0.008 0.0135 0.630 dimensions in inches min. max. 0.040 0.024 0-8 gauge plane .010 1 24 25 48 0.004 0.005 0.010 51-85061-*d top view pin 1 dot 1.00 max. 48 bottom view 0.230.05 1 1 0.05 max. 0.20 ref. side view 1. hatch area is solderable exposed metal. 2. reference jedec#: mo-220 4. all dimensions are in mm [min/max] notes : part # 5. package code description 3. package weight: 0.13g pad exposed solderable laser mark pin 1 id 5.55 ref 0.500.10 5.55 ref 5.60.10 5.60.10 24 12 25 36 48 13 37 0.400.10 0.08 c lead free lt48d 7.000.10 7.000.10 12 25 36 13 24 37 001- 45616 *b
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 112 of 120 figure 13-3. 68-pin qfn 88 with 0.4 mm pitch package outline (sawn version) figure 13-4. 100-pin tqfp (14 14 1.4 mm) package outline top view 0.200 ref pin 1 dot laser mark 1 8 3 4 3 5 5 1 5 2 6 8 1 1 7 0.08 c seating plane 0.05 max bottom view 1 0.4000.100 0.400 pitch 6 8 5 2 5 1 3 5 3 4 1 8 1 7 8.0000.100 8.0000.100 0.9000.100 6.40 ref 6.40 ref side view 0.200.05 5.70.10 pad exposed solderable 5.70.10 pin1 id r 0.20 001-09618 *c 51-85048 *e
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 113 of 120 14. acronyms table 14-1. acronyms us ed in this document acronym description abus analog local bus adc analog-to-digital converter ag analog global ahb amba (advanced microcontroller bus archi- tecture) high-performance bus, an arm data transfer bus alu arithmetic logic unit amuxbus analog mu ltiplexer bus api application programming interface apsr application program status register arm ? advanced risc machine, a cpu architecture atm automatic thump mode bw bandwidth can controller area network, a communications protocol cmrr common-mode rejection ratio cpu central processing unit crc cyclic redundancy check, an error-checking protocol dac digital-to-analog converter, see also idac, vdac dfb digital filter block dio digital input/output, gpio with only digital capabilities, no analog. see gpio. dma direct memory access, see also td dnl differential nonlinearity, see also inl dnu do not use dr port write data registers dsi digital system interconnect dwt data watchpoint and trace ecc error correcting code eco external crystal oscillator eeprom electrically erasable programmable read-only memory emi electromagnetic interference emif external memory interface eoc end of conversion eof end of frame epsr execution program status register esd electrostatic discharge etm embedded trace macrocell fir finite impulse resp onse, see also iir fpb flash patch and breakpoint fs full-speed gpio general-purpose input/output, applies to a psoc pin hvi high-voltage interrupt, see also lvi, lvd ic integrated circuit idac current dac, see also dac, vdac ide integrated development environment i 2 c, or iic inter-integrated circuit, a communications protocol iir infinite impulse response, see also fir ilo internal low-speed oscillator, see also imo imo internal main oscillator, see also ilo inl integral nonlinearity, see also dnl i/o input/output, see also gpio, dio, sio, usbio ipor initial power-on reset ipsr interrupt program status register irq interrupt request itm instrumentation trace macrocell lcd liquid crystal display lin local interconnect network, a communications protocol. lr link register lut lookup table lvd low-voltage detect, see also lvi lvi low-voltage interrupt, see also hvi lvttl low-voltage transistor-transistor logic mac multiply-accumulate mcu microcontroller unit miso master-in slave-out nc no connect nmi nonmaskable interrupt nrz non-return-to-zero nvic nested vectored interrupt controller nvl nonvolatile latch, see also wol opamp operational amplifier pal programmable array logic, see also pld pc program counter pcb printed circuit board pga programmable gain amplifier table 14-1. acronyms us ed in this document (continued) acronym description
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 114 of 120 15. reference documents psoc? 3, psoc? 5 architecture trm psoc? 3 registers trm phub peripheral hub phy physical layer picu port interrupt control unit pla programmable logic array pld programmable logic device, see also pal pll phase-locked loop pmdd package material declaration datasheet por power-on reset pres precise power-on reset prs pseudo random sequence ps port read data register psoc ? programmable system-on-chip? psrr power supply rejection ratio pwm pulse-width modulator ram random-access memory risc reduced-instruct ion-set computing rms root-mean-square rtc real-time clock rtl register transfer language rtr remote transmission request rx receive sar successive approximation register sc/ct switched capaci tor/continuous time scl i 2 c serial clock sda i 2 c serial data s/h sample and hold sinad signal to noise and distortion ratio sio special input/output, gpio with advanced features. see gpio. soc start of conversion table 14-1. acronyms us ed in this document (continued) acronym description sof start of frame spi serial peripheral interface, a communications protocol sr slew rate sram static random access memory sres software reset swd serial wire debug, a test protocol swv single-wire viewer td transaction descriptor, see also dma thd total harmonic distortion tia transimpedance amplifier trm technical reference manual ttl transistor-transistor logic tx transmit uart universal asynchronous transmitter receiver, a communications protocol udb universal digital block usb universal serial bus usbio usb input/output, psoc pins used to connect to a usb port vdac voltage dac, see also dac, idac wdt watchdog timer wol write once latch, see also nvl wres watchdog timer reset xres external reset i/o pin xtal crystal table 14-1. acronyms us ed in this document (continued) acronym description
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 115 of 120 16. document conventions 16.1 units of measure table 16-1. units of measure symbol unit of measure c degrees celsius db decibels ff femtofarads hz hertz kb 1024 bytes kbps kilobits per second khr kilohours khz kilohertz k kilohms ksps kilosamples per second lsb least significant bit mbps megabits per second mhz megahertz m megaohms msps megasamples per second a microamperes f microfarads h microhenrys s microseconds v microvolts w microwatts ma milliamperes ms milliseconds mv millivolts na nanoamperes ns nanoseconds nv nanovolts ohms pf picofarads ppm parts per million ps picoseconds s seconds sps samples per second sqrthz square root of hertz vvolts table 16-1. units of measure (continued) symbol unit of measure
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 116 of 120 17. revision history description title: psoc ? 3: cy8c32 family data sheet programmable system-on-chip (psoc ? ) document number: 001-56955 rev. ecn no. submission date orig. of change description of change ** 2796903 11/04/09 mkea new datasheet *a 2824546 12/09/09 mkea updated i2c section to reflect 1 mbps. updated table 11-6 and 11- 7 (boost ac and dc specs); also added shottky diode specs. changed current for sleep/hibernate mode to include sio; added footnote to analog global specs. updated figures 1-1, 6-2, 7-14, and 8-1. updated table 6-2 and table 6-3 (hibernate and sleep rows) and power modes section. updated gpio and sio ac specifications. updated gain error in idac and vdac specifications. updated description of v dda spec in table 11-1 and removed gpio clamp current parameter. updated number of udbs on page 1. moved filo from ilo dc to ac table. added pcb layout and pcb schematic diagrams. updated fgpioout spec (table 11-9). added duty cycle frequency in pll ac spec table. added note for sleep and hibernate modes and active mode specs in table 11-2. linked url in section 10.3 to psoc creator site. updated ja and jc values in table 13-1. updated single sample mode and fast fir mode sections. updated input resistanc e specification in del-sig adc table. added tio_init parameter. updated pga and ugb ac specs. removed spc adc. updated boost converter section. added section 'sio as comp arator'; updated hy steresis spec (differential mode) in table 11-10. updated v bat condition and deleted vstart parameter in table 11-6. added 'bytes' column for tables 4-1 to 4-5. *b 2873322 02/04/10 mkea changed maximum value of ppor_tr to '1'. updated v bias specification. updated pcb schematic. updated figure 8-1 and figure 6-3. updated interrupt vector table, updated sales links. updated jtag and swd specifications. removed jp-p and jperiod from eco ac spec table. added note on sleep timer in table 11-2. updated ilo ac and dc specifications. added resolution parameter in vdac and idac tables. updated i out typical and maximum values. changed temperature sensor range to ?40 c to +85 c. removed latchup specification from table 11-1. updated dac details
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 117 of 120 *c 2903576 04/01/10 mkea updated vb pin in pcb schematic. updated tstartup parameter in ac specifications table. added load regulation and line regulation parameters to inductive boost regulator dc specifications table. updated i cc parameter in lcd direct drive dc specs table. in page 1, updated internal oscillator range under prescision programmable clocking to start from 3 mhz. updated i out parameter in lcd direct drive dc specs table. updated table 6-2 and table 6-3. added bullets on capsense in page 1; added capsense column in section 12 rem oved some references to footnote [1]. changed inc_rn cycles from 3 to 2 (table 4-1). added footnote in pll ac specification table. added pll intermediate frequency row with footnote in pll ac specs table. added udbs subsection under 11.6 digital peripherals. updated figure 2-6 (pcb layout). updated pin descriptions section and modified figures 6-6, 6-8, 6-9. updated lvd in tables 6-2 and 6-3; modified low-power modes bullet in page 1. added note to figures 2-5 and 6-2; updated figure 6-2 to add capacitors for v dda and v ddd pins. updated boost converter section (6.2.2). updated tstartup values in table 11-3. removed ipor rows from table 11-53. updated 6.3.1.1, power voltage level monitors. updated section 5.2 and table 11-2 to co rrect suggestion of execution from flash. updated imo max frequency in figure 6-1, table 11-63, and table 11-64. updated v ref specs in table 11-19. updated idac uncompensated gain error in table 11-23. updated delay from interrupt signal inpu t to isr code execution from isr code in table-71. removed other line in table. added sentence to last paragraph of section 6.1.1.3. updated tresp, high and low-power modes, in table 11-22. updated f_tck values in table 11-58 and f_swdck values in table 11-59. updated snr condition in table 11-18. updated sleep wakeup time in table 6-3 and tsleep in table 11-3. added 1.71 v <= v ddd < 3.3 v, swd over usbio pins value to table 11-59. removed mention of hibernate reset (hr es) from page 1 features, table 6-3, section 6.2.1.4, se ction 6.3, and sect ion 6.3.1.1. change ppor/pres to tbds in section 6.3.1.1, section 6.4.1.6 (changed ppor to reset), table 11-3 (changed ppor to pres), table 11-53 (changed title, values tbd), and table 11-54 (changed ppor_tr to pres_tr). added sentence saying that lvd circuits can generate a reset to section 6.3.1.1. changed i dd values on page 1, page 5, and table 11-2. changed resume time value in section 6.2.1.3. changed esd hbm value in table 11-1. changed sample rate row in table 11-18. removed v dda = 1.65 v rows and changed bwag value in table 11-20. changed vioff values and changed cmrr value in table 11-21. changed inl max value in table 11-25. changed occurrences of ?block? to ?row? and deleted the ?ecc not included? footnote in table 11-41. changed max response time value in tables 11-54 and 11-56. change the startup time in table 11-64. added condition to intermediate frequency row in table 11-70. added row to table 11-54. added brown out note to section 11.8.1. description title: psoc ? 3: cy8c32 family data sheet programmable system-on-chip (psoc ? ) document number: 001-56955
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 118 of 120 *d 2938381 05/27/10 mkea replaced v ddio with v ddd in usbio diagram and specification tables, added text in usbio section of electrical specifications. added table 13-2 (package msl) modified tstorag condition and changed max spec to 100 added bullet (pass) under alu (section 7.2.2.2) added figures for khzeco and mhzeco in the external oscillator section updated figure 6-1(clock ing subsystem diagram) removed cpuclk_div in table 5-2, deleted clock divider sfr subsection updated psoc creator framework image updated sio dc specifications (v ih and v il parameters) updated bullets in clocking system and clocking distribution sections updated figure 8-2 updated table 11-10 updated pcb layout and schematic, u pdated as per mtrb review comments updated table 6-3 (power changed to current) in 32khz ec dc specifications table, changed i cc max to 0.25 in imo dc specifications table, updated supply current values updated gpio dc specs table modified to support a maximum 50mhz cpu speed *e 2958674 06/22/10 shea minor ecn to post datasheet to external website *f 2989685 08/04/10 mkea added usbio 22 ohm dp an d dm resistors to simplified block diagram added to table 6-6 a footnote and references to same. added sentences to the resistive pull-up and pull-down description bullets. added sentence to section 6.4.11, adjustable output level. updated section 5.5 external memory interface updated table 11-73 jtag interface ac specifications updated table 11-74 swd interface ac specifications *g 3078568 11/04/10 mkea updated ?current digital-to-ana log converter (idac)? on page 84 updated ?voltage digital to analog converter (vdac)? on page 89 updated table 11-2, ?dc specifications,? on page 65 *h 3107314 12/10/2010 mkea updated delta-sigma tables and graphs. updated flash ac specs formatted table 11.2. updated interrupt controller table updated transimpedance amplifier section updated sio dc specs table updated voltage monitors dc specifications table updated lcd direct drive dc specs table updated esd hbm value. updated idac and vdac sections removed eso parts from ordering information changed usbio pins from nc to dnu and removed redundant usbio pin description notes updated por with brown out dc and ac specs updated 32 khz external crystal dc specifications updated xres io specs updated inductive boost regulator section delta sigma adc spec updates updated comparator section removed buzz mode from power mode transition diagram *i 3179219 02/22/2011 mkea updated conditions for flash data retention time. updated 100-pin tqfp package spec. updated eeprom ac specifications. description title: psoc ? 3: cy8c32 family data sheet programmable system-on-chip (psoc ? ) document number: 001-56955
psoc ? 3: cy8c32 family data sheet document number: 001-56955 rev. *k page 119 of 120 *j 3200146 03/28/2011 mkea removed prelimi nary status from the data sheet. updated jtag id deleted cin_g1, adc input capacitance from delta-sigma adc dc spec table updated jtag interface ac specificati ons and swd interface specifications tables updated usbio dc specs added 0.01 to max speed updated features on page 1 added section 5.5, nonvolatile latches updated flash ac specs updated delta-sigma graphs, noise histog ram figures and rms noise spec tables add reference to application note an58304 in section 8.1 updated 100-pin tqfp package spec added oscillator, i/o, vdac, regulator graphs updated jtag/swd timing diagrams updated gpio and sio ac specs updated por with brown out ac spec table updatedidac graphs added dma timing diagram, interrupt ti ming and interrupt vector, i2c timing diagrams added full chip performance graphs changed mhzeco range. added ?solder reflow peak temperature? table. *k 3259185 05/17/2011 mkea added jtag and swd interface connection diagrams updated t ja and t jc values in table 13-1 changed typ and max values for the tcvos parameter in opamp dc specifications table. updated clocking subsystem diagram. changed vssd to vssb in the psoc power system diagram updated ordering information. description title: psoc ? 3: cy8c32 family data sheet programmable system-on-chip (psoc ? ) document number: 001-56955
document number: 001-56955 rev. *k revised may 20, 2011 page 120 of 120 capsense ? , psoc ? 3, psoc ? 5, and psoc ? creator? are trademarks and psoc ? is a registered trademark of cypress semiconductor corp. all other trademarks or registered trademarks referenced herein are property of the respective corporations. purchase of i2c components from cypress or one of its sublic ensed associated companies conveys a license under the philips i2c patent rights to use these components in an i2c system, provided that the system conforms to the i2c standard specification as defined by philips. arm is a registered trademark, and keil, and realview are trademarks, of arm limited. all products and company names mentioned in this document may be the trademarks of their respective holders. psoc ? 3: cy8c32 family data sheet ? cypress semiconductor corporation, 2009-2011. the information contained herein is subject to change without notice. cypress s emiconductor corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a cypress product. nor does it convey or imply any license under patent or other rights. cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement wi th cypress. furthermore, cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. the inclusion of cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies cypress against all charges. any source code (software and/or firmware) is owned by cypress semiconductor corporation (cypress) and is protected by and subj ect to worldwide patent protection (united states and foreign), united states copyright laws and international treaty provisions . cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of, and compile the cypress source code and derivative works for the sole purpose of creating custom software and or firmware in su pport of licensee product to be used only in conjunction with a cypress integrated circuit as specified in the applicable agreement. any reproduction, modification, translation, compilation, or repre sentation of this source code except as specified above is prohibited without the express written permission of cypress. disclaimer: cypress makes no warranty of any kind, express or implied, with regard to this material, including, but not limited to, the implied warranties of merchantability and fitness for a particular purpose. cypress reserves the right to make changes without further notice to t he materials described herein. cypress does not assume any liability arising out of the application or use of any product or circuit described herein. cypress does not authori ze its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. the inclusion of cypress? prod uct in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies cypress against all charges. use may be limited by and subject to the applicable cypress software license agreement. 18. sales, solutions , and legal information worldwide sales and design support cypress maintains a worldwide network of of fices, solution centers, ma nufacturers? representatives, and distributors. to find t he office closest to you, visit us at cypress locations . products automotive cypress.co m/go/automotive clocks & buffers cypress.com/go/clocks interface cypress. com/go/interface lighting & power control cypress.com/go/powerpsoc cypress.com/go/plc memory cypress.com/go/memory optical & image sensing cypress.com/go/image psoc cypress.com/go/psoc touch sensing cyp ress.com/go/touch usb controllers cypress.com/go/usb wireless/rf cypress.com/go/wireless psoc solutions psoc.cypress.com/solutions psoc 1 | psoc 3 | psoc 5

▲Up To Search▲

Price & Availability of CY8C3244LTI-130

	To Download CY8C3244LTI-130 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .